Patents by Inventor Ryan Mills
Ryan Mills has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240127308Abstract: A retail sales system and method for using same are provided. The system may include a mobile in-store terminal having a processor configured to execute a software application configured to receive product search information relating to a requested product, a database configured to store product detail information for a plurality of products, and a server configured to receive the product search information from the mobile in-store terminal, identify one or more products corresponding to the product search information, obtain and provide product detail information related to each of the one or more identified products to the mobile in-store terminal. The mobile in-store terminal may receive product search information that includes a product image of the requested product, a unique visual code corresponding to the requested product, a text code corresponding to the requested product, and a text description corresponding to the requested product.Type: ApplicationFiled: October 17, 2022Publication date: April 18, 2024Applicant: Hibbett Retail, Inc.Inventors: Michael E. Longo, Charles Mills, William Timothy Boggess, Benjamin A. Knighten, Michael Bonamy, Kevin Young, Ryan Besterwitch
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Publication number: 20230358909Abstract: A method includes receiving over a network from one or more seismic sensors a data set characterizing a seismic event generating a seismic wave. Based on the data set, a time of arrival and intensity of the seismic wave at a predetermined location is calculated. The predetermined location has one or more mitigation devices. Whether the intensity of the seismic wave exceeds a predetermined seismic intensity threshold is determined. If the intensity of the seismic wave exceeds the predetermined seismic intensity threshold, the one or more mitigation devices are activated.Type: ApplicationFiled: July 19, 2023Publication date: November 9, 2023Applicant: RH2 ENGINEERING, INC.Inventors: James Swanson, Lee Tumbleson, Ryan Mills, Isaac Oquist
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Patent number: 11712120Abstract: A leg pillow having an upper edge and lower edge and two convex curved side edges, wherein a recess is defined in the middle of the leg pillow. The leg pillow also includes leg support indentations at the upper edge. The leg support indentations are on both the top and bottom side of the leg pillow to provide support and proper body alignment for side sleeping individuals.Type: GrantFiled: December 22, 2021Date of Patent: August 1, 2023Assignee: Bob The Pillow Inc.Inventors: Matthew Burwick, Ryan Mills
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Publication number: 20230034805Abstract: A method includes receiving over a network from one or more seismic sensors a data set characterizing a seismic event generating a seismic wave. Based on the data set, a time of arrival and intensity of the seismic wave at a predetermined location is calculated. The predetermined location has one or more mitigation devices. Whether the intensity of the seismic wave exceeds a predetermined seismic intensity threshold is determined. If the intensity of the seismic wave exceeds the predetermined seismic intensity threshold, the one or more mitigation devices are activated.Type: ApplicationFiled: October 5, 2022Publication date: February 2, 2023Inventors: James Swanson, Lee Tumbleson, Ryan Mills, Isaac Oquist
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Patent number: 11493655Abstract: A method includes receiving over a network from one or more seismic sensors a data set characterizing a seismic event generating a seismic wave. Based on the data set, a time of arrival and intensity of the seismic wave at a predetermined location is calculated. The predetermined location has one or more mitigation devices. Whether the intensity of the seismic wave exceeds a predetermined seismic intensity threshold is determined. If the intensity of the seismic wave exceeds the predetermined seismic intensity threshold, the one or more mitigation devices are activated.Type: GrantFiled: October 14, 2019Date of Patent: November 8, 2022Assignee: RH2 Engineering, Inc.Inventors: James Swanson, Lee Tumbleson, Ryan Mills, Isaac Oquist
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Publication number: 20220240685Abstract: A leg pillow having an upper edge and lower edge and two convex curved side edges, wherein a recess is defined in the middle of the leg pillow. The leg pillow also includes leg support indentations at the upper edge. The leg support indentations are on both the top and bottom side of the leg pillow to provide support and proper body alignment for side sleeping individuals.Type: ApplicationFiled: December 22, 2021Publication date: August 4, 2022Applicant: Bob The Pillow Inc.Inventors: Matthew Burwick, Ryan Mills
