Patents by Inventor Ryo Nonaka
Ryo Nonaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250012008Abstract: The present invention provides a urethane resin composition including a urethane resin (A) having a nonionic group, water (B), and a powder (C), wherein the urethane resin (A) has a flow start temperature of 100° C. or above, the mass ratio [(A)/(B)] of the urethane resin (A) to the water (B) is in the range of 50/50 to 80/20, and the bulk density of the powder (C) is 400 g/L or less. The present invention also provides a synthetic leather including at least a base fabric (i), an adhesive layer (ii), and a skin layer (iii), wherein the adhesive layer (ii) is formed from the urethane resin composition. The urethane resin composition can form a film with excellent peel strength and texture.Type: ApplicationFiled: November 24, 2022Publication date: January 9, 2025Applicant: DIC CORPORATIONInventors: Tomohiro Tetsui, Miwa Usguchi, Ryo Maeda, Ryo Nonaka
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Patent number: 11578639Abstract: A fan shroud and a blower device are provided. The fan shroud includes a shroud wall surface and a plurality of ventilation openings. The shroud wall surface extends around a fan along a radial direction orthogonal to a rotation axis. The plurality of ventilation openings are formed through the shroud wall surface in a thickness direction of the shroud wall surface to allow passing of wind generated by a fan motor. A width of a wall surface side opening on a downstream side of the wind in the ventilation opening is smaller than a width of a lateral wall side opening on an upstream side of the wind in the ventilation opening.Type: GrantFiled: January 27, 2022Date of Patent: February 14, 2023Assignee: MITSUBA CorporationInventors: Ryo Nonaka, Hidetake Ota
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Publication number: 20220243640Abstract: A fan shroud and a blower device are provided. The fan shroud includes a shroud wall surface and a plurality of ventilation openings. The shroud wall surface extends around a fan along a radial direction orthogonal to a rotation axis. The plurality of ventilation openings are formed through the shroud wall surface in a thickness direction of the shroud wall surface to allow passing of wind generated by a fan motor. A width of a wall surface side opening on a downstream side of the wind in the ventilation opening is smaller than a width of a lateral wall side opening on an upstream side of the wind in the ventilation opening.Type: ApplicationFiled: January 27, 2022Publication date: August 4, 2022Applicant: MITSUBA CorporationInventors: RYO NONAKA, HIDETAKE OTA
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Patent number: 11022842Abstract: A planar light source device has: a housing, a substrate, a plurality of light-emitting devices each having a light-emitting element and a light-beam control member; and a light diffusing member. The housing has: a bottom surface and two inclined surfaces. In the light distribution characteristics of a light-emitting device, a light ray with the largest angle relative to the optical axis in an angular range within which a luminous intensity equal to or more than 70% of the maximum luminous intensity is exhibited reaches the inclined surfaces. A first angle between the optical axis of the light-emitting element and a light ray having the maximum luminous intensity emitted from the light-emitting device is larger than a second angle between the optical axis of the light-emitting element and a straight line connecting the luminescence center of the light-emitting element to the opening-side end portion of the housing.Type: GrantFiled: December 5, 2017Date of Patent: June 1, 2021Assignee: Enplas CorporationInventors: Ryo Nonaka, Kyouhei Yamada
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Publication number: 20200225536Abstract: A planar light source device has: a housing, a substrate, a plurality of light-emitting devices each having a light-emitting element and a light-beam control member; and a light diffusing member. The housing has: a bottom surface and two inclined surfaces. In the light distribution characteristics of a light-emitting device, a light ray with the largest angle relative to the optical axis in an angular range within which a luminous intensity equal to or more than 70% of the maximum luminous intensity is exhibited reaches the inclined surfaces. A first angle between the optical axis of the light-emitting element and a light ray having the maximum luminous intensity emitted from the light-emitting device is larger than a second angle between the optical axis of the light-emitting element and a straight line connecting the luminescence center of the light-emitting element to the opening-side end portion of the housing.Type: ApplicationFiled: December 5, 2017Publication date: July 16, 2020Applicant: Enplas CorporationInventors: Ryo NONAKA, Kyouhei YAMADA
