Abstract: An interconnect substrate includes an insulating layer and an interconnect layer formed on a surface of the insulating layer, wherein the surface of the insulating layer has grooves formed therein, the grooves having a meander shape on an order of nanometers in a plan view, and wherein the interconnect layer has anchor portions fitted into the grooves.

Abstract: An interconnect substrate includes an insulating layer and an interconnect layer formed on a surface of the insulating layer, wherein the surface of the insulating layer has grooves formed therein, the grooves having a meander shape on an order of nanometers in a plan view, and wherein the interconnect layer has anchor portions fitted into the grooves.

Abstract: An example information processing system includes a main device, and an operation device attachable to the main device. The operation device includes a first control circuit, a first battery, and a first power supply circuit. The main device includes a second control circuit, a second battery, and a second power supply circuit. The second power supply circuit supplies power from the second battery to the operation device in response to satisfaction of a condition about the amount of remaining charge indicated by the remaining charge amount information transmitted from the operation device. When power is supplied from the main device to the operation device, the first power supply circuit supplies power supplied from the main device to the first control circuit, instead of power from the first battery.

Abstract: An example information processing system includes a main device, and an operation device attachable to the main device. The operation device includes a first control circuit, a first battery, and a first power supply circuit. The main device includes a second control circuit, a second battery, and a second power supply circuit. The second power supply circuit supplies power from the second battery to the operation device in response to satisfaction of a condition about the amount of remaining charge indicated by the remaining charge amount information transmitted from the operation device. When power is supplied from the main device to the operation device, the first power supply circuit supplies power supplied from the main device to the first control circuit, instead of power from the first battery.

Abstract: An example information processing system includes a main device, and an operation device attachable to the main device. The operation device includes a first control circuit, a first battery, and a first power supply circuit. The main device includes a second control circuit, a second battery, and a second power supply circuit. The second power supply circuit supplies power from the second battery to the operation device in response to satisfaction of a condition about the amount of remaining charge indicated by the remaining charge amount information transmitted from the operation device. When power is supplied from the main device to the operation device, the first power supply circuit supplies power supplied from the main device to the first control circuit, instead of power from the first battery.

Abstract: Provided is a vehicle-mounted-camera bracket (10) for attaching a vehicle-mounted camera (20) to a vehicle body (30), wherein the durability of a hook (103) is enhanced and the vehicle-mounted-camera bracket (10) is capable of inserting into an attachment hole (31) of the vehicle body (30) along a narrow insertion trajectory. The present invention has: a bracket main body (100) capable of fastening a vehicle-mounted camera (20); and three or more planar hooks (103) for fixing the vehicle-mounted camera (20) to the vehicle body (30), the hooks (103) being formed in the bracket main body (100); the three or more planar hooks (103) being arranged so as to be suspended on at least two facing inside edges of a substantially rectangular attachment hole (31) provided in the vehicle body (30) when the hooks (103) are attached to the vehicle body (30).

Abstract: A wiring substrate includes a metal plate in which at least one wiring formation region is defined, a cavity formed in the wiring formation region, a concave part formed to have a frame shape at a peripheral edge portion of a bottom portion of the cavity, a first pad disposed at a central portion of the bottom portion of the cavity, a wiring portion connected to the first pad and disposed on and extended along the central portion of the bottom portion of the cavity, a side surface of the concave part and a bottom surface of the concave part, and a multi-layered wiring layer disposed at the central portion of the bottom portion of the cavity so as to cover the first pad and a part of the wiring portion. The multi-layered wiring layer has a second pad provided at an upper surface-side and connected to the wiring portion.

Abstract: An example connected device includes a first battery for supplying electric power to a game controller, a first terminal electrically connected to the game controller, and a resistor connected to the first terminal. The game controller includes a controlled component, a second battery for supplying electric power to the controlled component, a second terminal electrically connected to the connected device, a voltage detecting circuit detecting a voltage value in accordance with a current which flows through the resistor when the first terminal and the second terminal are connected to each other, and a control circuit. The control circuit discriminates a device connected to the game controller based on the detected voltage value, and switches from the second battery to the first battery when the discriminated device is the connected device while electric power is supplied from the second battery to the controlled component.

Abstract: An example connected device includes a first battery for supplying electric power to a game controller, a first terminal electrically connected to the game controller, and a resistor connected to the first terminal. The game controller includes a controlled component, a second battery for supplying electric power to the controlled component, a second terminal electrically connected to the connected device, a voltage detecting circuit detecting a voltage value in accordance with a current which flows through the resistor when the first terminal and the second terminal are connected to each other, and a control circuit. The control circuit discriminates a device connected to the game controller based on the detected voltage value, and switches from the second battery to the first battery when the discriminated device is the connected device while electric power is supplied from the second battery to the controlled component.

Abstract: A wiring substrate includes a metal plate in which at least one wiring formation region is defined, a cavity formed in the wiring formation region, a concave part formed to have a frame shape at a peripheral edge portion of a bottom portion of the cavity, a first pad disposed at a central portion of the bottom portion of the cavity, a wiring portion connected to the first pad and disposed on and extended along the central portion of the bottom portion of the cavity, a side surface of the concave part and a bottom surface of the concave part, and a multi-layered wiring layer disposed at the central portion of the bottom portion of the cavity so as to cover the first pad and a part of the wiring portion. The multi-layered wiring layer has a second pad provided at an upper surface-side and connected to the wiring portion.