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Publication number: 20200309977Abstract: A method includes receiving over a network from one or more seismic sensors a data set characterizing a seismic event generating a seismic wave. Based on the data set, a time of arrival and intensity of the seismic wave at a predetermined location is calculated. The predetermined location has one or more mitigation devices. Whether the intensity of the seismic wave exceeds a predetermined seismic intensity threshold is determined. If the intensity of the seismic wave exceeds the predetermined seismic intensity threshold, the one or more mitigation devices are activated.Type: ApplicationFiled: October 14, 2019Publication date: October 1, 2020Inventors: James Swanson, Lee Tumbleson, Ryan Mills, Isaac Oquist
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Methods for warning of electromagnetic fields produced by wireless electric vehicle charging systems
Patent number: 10403113Abstract: Techniques for detecting the presence of a magnetic field associated with a wireless electric vehicle charging (WEVC) system are disclosed. An example of an apparatus for alerting a user of the presence of a magnetic field according to the disclosure includes a mobile device and at least one magnetic flux sensor integrated as part of the mobile device or operably coupled to the mobile device, the at least one magnetic flux sensor configured to detect the presence of the magnetic field associated with a wireless electric vehicle charging system, the mobile device configured to generate an alert based on the presence of the magnetic field detected by the at least one magnetic flux sensor.Type: GrantFiled: April 6, 2018Date of Patent: September 3, 2019Assignee: Witricity CorpoationInventors: Michael Antar, Ryan Mills, Fang Han, Mei-Li Chi, William Von Novak, III -
Patent number: 10137966Abstract: Embodiments described herein provide recirculation-based alternating blowdown sea chest. The sea chest has a cover assembly with a plurality of grates thereon. Each grate is connected with a pipe in fluid communication with a pump. The pump provides suction while a plurality of valves modulate the flow of water through the system. A recirculation pipe promotes the blowdown of fluids within the system and permits tandem function of water intake and expulsion resulting in maximum efficiency of the sea chest with continuous functionality while in use.Type: GrantFiled: February 9, 2018Date of Patent: November 27, 2018Inventors: Eric Mills, Ryan Mills
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Publication number: 20140255901Abstract: An apparatus, system, and method for displaying content. A portion of content may be displayed to a user. Personal and community data relating to the portion of content may be displayed alongside the portion of content. The personal and community data may include performance-related data. Furthermore, portions of content may be selectively displayed based on customizable performance thresholds.Type: ApplicationFiled: March 11, 2014Publication date: September 11, 2014Applicant: Fast Forward Academy, LLCInventors: Rain HUGHES, Matthew McBride, Ryan Mills, James Brashear
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Publication number: 20080019097Abstract: A thermally manageable system is provided. The system may include a heat-generating unit, a heat-dissipating unit, and a thermal transport structure located between the heat-dissipating unit and the heat-generating unit. The thermal transport structure has a first surface in thermal communication with the heat-generating unit and a second surface in thermal communication with the heat-dissipating unit. The thermal transport structure includes a thermally conductive material having a length-to-width ratio greater than 1, and the length is oriented to directionally facilitate heat conduction in a direction about perpendicular at least one of the thermal transport structure first surface or second surface. The thermal transport layer comprises a plurality of individual thermally conductive strips or channels that define a discontinuous array within a relatively non-thermally conductive matrix.Type: ApplicationFiled: July 24, 2007Publication date: January 24, 2008Applicant: GENERAL ELECTRIC COMPANYInventors: Jian Zhang, Sandeep Tonapi, Arun Gowda, Ryan Mills
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Publication number: 20070240310Abstract: A method for making a thermal interface structure is provided. The method may include disposing a thermal transport layer on a resin layer to form a stacked structure, and slicing the stacked structure to form a cross-sectional slice having a first exposed portion of the thermal transport layer on a first surface of the slice, and a second exposed portion of the thermal transport layer on the second surface of the slice.Type: ApplicationFiled: October 11, 2005Publication date: October 18, 2007Applicant: General Electric CompanyInventors: Jian Zhang, Sandeep Tonapi, Ryan Mills, Arun Gowda
