TEMPERATURE CONTROL DEVICE

Abstract

A temperature control device controls the temperature of a controlled object by circulating a fluid in a temperature adjustment unit arranged near the controlled object. The temperature control device comprises a heating pathway that heats and circulates the fluid in the temperature adjustment unit, a cooling pathway that cools and circulates the fluid in the temperature adjustment unit, a bypass pathway that does not pass the fluid through the heating pathway and cooling pathway, but circulates the fluid in the temperature adjustment unit, and adjustment means that adjust a flow ratio of the fluid that is supplied from the heating pathway, cooling pathway, and bypass pathway to the temperature adjustment unit via a confluence unit that combines these flows. The adjustment means are provided on a downstream side of each of the heating pathway, the cooling pathway, and the bypass pathway and on the upstream side of the confluence unit.

Description

FIELD OF THE INVENTION

The present invention relates to a temperature control device that controls the temperature of a controlled object by circulating a fluid in a temperature adjustment unit arranged near the controlled object.

BACKGROUND ART

FIG. 12 shows this type of temperature control device. Fluid inside a storage tank 100 is drawn by a pump 102, and is discharged to a heating unit 104. The heating unit 104 is comprised of a heater, and is capable of heating the fluid to be supplied to a temperature adjustment unit 106. The fluid that has passed through the temperature adjustment unit 106 will be supplied to a cooling unit 108. The cooling unit 108 is capable of cooling the fluid to be discharged to the storage tank 100.

The temperature adjustment unit 106 is capable of supporting a controlled object, and the temperature of the controlled object that is supported by the temperature adjustment unit 106 will be controlled by adjusting the temperature of the fluid supplied to the temperature adjustment unit 106. Here, when there is a need to raise the temperature of the controlled object, the fluid in the cooling unit 108 will not be cooled, and the fluid in the heating unit 10 will be heated. In contrast, when there is a need to lower the temperature of the controlled object, the fluid in the cooling unit 108 will be cooled, and the fluid in the heating unit 10 will not be heated. In this way, the temperature of the controlled object can be controlled at a desired level.

Note that a conventional temperature control device may be one other than that shown in FIG. 12, e.g., the device disclosed in the following Patent Reference 1.

[Patent Reference 1] Japanese Published Patent Application No. 2000-89832.

SUMMARY OF THE INVENTION

The aforementioned temperature control device requires a long period of time in order to change to the desired temperature of a controlled object. When there is a need to cool the temperature of a controlled object, it will be necessary to stop heating with the heating unit 104 and start cooling with the cooling unit 108. However, even after heating with the heating unit 104 is stopped, high temperature fluid will be supplied from the heating unit 104 for a period of time due to residual heat. In addition, even though cooling has begun with the cooling unit 108, it will take time for the fluid to be actually cooled, and an even longer period of time will be needed to reduce the temperature of the fluid inside the storage tank 100. Because of this, the temperature inside the temperature adjustment unit 106 cannot be quickly changed, and thus the temperature of the controlled object cannot be quickly changed.

An object of the present invention is to provide a temperature control device that can, when controlling the temperature of a controlled object by circulating a fluid in a temperature adjustment unit arranged near the controlled object, quickly achieve the desired temperature of the controlled object.

An aspect of the invention of means 1 is a temperature control device that controls the temperature of a controlled object by circulating a fluid in a temperature adjustment unit arranged near the controlled object, and can comprise a heating pathway that heats and circulates the fluid in the temperature adjustment unit, a cooling pathway that cools and circulates the fluid in the temperature adjustment unit, a bypass pathway that does not pass the fluid through the heating pathway and cooling pathway, but circulates the fluid in the temperature adjustment unit, and adjustment means that adjust a flow ratio of the fluid that is supplied from the heating pathway, cooling pathway, and bypass pathway to the temperature adjustment unit via a confluence unit that combines these flows. The adjustment means may be provided on a downstream side of each of the heating pathway, the cooling pathway, and the bypass pathway and on the upstream side of the confluence unit.

Means 1 can quickly change the temperature of the fluid supplied to the temperature adjustment unit by adjusting the flow ratio supplied to the temperature adjustment unit via the heating pathway, the cooling pathway, and the bypass pathway. In particular, because the flow ratio is adjusted on the downstream side of the heating pathway, the cooling pathway, and the bypass pathway, and on the upstream side of the confluence unit, the distance between the flow ratio adjustment point and the temperature adjustment unit can be considerably shortened, and the temperature of the fluid supplied to the temperature adjustment unit can be all the more quickly changed. Because of this, when the temperature of the controlled object is to be controlled, the temperature of the controlled object can quickly achieve the desired level.

Note that it is preferable that the path dimensions of the confluence unit is small to the greatest extent possible so as not to reduce the flow rate of the fluid flowing therein via the heating pathway, the cooling pathway, and the bypass pathway. Here, the flow rate of the fluid is the forward speed of the fluid in the direction of circulation.

In addition, the adjustment means may adjust the individual flow ratio of the fluid that is supplied to the temperature adjustment unit via the heating pathway, the cooling pathway, and the bypass pathway.