Abstract: An example information processing system includes a main device, and an operation device attachable to the main device. The operation device includes a first control circuit, a first battery, and a first power supply circuit. The main device includes a second control circuit, a second battery, and a second power supply circuit. The second power supply circuit supplies power from the second battery to the operation device in response to satisfaction of a condition about the amount of remaining charge indicated by the remaining charge amount information transmitted from the operation device. When power is supplied from the main device to the operation device, the first power supply circuit supplies power supplied from the main device to the first control circuit, instead of power from the first battery.

Abstract: A wiring substrate includes a buried substrate disposed within a through-hole penetrating through a resin substrate of a core layer and including a plate-like body and a plurality of linear conductors penetrating the plate-like body, a first insulating layer covering a first surface of the resin substrate, a first wiring layer including a first pad pattern formed on a first surface of the buried substrate and a first wiring pattern formed on a first surface of the first insulating layer, and a third wiring pattern formed on the first surface of the resin substrate and covered by the first insulating layer. In the plurality of linear conductors, a gap between the adjacent linear conductors is smaller than a diameter of each of the linear conductors. The third wiring pattern is formed so as to have a thickness thicker than a thickness of the first wiring pattern.

Abstract: A wiring substrate includes a core substrate and a cavity extending through the core substrate. The cavity has a planar shape that is rectangular, and includes corners and sides connecting the corners in a plan view. The wiring substrate also includes first through holes that extend through the core substrate and are spaced apart from the cavity. An electronic component is arranged in the cavity. The wiring substrate also includes a first insulating material with which the first through holes are filled and a second insulating material with which a gap between the electronic component and walls of the cavity is filled. The first through holes are arranged around the corners of the cavity in a plan view. Each of the first through holes is L-shaped in a plan view and formed continuously along two of the sides of the cavity that define the corresponding corner.

Abstract: Provided is a vehicle-mounted-camera bracket (10) for attaching a vehicle-mounted camera (20) to a vehicle body (30), wherein the durability of a hook (103) is enhanced and the vehicle-mounted-camera bracket (10) is capable of inserting into an attachment hole (31) of the vehicle body (30) along a narrow insertion trajectory. The present invention has: a bracket main body (100) capable of fastening a vehicle-mounted camera (20); and three or more planar hooks (103) for fixing the vehicle-mounted camera (20) to the vehicle body (30), the hooks (103) being formed in the bracket main body (100); the three or more planar hooks (103) being arranged so as to be suspended on at least two facing inside edges of a substantially rectangular attachment hole (31) provided in the vehicle body (30) when the hooks (103) are attached to the vehicle body (30).

Abstract: A wiring substrate includes a core substrate and a cavity extending through the core substrate. The cavity has a planar shape that is rectangular, and includes corners and sides connecting the corners in a plan view. The wiring substrate also includes first through holes that extend through the core substrate and are spaced apart from the cavity. An electronic component is arranged in the cavity. The wiring substrate also includes a first insulating material with which the first through holes are filled and a second insulating material with which a gap between the electronic component and walls of the cavity is filled. The first through holes are arranged around the corners of the cavity in a plan view. Each of the first through holes is L-shaped in a plan view and formed continuously along two of the sides of the cavity that define the corresponding corner.

Abstract: A semiconductor device includes a first electronic component mounted to an upper face of a plated interconnect layer, a second electronic component mounted to a lower face of the plated interconnect layer, a first resin part covering the first electronic component on an upper side of the plated interconnect layer, and a second resin part covering the second electronic component on a lower side of the plated interconnect layer, wherein the first and second electronic components at least partially face each other across the plated interconnect layer, wherein the plated interconnect layer includes a sloping portion disposed on a sloping boundary between the first and second resin parts, and wherein an end part of the sloping portion is bent to have a face thereof exposed from the second resin part, and a lower surface of the second resin part is flush with the face of the end part.

Abstract: A game device according to the present embodiment includes a camera as image pick-up means. An inner camera is accommodated in an upper housing. In addition, a microphone hole is provided in an inner surface of the upper housing so as to sense external sound through a microphone.

Abstract: A wiring substrate includes a core layer including a plate-like body and linear conductors, a first wiring layer formed on a first surface of the plate-like body, and an insulating layer formed on the first surface. A gap between the adjacent linear conductors is smaller than a diameter of each linear conductor. The linear conductors include a first linear conductor disposed in a position overlapping with the first wiring layer and conducting to the first wiring layer and a second linear conductor disposed in a position not overlapping with the first wiring layer. An end surface of the first linear conductor on the side of the first surface is approximately flush with the first surface. An end surface of the second linear conductor on the side of the first surface is in a position more depressed than the first surface to form a hole. The insulating layer is filled in the hole.

Abstract: A probe card includes a wiring substrate including an opening portion and a connection pad arranged on an upper face of the wiring substrate located on the periphery of the opening portion, a resin portion formed in the opening portion of the wiring substrate, and the resin portion formed of a material having elasticity, a contact terminal arranged to protrude from the lower face of the resin portion, and wire buried in the resin portion and connecting the contact terminal and the connection pad, wherein the contact terminal is formed of an end part of the wire, and is formed integrally with the wire.

Abstract: A probe card includes a wiring substrate including an opening portion, a first connection pad, and a second connection pad arranged in an opposite area to the first connection pad, a resin portion formed in the opening portion, a first wire buried in the resin portion, in which one end is connected to the first connection pad and other end constitutes a first contact terminal, and a second wire buried in the resin portion, in which one end is connected to the second connection pad and other end constitutes a second contact terminal, wherein the first and second wires extend on one line, and the first and second contact terminals are arranged on the one line, and the first and second contact terminals are gathered to be separated such that the first and second contact terminals touch one electrode pad of a text object with a pair.