Abstract: A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.

Abstract: A method for preparing hydroxyaromatic compounds brominated in the para-position, such as p-bromophenol, is disclosed. The method yields overall high process selectivity through isomeric equilibration and separation of the brominated products, thereby eliminating the need for high para selectivity in the products of catalytic oxybromination reactions of hydroxyaromatic compounds using oxygen, a bromine source, and an acidic medium in the presence of a metal catalyst. Furthermore, the invention provides an efficient method for recycling the metal catalyst, as well as reagents used in the bromination, to further reactions.

Abstract: A method for brominating hydroxyaromatic compounds to form products, such as p-bromophenol, is disclosed. The method uses elemental bromine as the brominating agent and comprises contacting a hydroxyaromatic compound with bromine and oxygen in the presence of metal catalyst. Suitable catalysts include elemental copper, copper compounds, and compounds of Group IV-VIII transition metals.

Abstract: A solvent-modified resin composition for use as underfill material is provided. The composition having at least one epoxy resin, at least one solvent and a filler of functionalized colloidal silica. The solvent-modified resin composition is useful in making transparent B-stage resin films. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.