Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

Abstract: A mechanical tonfa with a spring-loaded swiveling and locking mechanism. The tonfa includes a main bar with a perpendicular handle. The handle includes a button that engages a spring-loaded locking bar within the handle. The portion of the main bar that connects to the handle includes a circular groove that fits over a circular protrusion on the handle. The main bar also includes an aforementioned plurality of notches, enabling the main bar to lock in multiple positions. When the button is pressed, the locking bar is moved such that it is removed from one of the notches, enabling the main bar to swivel relative to the handle. When the button is released, the force of the spring causes the locking bar to return to its original position, causing the main tonfa bar to lock in one of multiple positions depending on the positions of the plurality of notches.

Abstract: Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

Abstract: A pressure sensing balloon retractor for use in brain surgery to avoid mechanical injury to brain tissues. The balloon retractor includes an inflatable balloon that can be inserted in-between brain tissues to increase accessibility during surgery. A pressure transducer connected to a microcontroller senses the pressure of the retractor, and this retractor pressure is compared to the patient’s mean arterial pressure derived from a blood pressure monitor in order to determine whether the pressure exceeds the threshold for brain injury. A load cell can be used to calibrate the microcontroller to remove the effect of elastic pressure on the pressure transducer’s measurements.

Abstract: A mechanical tonfa with a spring-loaded swiveling and locking mechanism. The tonfa includes a main bar with a perpendicular handle. The handle includes a button that engages a spring-loaded locking bar within the handle. The portion of the main bar that connects to the handle includes a circular groove that fits over a circular protrusion on the handle. The main bar also includes an aforementioned plurality of notches, enabling the main bar to lock in multiple positions. When the button is pressed, the locking bar is moved such that it is removed from one of the notches, enabling the main bar to swivel relative to the handle. When the button is released, the force of the spring causes the locking bar to return to its original position, causing the main tonfa bar to lock in one of multiple positions depending on the positions of the plurality of notches.

Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

Abstract: Methods, apparatus and computer program product for improving data indexing in a group-based communication platform are described herein. The group-based communication platform having a computed collection and one or more live collections. The computer-implemented method includes generating a new collection, the new collection being generated at a snapshot time point; associating a collection manager with the new collection; retrieving a plurality of electronic messages from the computed collection and the one or more live collections; writing the plurality of electronic messages to the new collection, the writing being completed at a cut-over time point; synchronizing the new collection with the one or more live collections based on the plurality of electronic messages; and redirecting the read alias and the write alias from the computed collection to the new collection.

Abstract: Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

Abstract: Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

Abstract: A wireless wiring apparatus includes a ceiling-embedded casing and a power-receiving casing. The ceiling-embedded casing includes screws connected to a surface of the ceiling-embedded casing and configured to be connected to a ceiling, a bracket inside the ceiling-embedded casing and connected to the screws, a coil, and a power wire connected to an external alternating current electrical power source. The power-receiving casing includes neodymium magnets on another surface of the power-receiving case, L-shaped notches formed adjacent to the neodymium magnets, and a coil of wire formed inside the power-receiving casing.

Abstract: A wireless wiring apparatus includes a ceiling-embedded casing and a power-receiving casing. The ceiling-embedded casing includes screws connected to a surface of the ceiling-embedded casing and configured to be connected to a ceiling, a bracket inside the ceiling-embedded casing and connected to the screws, a coil, and a power wire connected to an external alternating current electrical power source. The power-receiving casing includes neodymium magnets on another surface of the power-receiving case, L-shaped notches formed adjacent to the neodymium magnets, and a coil of wire formed inside the power-receiving casing.

Abstract: A wireless wiring apparatus includes a ceiling-embedded casing and a power-receiving casing. The ceiling-embedded casing includes screws connected to a surface of the ceiling-embedded casing and configured to be connected to a ceiling, a bracket inside the ceiling-embedded casing and connected to the screws, a coil, and a power wire connected to an external alternating current electrical power source. The power-receiving casing includes neodymium magnets on another surface of the power-receiving case, L-shaped notches formed adjacent to the neodymium magnets, and a coil of wire formed inside the power-receiving casing.

Abstract: A wireless wiring apparatus includes a ceiling-embedded casing and a power-receiving casing. The ceiling-embedded casing includes screws connected to a surface of the ceiling-embedded casing and configured to be connected to a ceiling, a bracket inside the ceiling-embedded casing and connected to the screws, a coil, and a power wire connected to an external alternating current electrical power source. The power-receiving casing includes neodymium magnets on another surface of the power-receiving case, L-shaped notches formed adjacent to the neodymium magnets, and a coil of wire formed inside the power-receiving casing.

Abstract: Methods, apparatus and computer program product for improving data indexing in a group-based communication platform are described herein. The group-based communication platform having a computed collection and one or more live collections. The computer-implemented method includes generating a new collection, the new collection being generated at a snapshot time point; associating a collection manager with the new collection; retrieving a plurality of electronic messages from the computed collection and the one or more live collections; writing the plurality of electronic messages to the new collection, the writing being completed at a cut-over time point; synchronizing the new collection with the one or more live collections based on the plurality of electronic messages; and redirecting the read alias and the write alias from the computed collection to the new collection.

Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

Abstract: Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

Abstract: Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongate carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.