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Publication number: 20070231560Abstract: A thermal transport structure having a thermal transport layer and a resin layer is provided. The thermal transport layer may include a first surface and a second surface, and having a thermally conductive material disposed in the thermal transport layer, where the thermally conductive material is oriented in a predetermined direction in order to facilitate heat conduction relative to the predetermined direction. Further, the resin layer is secured to the thermal transport layer second surface, where the resin layer is relatively less thermally conductive than the thermal transport layer.Type: ApplicationFiled: October 11, 2005Publication date: October 4, 2007Applicant: General Electric CompanyInventors: Jian Zhang, Sandeep Tonapi, Ryan Mills, Arun Gowda
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Publication number: 20060293172Abstract: A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen-containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.Type: ApplicationFiled: June 23, 2005Publication date: December 28, 2006Inventors: Slawomir Rubinsztajn, John Campbell, Ryan Mills, Sandeep Tonapi, Ananth Prabhakumar
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Publication number: 20060275952Abstract: Disclosed are methods for forming an electronic device that comprises a material that functions as an underfill material as well as a thermal interface material simultaneously. The electronic assembly comprising a heat dissipating element, a semiconductor chip, a substrate and a thermally conductive material is also given here, wherein the thermally conductive material serves as an underfill material as well as a thermal interface material simultaneously.Type: ApplicationFiled: June 7, 2005Publication date: December 7, 2006Inventors: Arun Gowda, Sandeep Tonapi, Ryan Mills, David Esler, Stephen Latham, John Campbell
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Publication number: 20060275608Abstract: A B-stageable film that includes a thermal interface material is provided. The film may secure a heat-generating device to a heat-dissipating component, may further cross-link, and may conduct thermal energy from the heat-generating device to the heat-dissipating component. A method of making and using the film is provided, as well as a device that incorporates the film.Type: ApplicationFiled: June 7, 2005Publication date: December 7, 2006Inventors: Sandeep Tonapi, John Campbell, Ryan Mills, Jian Zhang, Stephen Latham
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Publication number: 20060192280Abstract: A method of forming polymer reinforced solder-bumped containing device or substrate is described. The method comprises the following steps: providing a device or substrate having at least one solder bump formed thereon; coating a predetermined portion of the device or substrate with a curable polymer reinforcement material forming a layer on the device or substrate, partially curing the curable polymer reinforcement material to provide a solder-bumped structure comprising a partially cured polymer reinforcement material, and, making a connection between the solder-bumped structure formed and a printed circuit board or array of attachment pads and fully curing the partially cured polymer reinforcement material to provide a reinforced interconnection. Full curing of the polymer reinforcement material may take place either during the “reflow step” or subsequent to it (post-curing).Type: ApplicationFiled: February 28, 2005Publication date: August 31, 2006Inventors: David Esler, Donald Buckley, Sandeep Tonapi, John Campbell, Ryan Mills, Ananth Prabhakumar, Arun Gowda
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Publication number: 20060147719Abstract: A curable composition is provided, and a method associated therewith. The curable composition may include a curable resin and a finely divided refractory solid. The solid may have a surface area that is greater than about 5 square meters per gram, and a determined density of active surface termination sites per square nanometer of surface area.Type: ApplicationFiled: March 3, 2006Publication date: July 6, 2006Inventors: Slawomir Rubinsztajn, John Campbell, Ryan Mills, Ananth Prabhakumar, Sandeep Tanopi, David Gibson, Florian Schattenmann
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Patent number: 7022410Abstract: A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.Type: GrantFiled: December 16, 2003Date of Patent: April 4, 2006Assignee: General Electric CompanyInventors: Sandeep Shrikant Tonapi, John Campbell, Ryan Mills, Ananth Prabhakumar, Slawomir Rubinsztajn
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Publication number: 20050170188Abstract: A composition comprises a first curable resin composition that includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds, combinations thereof, and mixtures thereof. The composition can include a separate second curable fluxing composition that comprises at least one epoxy resin. The first curable resin or the combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.Type: ApplicationFiled: April 1, 2005Publication date: August 4, 2005Inventors: John Campbell, Slawomir Rubinsztajn, David Gibson, Sandeep Tonapi, Ryan Mills, Ananth Prabhakumar