Abstract: Methods, apparatus and computer program product for improving data indexing in a group-based communication platform are described herein. The group-based communication platform having a computed collection and one or more live collections. The computer-implemented method includes generating a new collection, the new collection being generated at a snapshot time point; associating a collection manager with the new collection; retrieving a plurality of electronic messages from the computed collection and the one or more live collections; writing the plurality of electronic messages to the new collection, the writing being completed at a cut-over time point; synchronizing the new collection with the one or more live collections based on the plurality of electronic messages; and redirecting the read alias and the write alias from the computed collection to the new collection.

Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

Abstract: Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongate carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

Abstract: Introduced here are carrier trays that include an adhesive film affixed to a deck area. For example, the adhesive film may be integrally laminated onto the top surface of the carrier tray as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the carrier tray. Semiconductor component(s) can be secured to the carrier tray based on the adhesiveness of the adhesive film. Said another way, proper securement of the semiconductor component(s) to the carrier tray may depend on the tackiness of the constituent material(s) of the adhesive film.

Abstract: Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

Abstract: In one embodiment a control unit of a communication system exchanging a multiple-phase time-interleaved data includes a first Phase-Locked Loop (PLL) to generate a set of un-calibrated multiple-phase signals of a first-clock; a second-PLL, a pulse generator, a pulse-width measurement unit and a phase calibration engine to evaluate adjustments required in a temporal location of a logically critical voltage transition edge in each signal in the un-calibrated set; and a phase adjustment unit to adjust the temporal location of the logically critical voltage transition edge in each signal in the un-calibrated set to generate a set of calibrated multiple-phase signals of the first-clock such that each signal in the calibrated set includes the logically critical voltage transition edge which is time skewed in a predetermined amount from the logically critical voltage transition edge in other signals in the same set within a predetermined accuracy.

Abstract: A method, apparatus and/or system of a duty cycle counting phase calibration scheme of an I/O interface is disclosed.

Abstract: A ribbon cartridge includes a cartridge housing, a supply spool, a take-up spool, a supply of ribbon, and a supply circuit. The cartridge housing includes a supply spool enclosure and a take-up spool enclosure. The supply spool is contained in the supply spool enclosure and the take-up spool is contained in the take-up spool enclosure. The supply of ribbon extends from the supply spool to the take-up spool. The supply circuit includes a memory containing supply information relating to the ribbon cartridge.

Abstract: A printer includes a substrate input, a substrate transport, a printhead, a removable ribbon cartridge, a ribbon cartridge receiver, and a substrate output. The substrate transport is configured to feed a substrate from the substrate input along a print path. The printhead is positioned below the print path and is configured to print an image on a surface of the substrate. The ribbon cartridge is received in the ribbon cartridge receiver and contains a supply of print ribbon that extends between supply and take-up spools and over the printhead. The substrate can then be discharged through the substrate output.

Abstract: A ribbon sensor includes a first and second emitter and a receiver. The first emitter is configured to transmit a yellow light signal and the second emitter is configured to transmit a blue light signal. The receiver is configured to produce an output signal in response to the transmission of the yellow and blue light signals through a panel of a print ribbon, wherein the output signal is indicative of a color of the panel. Additional aspects of the present invention are directed to a printer that includes the above-described sensor and a method of using the sensor to identify colored ribbon panels.

Abstract: An identification card printer includes a card input, a card transport, a printhead, and a card output. The card transport is configured to feed a card from the card input along a print path. The printhead is positioned below the print path and is configured to print an image on a surface of the card. The card can then be discharged through the card output.

Abstract: A compact package for a garment made from a delicate material includes a container body having a volume of less than 10 in3 (164 cm3), a delicate material garment, a cover member and a cap. The cover member is inserted into the container body atop the garment, followed by the cap. Preferably, a buffer material is arranged between the garment and the cover member within the container body to protect the garment from damage during the packing process. The package is preferably produced by directing the garment and buffer material into a pre-loading tube, followed by shifting of a plunger member to load the container body with the garment, buffer material and the cover member. Subsequently, the cap is snap-fit upon the container body.