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Patent number: 10418258Abstract: A temperature of only a part in a surface of a mounting table can be set to be higher than or lower than a set temperature of an entire surface of the mounting table. A main flow path 320 formed within the mounting table 200 to be arranged over the entire surface thereof; an auxiliary flow path 330 formed within the mounting table to be arranged in a part of the surface thereof; and a temperature control medium circulating unit that supplies and circulates a temperature control medium adjusted to have a set temperature into and through the main flow path, allows the temperature control medium to be branched, and supplies and circulates the branched temperature control medium into and through the auxiliary flow path after adjusting a temperature of the branched temperature control medium to be a temperature higher than or lower than the set temperature are provided.Type: GrantFiled: July 19, 2012Date of Patent: September 17, 2019Assignee: TOKYO ELECTRON LIMITEDInventor: Ryo Nonaka
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Patent number: 10408417Abstract: A light-emitting element includes a rectangular light emitting element with four edge surfaces; and a light flux control member defining a central axis and having a back surface, light entry surface formed as a recess in the back surface, a light emission surface disposed opposite the back surface, and a plurality of protruding elements forming a grid on the back surface. The grid of protruding elements include a plurality of linear ridges/valleys such that the angles formed by such linear ridges/valley and a plane including at least one of the edge surfaces of the light emitting element is an acute angle; or the grid of protruding element include a plurality of annular ridges/valley centered about the central axis, and a plurality of linear ridges/valleys disposed radially around the central axis.Type: GrantFiled: October 29, 2015Date of Patent: September 10, 2019Assignee: ENPLAS CORPORATIONInventors: Yasuyuki Fukuda, Ryo Nonaka
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Publication number: 20170328537Abstract: This light-emitting device has a light-emitting element, whereof the shape in planar view is rectangular, for emitting light, and a light flux control member. The light flux control member has an entry surface, a back surface, and where grid-shaped protruding stripes comprising a plurality of protruding stripes disposed into a grid shape or grid-shaped recessed stripes comprising a plurality of recessed stripes disposed into a grid shape are formed; and an exit surface disposed on the surface facing away from the back surface, and where the light that has entered the entry surface is caused to exit. Of the angles formed by each of the four sides constituting the outer edges of the light-emitting element and a first virtual straight line that is parallel to the crest lines of the grid-shaped protruding stripes or the valley lines of the grid-shaped recessed stripes, the smaller angle is an acute angle.Type: ApplicationFiled: October 29, 2015Publication date: November 16, 2017Inventors: Yasuyuki FUKUDA, Ryo NONAKA
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Patent number: 9330891Abstract: A plasma processing method of the present disclosure includes attaching a Si-containing material or a N-containing material to an electrostatic chuck that is provided in a processing container and attached with a reaction product containing C and F, in a state where a workpiece is not mounted on the electrostatic chuck; adsorbing the workpiece by the electrostatic chuck attached with the Si-containing material or the N-containing material when the workpiece is carried into the processing container; processing the workpiece with plasma; and separating the workpiece processed with plasma from the electrostatic chuck attached with the Si-containing material or the N-containing material.Type: GrantFiled: October 29, 2014Date of Patent: May 3, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Ryo Nonaka, Masanori Sato, Natsuki Yabumoto, Takamitsu Takayama, Akitoshi Harada, Junichi Sasaki, Hidetoshi Hanaoka
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Publication number: 20150114930Abstract: A plasma processing method of the present disclosure includes attaching a Si-containing material or a N-containing material to an electrostatic chuck that is provided in a processing container and attached with a reaction product containing C and F, in a state where a workpiece is not mounted on the electrostatic chuck; adsorbing the workpiece by the electrostatic chuck attached with the Si-containing material or the N-containing material when the workpiece is carried into the processing container; processing the workpiece with plasma; and separating the workpiece processed with plasma from the electrostatic chuck attached with the Si-containing material or the N-containing material.Type: ApplicationFiled: October 29, 2014Publication date: April 30, 2015Applicant: TOKYO ELECTRON LIMITEDInventors: Ryo NONAKA, Masanori SATO, Natsuki YABUMOTO, Takamitsu TAKAYAMA, Akitoshi HARADA, Junichi SASAKI, Hidetoshi HANAOKA
