Patents by Inventor Ryo Fukasawa
Ryo Fukasawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8053877Abstract: A semiconductor package includes a chip base material; a capacitor formed on the base material; and a cover formed over the base material to cover the capacitor, and having a side portion and an upper portion. The base material is provided with a bonding pattern connecting the base material and the cover to cover the capacitor. The bonding pattern includes a region A having a substantially uniform pattern width A, and at least one region B having a pattern width B which is larger than the width pattern width A.Type: GrantFiled: November 4, 2009Date of Patent: November 8, 2011Assignee: Panasonic CorporationInventors: Ryo Fukasawa, Tatsuhiro Sawada
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Publication number: 20110242361Abstract: A game device according to the present embodiment includes a camera as image pick-up means. An inner camera is accommodated in an upper housing. In addition, a microphone hole is provided in an inner surface of the upper housing so as to sense external sound through a microphone.Type: ApplicationFiled: October 1, 2008Publication date: October 6, 2011Applicant: NINTENDO CO., LTD.Inventors: Masato Kuwahara, Kazunori Koshiishi, Yui Ehara, Ryo Fukasawa, Masahiro Imaizumi, Yoshihiro Matsushima, Yuki Onozawa, Hiroyuki Kono, Yoshihiro Iwasa, Tomohiro Kawase, Yusuke Akifusa, Tomohisa Saito
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Patent number: 7977569Abstract: A solar cell module is provided with a plurality of dye sensitized solar cells arranged on a plane and connected in series with an intercell region interposed therebetween. A first transparent substrate, a first transparent conductive film, a dye carrying oxide semiconductor layer, an electrolyte layer, a catalyst layer, a second transparent conductive film and a second transparent substrate are laminated. An insulating barrier seals cells on both sides thereof in fluid tightness and insulates them in the intercell region. An electrode connecting portion provided in a vertical central part of the insulating barrier connects an extended portion of the first transparent conductive film of one of the cells to that of a second transparent conductive film of the other cell, and the electrode connecting portion penetrates through at least one of the first transparent substrate and the second transparent substrate in the vertical direction and is thus exposed.Type: GrantFiled: December 10, 2007Date of Patent: July 12, 2011Assignee: Shinko Electric Industries Co., Ltd.Inventors: Sumihiro Ichikawa, Koji Takei, Noriyasu Shimizu, Yasunari Suzuki, Ryo Fukasawa, Daisuke Matono, Yuichiro Shimizu
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Publication number: 20100316367Abstract: An imaging apparatus comprises a lower housing, an upper housing, a lower LCD, an upper LCD, an inner camera, and a microphone. The upper housing has a lower side which is connected to an upper side of the lower housing such that the lower housing and the upper housing are foldable. The lower LCD has a display screen which is provided in an inner surface of the lower housing when folded. The upper LCD has a display screen which is provided in an inner surface of the upper housing when folded. The imaging section is provided in the inner surface of the upper housing and between the display screen of the lower LCD and the display screen of the upper LCD. The microphone is provided in the inner housing of the upper housing and between the display screen of the lower LCD and the display screen of the upper LCD.Type: ApplicationFiled: August 19, 2010Publication date: December 16, 2010Applicant: NINTENDO CO., LTD.Inventors: Masato Kuwahara, Kazunori Koshiishi, Yui Ehara, Ryo Fukasawa
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Publication number: 20100176467Abstract: A semiconductor package includes a chip base material; a capacitor formed on the base material; and a cover formed over the base material to cover the capacitor, and having a side portion and an upper portion. The base material is provided with a bonding pattern connecting the base material and the cover to cover the capacitor. The bonding pattern includes a region A having a substantially uniform pattern width A, and at least one region B having a pattern width B which is larger than the width pattern width A.Type: ApplicationFiled: November 4, 2009Publication date: July 15, 2010Inventors: Ryo FUKASAWA, Tatsuhiro Sawada
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Patent number: 7648906Abstract: A method and apparatus for processing a thin film able to easily form grooves in a conductive thin film on an insulating substrate, comprising bringing a first electrode into contact with the conductive thin film, maintaining a conductive state between a tip of a second electrode with a voltage applied with respect to the first electrode and the surface of the conductive thin film, and using the tip of the second electrode to scan the conductive thin film so as to thereby form grooves passing through the thickness of the conductive thin film and exposing the surface of the insulating substrate at their bottoms in the conductive thin film.Type: GrantFiled: January 11, 2006Date of Patent: January 19, 2010Assignee: Shinko Electric Industries Co., Ltd.Inventors: Koji Takei, Sumihiro Ichikawa, Yasunari Suzuki, Ryo Fukasawa, Daisuke Matono
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Publication number: 20090169727Abstract: A copper film forming method including the steps of spraying a copper formate solution including a copper foramate and a solvent which is evaporated at a certain temperature on a surface of the substrate, and spraying a reducing agent solution including a reducing agent for reducing a copper oxide or undecomposed copper formate on the surface of the substrate to the surface of the substrate. The spraying steps are performed while heating the substrate to the certain temperature and the substrate is placed in an inert gas which is inert at the certain temperature.Type: ApplicationFiled: December 19, 2008Publication date: July 2, 2009Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Ryo FUKASAWA
