Patents by Inventor Ryan Michael Coutts

Ryan Michael Coutts has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SWITCHABLE DECOUPLING CAPACITORS
    Publication number: 20150303912
    Abstract: Aspects of an integrated circuit are disclosed. The integrated circuit includes a first circuit configured to be powered by a first voltage source, a second circuit configured to be powered by a second voltage source, a decoupling capacitor, and a controller configured to switch the decoupling capacitor between the first and second voltage source.
    Type: Application
    Filed: April 16, 2014
    Publication date: October 22, 2015
    Applicant: QUALCOMM Incorporated
    Inventors: Ryan Michael COUTTS, Mikhail POPOVICH
  • SWITCHABLE PACKAGE CAPACITOR FOR CHARGE CONSERVATION AND SERIES RESISTANCE
    Publication number: 20150293551
    Abstract: In one embodiment, an apparatus comprises a capacitor and a die. The die comprises a resistor switch coupled between a power line and the capacitor, wherein the resistor switch has an adjustable resistance, and the power line and the capacitor are both external to the die. The die also comprises a circuit configured to receive power from the power line.
    Type: Application
    Filed: April 10, 2014
    Publication date: October 15, 2015
    Applicant: QUALCOMM INCORPORATED
    Inventors: Ryan Michael Coutts, Mikhail Popovich
  • PLANE CONNECTED EMBEDDED SUBSTRATE CAPACITOR
    Publication number: 20150237714
    Abstract: A package substrate is provided that includes a substrate and a capacitor. The substrate comprises a cavity penetrating a core layer and metal layers of the substrate. The capacitor comprises electrode pads and is disposed in the cavity. One of the metal layers of the substrate includes a discontinuous metal plane, and the electrode pads directly contact the discontinuous metal plane.
    Type: Application
    Filed: February 20, 2014
    Publication date: August 20, 2015
    Applicant: QUALCOMM Incorporated
    Inventors: Ryan Michael Coutts, Yuancheng Christopher Pan
  • SIZING POWER-GATED SECTIONS BY CONSTRAINING VOLTAGE DROOP
    Publication number: 20150198933
    Abstract: A method for powering up a circuit comprising a plurality of sections of progressively increasing size is described. The method comprises receiving a signal for powering up the circuit, and, in response to the signal, sequentially powering up the plurality of sections in an order of increasing size.
    Type: Application
    Filed: January 16, 2014
    Publication date: July 16, 2015
    Applicant: QUALCOMM INCORPORATED
    Inventor: Ryan Michael Coutts
  • STATE-DEPENDENT CAPACITANCE ESTIMATION
    Publication number: 20150198657
    Abstract: Techniques for estimating state-dependent capacitance of a circuit are described herein. In one embodiment, a method for determining a circuit state for a circuit comprises determining a capacitance of the circuit for each one of a plurality of circuit states, and selecting one of the circuit states based on the determined capacitances.
    Type: Application
    Filed: January 16, 2014
    Publication date: July 16, 2015
    Applicant: QUALCOMM INCORPORATED
    Inventors: Ryan Michael Coutts, Mohamed Waleed Allam
  • VOLTAGE DEPENDENT DIE RC MODELING FOR SYSTEM LEVEL POWER DISTRIBUTION NETWORKS
    Publication number: 20150198646
    Abstract: Techniques for determining the voltage-dependent capacitance of a circuit are described herein. In one embodiment, a method for determining voltage-dependent capacitance of a circuit comprises measuring a parameter of the circuit at each one of a plurality of voltages, and, for each voltage, determining a capacitance of the circuit at the voltage by fitting a resistor-capacitor (RC) model of the circuit to the measured parameter of the circuit at the voltage.
    Type: Application
    Filed: January 16, 2014
    Publication date: July 16, 2015
    Applicant: QUALCOMM INCORPORATED
    Inventor: Ryan Michael Coutts