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Patent number: 8950469Abstract: A temperature control system includes a heat transfer medium supply configured to supply a first heat transfer medium of a first temperature into a heat transfer medium path; at least one heat transfer medium storage provided between the heat transfer medium path and the heat transfer medium supply and configured to store a second heat transfer medium of a second temperature higher than the first temperature; a heat transfer medium supply control device provided between the heat transfer medium supply and the heat transfer medium path and between the heat transfer medium storage and the heat transfer medium path and configured to stop a supply of the first heat transfer medium into the heat transfer medium path from the heat transfer medium supply and to supply the second heat transfer medium into the heat transfer medium path from the heat transfer medium storage when a heating unit generates heat.Type: GrantFiled: October 12, 2010Date of Patent: February 10, 2015Assignee: Tokyo Electron LimitedInventors: Yasuharu Sasaki, Ryo Nonaka, Nobuyuki Nagayama
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Publication number: 20140311728Abstract: A temperature of only a part in a surface of a mounting table can be set to be higher than or lower than a set temperature of an entire surface of the mounting table. A main flow path 320 formed within the mounting table 200 to be arranged over the entire surface thereof; an auxiliary flow path 330 formed within the mounting table to be arranged in a part of the surface thereof; and a temperature control medium circulating unit that supplies and circulates a temperature control medium adjusted to have a set temperature into and through the main flow path, allows the temperature control medium to be branched, and supplies and circulates the branched temperature control medium into and through the auxiliary flow path after adjusting a temperature of the branched temperature control medium to be a temperature higher than or lower than the set temperature are provided.Type: ApplicationFiled: July 19, 2012Publication date: October 23, 2014Applicant: TOKYO ELECTRON LIMITEDInventor: Ryo Nonaka
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Patent number: 8132580Abstract: A substrate processing system that enables foreign matter adhered to a rear surface or a periphery of a substrate to be completely removed. A substrate processing apparatus performs predetermined processing on the substrate. A substrate cleaning apparatus cleans the substrate at least one of before and after the predetermined processing. A jetting apparatus jets a cleaning substance in two phases of a gas phase and a liquid phase and a high-temperature gas towards the rear surface or the periphery of the substrate.Type: GrantFiled: March 28, 2008Date of Patent: March 13, 2012Assignee: Tokyo Electron LimitedInventors: Tsuyoshi Moriya, Tadashi Onishi, Ryo Nonaka, Eiichi Nishimura
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Patent number: 7988062Abstract: A temperature control device for a target substrate includes a mounting table having temperature control members respectively provided in temperature systems to control temperatures of regions of the target substrate to respective predetermined temperature levels; circulation channels through which fluids passing through the temperature control members flow; and heating channels each for flowing therein a heated fluid having a higher temperature compared to the fluids circulating in the circulation channels. The device further includes cooling channels each for flowing therein a cooled fluid having a lower temperature compared to the fluids circulating in the circulation channels; and joining units that join the circulation channels to build the respective temperature control systems, the joining units having flow rate control units that controls flow rate ratios of the fluids supplied from the respective channels to the temperature control members.Type: GrantFiled: October 30, 2008Date of Patent: August 2, 2011Assignee: Tokyo Electron LimitedInventors: Ryo Nonaka, Koichi Murakami
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Publication number: 20110083837Abstract: A temperature control system includes a heat transfer medium supply configured to supply a first heat transfer medium of a first temperature into a heat transfer medium path; at least one heat transfer medium storage provided between the heat transfer medium path and the heat transfer medium supply and configured to store a second heat transfer medium of a second temperature higher than the first temperature; a heat transfer medium supply control device provided between the heat transfer medium supply and the heat transfer medium path and between the heat transfer medium storage and the heat transfer medium path and configured to stop a supply of the first heat transfer medium into the heat transfer medium path from the heat transfer medium supply and to supply the second heat transfer medium into the heat transfer medium path from the heat transfer medium storage when a heating unit generates heat.Type: ApplicationFiled: October 12, 2010Publication date: April 14, 2011Applicant: TOKYO ELECTRON LIMITEDInventors: Yasuharu Sasaki, Ryo Nonaka, Nobuyuki Nagayama
