Patents by Inventor Ryan Mills

Ryan Mills has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240127308
    Abstract: A retail sales system and method for using same are provided. The system may include a mobile in-store terminal having a processor configured to execute a software application configured to receive product search information relating to a requested product, a database configured to store product detail information for a plurality of products, and a server configured to receive the product search information from the mobile in-store terminal, identify one or more products corresponding to the product search information, obtain and provide product detail information related to each of the one or more identified products to the mobile in-store terminal. The mobile in-store terminal may receive product search information that includes a product image of the requested product, a unique visual code corresponding to the requested product, a text code corresponding to the requested product, and a text description corresponding to the requested product.
    Type: Application
    Filed: October 17, 2022
    Publication date: April 18, 2024
    Applicant: Hibbett Retail, Inc.
    Inventors: Michael E. Longo, Charles Mills, William Timothy Boggess, Benjamin A. Knighten, Michael Bonamy, Kevin Young, Ryan Besterwitch
  • Publication number: 20230358909
    Abstract: A method includes receiving over a network from one or more seismic sensors a data set characterizing a seismic event generating a seismic wave. Based on the data set, a time of arrival and intensity of the seismic wave at a predetermined location is calculated. The predetermined location has one or more mitigation devices. Whether the intensity of the seismic wave exceeds a predetermined seismic intensity threshold is determined. If the intensity of the seismic wave exceeds the predetermined seismic intensity threshold, the one or more mitigation devices are activated.
    Type: Application
    Filed: July 19, 2023
    Publication date: November 9, 2023
    Applicant: RH2 ENGINEERING, INC.
    Inventors: James Swanson, Lee Tumbleson, Ryan Mills, Isaac Oquist
  • Patent number: 11712120
    Abstract: A leg pillow having an upper edge and lower edge and two convex curved side edges, wherein a recess is defined in the middle of the leg pillow. The leg pillow also includes leg support indentations at the upper edge. The leg support indentations are on both the top and bottom side of the leg pillow to provide support and proper body alignment for side sleeping individuals.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: August 1, 2023
    Assignee: Bob The Pillow Inc.
    Inventors: Matthew Burwick, Ryan Mills
  • Publication number: 20230034805
    Abstract: A method includes receiving over a network from one or more seismic sensors a data set characterizing a seismic event generating a seismic wave. Based on the data set, a time of arrival and intensity of the seismic wave at a predetermined location is calculated. The predetermined location has one or more mitigation devices. Whether the intensity of the seismic wave exceeds a predetermined seismic intensity threshold is determined. If the intensity of the seismic wave exceeds the predetermined seismic intensity threshold, the one or more mitigation devices are activated.
    Type: Application
    Filed: October 5, 2022
    Publication date: February 2, 2023
    Inventors: James Swanson, Lee Tumbleson, Ryan Mills, Isaac Oquist
  • Patent number: 11493655
    Abstract: A method includes receiving over a network from one or more seismic sensors a data set characterizing a seismic event generating a seismic wave. Based on the data set, a time of arrival and intensity of the seismic wave at a predetermined location is calculated. The predetermined location has one or more mitigation devices. Whether the intensity of the seismic wave exceeds a predetermined seismic intensity threshold is determined. If the intensity of the seismic wave exceeds the predetermined seismic intensity threshold, the one or more mitigation devices are activated.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: November 8, 2022
    Assignee: RH2 Engineering, Inc.
    Inventors: James Swanson, Lee Tumbleson, Ryan Mills, Isaac Oquist
  • Publication number: 20220240685
    Abstract: A leg pillow having an upper edge and lower edge and two convex curved side edges, wherein a recess is defined in the middle of the leg pillow. The leg pillow also includes leg support indentations at the upper edge. The leg support indentations are on both the top and bottom side of the leg pillow to provide support and proper body alignment for side sleeping individuals.
    Type: Application
    Filed: December 22, 2021
    Publication date: August 4, 2022
    Applicant: Bob The Pillow Inc.