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Publication number: 20090059497Abstract: An imaging apparatus 10 comprises a lower housing 11, an upper housing 21, a lower LCD 12, an upper LCD 22, an inner camera 23, and a microphone. The upper housing 21 has a lower side which is connected to an upper side of the lower housing 11 such that the lower housing 11 and the upper housing 21 are foldable. The lower LCD 12 has a display screen which is provided in an inner surface of the lower housing 11 when folded. The upper LCD 22 has a display screen which is provided in an inner surface of the upper housing 21 when folded. The imaging section is provided in the inner surface of the upper housing 22 and between the display screen of the lower LCD 12 and the display screen of the upper LCD 22. The microphone is provided in the inner housing of the upper housing 21 and between the display screen of the lower LCD 12 and the display screen of the upper LCD 22.Type: ApplicationFiled: May 27, 2008Publication date: March 5, 2009Applicant: NINTENDO CO., LTD.Inventors: Masato Kuwahara, Kazunori Koshiishi, Yui Ehara, Ryo Fukasawa
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Publication number: 20080236662Abstract: In a solar cell module in which a plurality of dye sensitized solar cells is arranged on a plane basis and is connected in series with an intercell region interposed therebetween, a first transparent substrate, a first transparent conductive film, a dye carrying oxide semiconductor layer, an electrolyte layer, a catalyst layer, a second transparent conductive film and a second transparent substrate are laminated, an insulating barrier seals cells on both sides thereof in fluid tightness and insulates them in the intercell region, an electrode connecting portion provided in a central part in a vertical direction of the insulating barrier connects an extended portion of the first transparent conductive film of one of the cells on the both sides to that of a second transparent conductive film of the other cell, and the electrode connecting portion penetrates through at least one of the first transparent substrate and the second transparent substrate in the vertical direction and is thus exposed.Type: ApplicationFiled: December 10, 2007Publication date: October 2, 2008Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Sumihiro Ichikawa, Koji Takei, Noriyoshi Shimizu, Yasunari Suzuki, Ryo Fukasawa, Daisuke Matono, Yuichiro Shimizu
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Patent number: 7169501Abstract: A single chamber fuel cell comprised of a cell arranged in a mixed fuel gas comprised of hydrogen or another fuel gas and oxygen, wherein the cell used is a pn junction type semiconductor having electrodes of a p-type semiconductor with carriers of holes and an n-type semiconductor with carriers of electrons connected to ends of electrical takeout wires, and each of the p-type semiconductor and n-type semiconductor is formed porous to an extent enabling the mixed fuel gas to pass.Type: GrantFiled: December 11, 2003Date of Patent: January 30, 2007Assignee: Shinko Electric Industries Co., Ltd.Inventors: Shigeaki Suganuma, Michio Horiuchi, Misa Watanabe, Ryo Fukasawa
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Publication number: 20060160340Abstract: A method and apparatus for processing a thin film able to easily form grooves in a conductive thin film on an insulating substrate, comprising bringing a first electrode into contact with the conductive thin film, maintaining a conductive state between a tip of a second electrode with a voltage applied with respect to the first electrode and the surface of the conductive thin film, and using the tip of the second electrode to scan the conductive thin film so as to thereby form grooves passing through the thickness of the conductive thin film and exposing the surface of the insulating substrate at their bottoms in the conductive thin film.Type: ApplicationFiled: January 11, 2006Publication date: July 20, 2006Inventors: Koji Takei, Sumihiro Ichikawa, Yasunari Suzuki, Ryo Fukasawa, Daisuke Matono
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Patent number: 7030420Abstract: A linear array of red LEDs 10R is provided so as to extend in a direction substantially perpendicular to a direction in which a swing-type display device is swung, and a linear array of green LEDs 10G is further provided, the red LEDs 10R and green LEDs 10G being arranged in pairs of two. A CPU activates each of the red LEDs 10R and green LEDs 10G for a predetermined period to emit light in a luminance level in accordance with image data. As a result, an image corresponding to the image data is displayed in the trajectory of the swing due to persistence of vision. Thus, an image can be displayed in various colors.Type: GrantFiled: August 22, 2003Date of Patent: April 18, 2006Assignee: Nintendo Co., Ltd.Inventors: Masaru Shimomura, Mikihiro Ishikawa, Hirotaka Uemura, Ryo Fukasawa, Masahiko Ota
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Publication number: 20040222428Abstract: A linear array of red LEDs 10R is provided so as to extend in a direction substantially perpendicular to a direction in which a swing-type display device is swung, and a linear array of green LEDs 10G is further provided, the red LEDs 10R and green LEDs 10G being arranged in pairs of two. A CPU activates each of the red LEDs 10R and green LEDs 10G for a predetermined period to emit light in a luminance level in accordance with image data. As a result, an image corresponding to the image data is displayed in the trajectory of the swing due to persistence of vision. Thus, an image can be displayed in various colors.Type: ApplicationFiled: August 22, 2003Publication date: November 11, 2004Applicant: Nintendo Co., LtdInventors: Masaru Shimomura, Mikihiro Ishikawa, Hirotaka Uemura, Ryo Fukasawa, Masahiko Ota
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Publication number: 20040121197Abstract: A single chamber fuel cell comprised of a cell arranged in a mixed fuel gas comprised of hydrogen or another fuel gas and oxygen, wherein the cell used is a pn junction type semiconductor having electrodes of a p-type semiconductor with carriers of holes and an n-type semiconductor with carriers of electrons connected to ends of electrical takeout wires, and each of the p-type semiconductor and n-type semiconductor is formed porous to an extent enabling the mixed fuel gas to pass.Type: ApplicationFiled: December 11, 2003Publication date: June 24, 2004Applicant: SHINKO ELECTRIC INDUSTRIES CO. LTD.Inventors: Shigeaki Suganuma, Michio Horiuchi, Misa Watanabe, Ryo Fukasawa