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Publication number: 20090188428Abstract: A substrate processing apparatus includes a processing vessel; a mounting table for mounting the substrate thereon in the processing vessel; a gas inlet unit provided in the processing vessel; a gas supply mechanism for supplying a hydrogen-containing gas into the processing vessel through the gas inlet unit; a gas discharge port provided at the processing vessel; a gas exhaust mechanism for exhausting an inside of the processing vessel through the gas discharge port; a catalyst provided in the processing vessel; and a heating unit for heating the catalyst. Hydrogen radicals are formed in the processing vessel by a catalytic cracking reaction between the hydrogen-containing gas and the catalyst of high temperature, and the substrate is processed by the hydrogen radicals.Type: ApplicationFiled: January 28, 2009Publication date: July 30, 2009Applicant: TOKYO ELECTRON LIMITEDInventors: Isamu SAKURAGI, Shigeru Tahara, Kumiko Yamazaki, Ryo Nonaka, Morihiro Takanashi, Eiichi Nishimura
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Publication number: 20090118872Abstract: A temperature control device for a target substrate includes a mounting table having temperature control members respectively provided in temperature systems to control temperatures of regions of the target substrate to respective predetermined temperature levels; circulation channels through which fluids passing through the temperature control members flow; and heating channels each for flowing therein a heated fluid having a higher temperature compared to the fluids circulating in the circulation channels. The device further includes cooling channels each for flowing therein a cooled fluid having a lower temperature compared to the fluids circulating in the circulation channels; and joining units that join the circulation channels to build the respective temperature control systems, the joining units having flow rate control units that controls flow rate ratios of the fluids supplied from the respective channels to the temperature control members.Type: ApplicationFiled: October 30, 2008Publication date: May 7, 2009Applicant: TOKYO ELECTRON LIMITEDInventors: Ryo NONAKA, Koichi Murakami
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Publication number: 20090049981Abstract: A cylinder stop position varying mechanism is employed in a cylinder having a piston and a shaft. The cylinder stop position varying mechanism includes a stopper fitted onto the shaft; a pair of limiters for stopping a reciprocating movement of the piston by contact with the stopper; and a limiter moving mechanism for varying positions of the limiters. The cylinder is driven by a hydraulic pressure, and the limiter moving mechanism is provided to each of the pair of limiters to control positions of the limiters independently.Type: ApplicationFiled: August 15, 2008Publication date: February 26, 2009Applicant: TOKYO ELECTRON LIMITEDInventors: Daisuke HAYASHI, Ryo NONAKA
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Publication number: 20080314564Abstract: A temperature control device controls the temperature of a controlled object by circulating a fluid in a temperature adjustment unit arranged near the controlled object. The temperature control device comprises a heating pathway that heats and circulates the fluid in the temperature adjustment unit, a cooling pathway that cools and circulates the fluid in the temperature adjustment unit, a bypass pathway that does not pass the fluid through the heating pathway and cooling pathway, but circulates the fluid in the temperature adjustment unit, and adjustment means that adjust a flow ratio of the fluid that is supplied from the heating pathway, cooling pathway, and bypass pathway to the temperature adjustment unit via a confluence unit that combines these flows. The adjustment means are provided on a downstream side of each of the heating pathway, the cooling pathway, and the bypass pathway and on the upstream side of the confluence unit.Type: ApplicationFiled: April 25, 2008Publication date: December 25, 2008Applicants: TOKYO ELECTRON LIMITED, CKD CORPORATIONInventors: Kazuya NAGASEKI, Yoshiyuki KOBAYASHI, Koichi MURAKAMI, Ryo NONAKA, Yoshihisa SUDOH, Hiroshi ITAFUJI, Norio KOKUBO
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Patent number: D778334Type: GrantFiled: March 30, 2015Date of Patent: February 7, 2017Assignee: ENPLAS CORPORATIONInventors: Hiroshi Takatori, Yasuyuki Fukuda, Ryo Nonaka