    Inventors: Matthew Burwick, Ryan Mills
  • Publication number: 20200309977
    Abstract: A method includes receiving over a network from one or more seismic sensors a data set characterizing a seismic event generating a seismic wave. Based on the data set, a time of arrival and intensity of the seismic wave at a predetermined location is calculated. The predetermined location has one or more mitigation devices. Whether the intensity of the seismic wave exceeds a predetermined seismic intensity threshold is determined. If the intensity of the seismic wave exceeds the predetermined seismic intensity threshold, the one or more mitigation devices are activated.
    Type: Application
    Filed: October 14, 2019
    Publication date: October 1, 2020
    Inventors: James Swanson, Lee Tumbleson, Ryan Mills, Isaac Oquist
  • Patent number: 10403113
    Abstract: Techniques for detecting the presence of a magnetic field associated with a wireless electric vehicle charging (WEVC) system are disclosed. An example of an apparatus for alerting a user of the presence of a magnetic field according to the disclosure includes a mobile device and at least one magnetic flux sensor integrated as part of the mobile device or operably coupled to the mobile device, the at least one magnetic flux sensor configured to detect the presence of the magnetic field associated with a wireless electric vehicle charging system, the mobile device configured to generate an alert based on the presence of the magnetic field detected by the at least one magnetic flux sensor.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: September 3, 2019
    Assignee: Witricity Corpoation
    Inventors: Michael Antar, Ryan Mills, Fang Han, Mei-Li Chi, William Von Novak, III
  • Patent number: 10137966
    Abstract: Embodiments described herein provide recirculation-based alternating blowdown sea chest. The sea chest has a cover assembly with a plurality of grates thereon. Each grate is connected with a pipe in fluid communication with a pump. The pump provides suction while a plurality of valves modulate the flow of water through the system. A recirculation pipe promotes the blowdown of fluids within the system and permits tandem function of water intake and expulsion resulting in maximum efficiency of the sea chest with continuous functionality while in use.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: November 27, 2018
    Inventors: Eric Mills, Ryan Mills
  • Publication number: 20140255901
    Abstract: An apparatus, system, and method for displaying content. A portion of content may be displayed to a user. Personal and community data relating to the portion of content may be displayed alongside the portion of content. The personal and community data may include performance-related data. Furthermore, portions of content may be selectively displayed based on customizable performance thresholds.
    Type: Application
    Filed: March 11, 2014
    Publication date: September 11, 2014
    Applicant: Fast Forward Academy, LLC
    Inventors: Rain HUGHES, Matthew McBride, Ryan Mills, James Brashear
  • Publication number: 20080019097
    Abstract: A thermally manageable system is provided. The system may include a heat-generating unit, a heat-dissipating unit, and a thermal transport structure located between the heat-dissipating unit and the heat-generating unit. The thermal transport structure has a first surface in thermal communication with the heat-generating unit and a second surface in thermal communication with the heat-dissipating unit. The thermal transport structure includes a thermally conductive material having a length-to-width ratio greater than 1, and the length is oriented to directionally facilitate heat conduction in a direction about perpendicular at least one of the thermal transport structure first surface or second surface. The thermal transport layer comprises a plurality of individual thermally conductive strips or channels that define a discontinuous array within a relatively non-thermally conductive matrix.
    Type: Application
    Filed: July 24, 2007
    Publication date: January 24, 2008
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Jian Zhang, Sandeep Tonapi, Arun Gowda, Ryan Mills
  • Publication number: 20070240310
    Abstract: A method for making a thermal interface structure is provided. The method may include disposing a thermal transport layer on a resin layer to form a stacked structure, and slicing the stacked structure to form a cross-sectional slice having a first exposed portion of the thermal transport layer on a first surface of the slice, and a second exposed portion of the thermal transport layer on the second surface of the slice.
    Type: Application
    Filed: October 11, 2005
    Publication date: October 18, 2007
    Applicant: General Electric Company
    Inventors: Jian Zhang, Sandeep Tonapi, Ryan Mills, Arun Gowda
  • Publication number: 20070231560
    Abstract: A thermal transport structure having a thermal transport layer and a resin layer is provided. The thermal transport layer may include a first surface and a second surface, and having a thermally conductive material disposed in the thermal transport layer, where the thermally conductive material is oriented in a predetermined direction in order to facilitate heat conduction relative to the predetermined direction. Further, the resin layer is secured to the thermal transport layer second surface, where the resin layer is relatively less thermally conductive than the thermal transport layer.
