Abstract: Provided is a wafer lens unit comprising a plurality of wafer lens arrays, wherein the wafer lens array comprises a plurality of lenses arranged in one dimension or two dimensions and a substrate interconnecting the lenses; and the neighboring wafer lens arrays are bonded through an adhesive layer comprising a spacer only at the substrates thereof.

Abstract: Provided is a wafer lens unit comprising a plurality of wafer lens arrays, wherein the wafer lens array comprises a plurality of lenses arranged in one dimension or two dimensions and a substrate interconnecting the lenses; and the neighboring wafer lens arrays are bonded through an adhesive layer comprising a spacer only at the substrates thereof.

Abstract: A wafer lens array comprising a plurality of lens sections arranged one-dimensionally or two-dimensionally, a substrate section connecting the lens sections, and gap sections, wherein the lens surfaces in the lens section each have one or more curved surfaces; the gap section is a part projecting from outside than the inner edge of the lens section; and the inner surfaces of the gap sections are spread from a side near the lens section to the other side.

Abstract: Disclosed are a wafer-level lens array, a method of manufacturing a wafer-level lens array, a lens module, and an imaging unit that can prevent the influence of, for example, the shrinkage of a forming material, prevent the positional deviation between lenses when the wafer-level lens arrays overlap each other or when the wafer-level lens array overlaps an imaging element array, and be easily designed. A method of manufacturing a wafer-level lens array including a substrate unit and a plurality of lens units that is arranged on the substrate unit includes: forming the substrate unit; and integrally forming the lens units that are made of a resin having substantially the same optical characteristics as a material forming the substrate unit with the substrate unit.