    Type: Application
    Filed: October 11, 2005
    Publication date: October 4, 2007
    Applicant: General Electric Company
    Inventors: Jian Zhang, Sandeep Tonapi, Ryan Mills, Arun Gowda
  • Publication number: 20060293172
    Abstract: A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen-containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.
    Type: Application
    Filed: June 23, 2005
    Publication date: December 28, 2006
    Inventors: Slawomir Rubinsztajn, John Campbell, Ryan Mills, Sandeep Tonapi, Ananth Prabhakumar
  • Publication number: 20060275952
    Abstract: Disclosed are methods for forming an electronic device that comprises a material that functions as an underfill material as well as a thermal interface material simultaneously. The electronic assembly comprising a heat dissipating element, a semiconductor chip, a substrate and a thermally conductive material is also given here, wherein the thermally conductive material serves as an underfill material as well as a thermal interface material simultaneously.
    Type: Application
    Filed: June 7, 2005
    Publication date: December 7, 2006
    Inventors: Arun Gowda, Sandeep Tonapi, Ryan Mills, David Esler, Stephen Latham, John Campbell
  • Publication number: 20060275608
    Abstract: A B-stageable film that includes a thermal interface material is provided. The film may secure a heat-generating device to a heat-dissipating component, may further cross-link, and may conduct thermal energy from the heat-generating device to the heat-dissipating component. A method of making and using the film is provided, as well as a device that incorporates the film.
    Type: Application
    Filed: June 7, 2005
    Publication date: December 7, 2006
    Inventors: Sandeep Tonapi, John Campbell, Ryan Mills, Jian Zhang, Stephen Latham
  • Publication number: 20060192280
    Abstract: A method of forming polymer reinforced solder-bumped containing device or substrate is described. The method comprises the following steps: providing a device or substrate having at least one solder bump formed thereon; coating a predetermined portion of the device or substrate with a curable polymer reinforcement material forming a layer on the device or substrate, partially curing the curable polymer reinforcement material to provide a solder-bumped structure comprising a partially cured polymer reinforcement material, and, making a connection between the solder-bumped structure formed and a printed circuit board or array of attachment pads and fully curing the partially cured polymer reinforcement material to provide a reinforced interconnection. Full curing of the polymer reinforcement material may take place either during the “reflow step” or subsequent to it (post-curing).
    Type: Application
    Filed: February 28, 2005
    Publication date: August 31, 2006
    Inventors: David Esler, Donald Buckley, Sandeep Tonapi, John Campbell, Ryan Mills, Ananth Prabhakumar, Arun Gowda
  • Publication number: 20060147719
    Abstract: A curable composition is provided, and a method associated therewith. The curable composition may include a curable resin and a finely divided refractory solid. The solid may have a surface area that is greater than about 5 square meters per gram, and a determined density of active surface termination sites per square nanometer of surface area.
    Type: Application
    Filed: March 3, 2006
    Publication date: July 6, 2006
    Inventors: Slawomir Rubinsztajn, John Campbell, Ryan Mills, Ananth Prabhakumar, Sandeep Tanopi, David Gibson, Florian Schattenmann
  • Patent number: 7022410
    Abstract: A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.
    Type: Grant
    Filed: December 16, 2003
    Date of Patent: April 4, 2006
    Assignee: General Electric Company
    Inventors: Sandeep Shrikant Tonapi, John Campbell, Ryan Mills, Ananth Prabhakumar, Slawomir Rubinsztajn
  • Publication number: 20050170188
    Abstract: A composition comprises a first curable resin composition that includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds, combinations thereof, and mixtures thereof. The composition can include a separate second curable fluxing composition that comprises at least one epoxy resin. The first curable resin or the combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.
    Type: Application
    Filed: April 1, 2005
    Publication date: August 4, 2005
    Inventors: John Campbell, Slawomir Rubinsztajn, David Gibson, Sandeep Tonapi, Ryan Mills, Ananth Prabhakumar