An aspect of the invention of means 2 is a temperature control device that controls the temperature of a controlled object by circulating a fluid in a temperature adjustment unit arranged near the controlled object, and can comprise a heating pathway that heats and circulates the fluid in the temperature adjustment unit, a cooling pathway that cools and circulates the fluid in the temperature adjustment unit, a bypass pathway that does not pass the fluid through the heating pathway and cooling pathway, but circulates the fluid in the temperature adjustment unit, and adjustment means that adjust the downstream side flow dimensions of each of the heating pathway, cooling pathway, and bypass pathway.

Means 2 can adjust the flow ratio supplied to the temperature adjustment unit via the heating pathway, the cooling pathway, and the bypass pathway by adjusting the respective downstream side flow dimensions of the heating pathway, the cooling pathway, and the bypass pathway. Thus, the temperature of the fluid supplied to the temperature adjustment unit can be quickly changed. Because of this, when the temperature of the controlled object is to be controlled, the temperature of the controlled object can quickly achieve the desired level.

In an aspect of the invention of means 3, the bypass pathway is shared with the heating pathway and the cooling pathway.

Means 3 can employ a shared bypass pathway when fluid is to be supplied from the heating pathway and the bypass pathway to the temperature adjustment unit, and when fluid is to be supplied from the cooling pathway and the bypass pathway to the temperature adjustment unit. Because of this, compared to situations in which different bypass pathways must be used, the structure of the temperature control device can be simplified.

In an aspect of the invention of means 4, an effusion pathway that diverts the fluid from the adjustment means and effuses the fluid can be provided on the upstream side of the heating pathway and the cooling pathway.

When the supply of fluid from the heating pathway and the cooling pathway to the temperature adjustment unit is prohibited, a temperature gradient will be created between the downstream side of the adjustment means and the prohibited pathway. Thus, due to the effects of the temperature gradient in the fluid to be supplied to the temperature adjustment unit immediately after the prohibition is eliminated, a longer period of time may be needed for the temperature of the temperature adjustment unit to achieve the desired temperature. By including the effusion pathways in means 4, temperature gradients upstream of the discharge pathway can be suitably inhibited, and the temperature of the temperature adjustment unit can quickly achieve the desired temperature.

Note that means 4 may be provided with heating side temperature detecting means that detects the temperature upstream from the adjustment means along the heating pathway, and cooling side temperature detecting means that detects the temperature upstream from the adjustment means along the cooling pathway. In this case, by providing the effusion pathways, the effect of temperature gradients on the detecting means caused by prohibiting the discharge of fluid from the heating pathway and the cooling pathway can be suitably inhibited.

An aspect of the invention of means 5 can comprise a pump that draws in the fluid downstream from the temperature adjustment unit, and discharges the fluid to the heating pathway, the cooling pathway, and the bypass pathway.

Means 5 can use the pump to circulate the fluid. In particular, by arranging a pump upstream from the heating pathway, the cooling pathway, and the bypass pathway, the length of the fluid pathway between the adjustment means and the temperature adjustment unit can be shortened compared to when arranged downstream from the heating pathway, the cooling pathway, and the bypass pathway and upstream from the temperature adjustment unit. Because of this, the fluid supplied from the adjustment means can be quickly delivered to the temperature adjustment unit, and the temperature of the temperature adjustment unit can quickly achieve the desired temperature.

An aspect of the invention of means 6 can be provided with a storage means that stores the fluid on the upstream side of each of the heating pathway, the cooling pathway, and the bypass pathway, and on the downstream side of the temperature adjustment unit. The storage means absorbs a change in the volume of the fluid due to a change in temperature.

When the volume of the fluid is temperature dependent, the circulation of the fluid may be hindered by a change in the volume caused by a change in the temperature of the fluid. Because means 6 has a function in which the storage means absorbs a change in the volume, the circulation of the fluid can be suitably maintained when the volume of the fluid changes. Moreover, by arranging the storage means upstream from the heating pathway, the cooling pathway, and the bypass pathway, the length of the fluid pathway between the adjustment means and the temperature adjustment unit can be shortened compared to when the storage means is arranged downstream from the heating pathway, the cooling pathway, and the bypass pathway and upstream from the temperature adjustment unit.

An aspect of the invention of means 7 can comprise a manipulating means that manipulates the adjustment means so as to control the temperature of the fluid inside and/or near the temperature adjustment unit to a target value.

In means 7, the temperature of the temperature adjustment unit can be adjusted by providing the manipulating means at desired level.

An aspect of the invention of means 8 may comprise a supply temperature detection means that detects the temperature of the fluid inside and/or near the temperature adjustment unit, and the manipulating means feedback controls the value detected by the temperature detection means to the target value.

With means 8, the detected value will be adjusted to the target value with a high degree of accuracy because the manipulating means performs feedback control.

In an aspect of the invention of means 9, the adjustment means can adjust the downstream side flow dimensions of each of the heating pathway, the cooling pathway, and the bypass pathway. The manipulating means can comprise a conversion means that converts an amount based upon a degree of deviation from the target value of the detected value to manipulating variable of a path dimension for each of the heating pathway, the cooling pathway, and the bypass pathway.

By providing the conversion means in means 9, the degree of deviation of the detected value from the target value can be simply quantified with a single amount, and the path dimensions of the three pathways can be adjusted (changed) based on this quantified amount.

Note that it is preferable for the conversion means to change the path dimensions of the cooling pathway and the bypass pathway with respect to the change of the degree of deviation when the detected value is larger than the target value, and change the path dimensions of the heating pathway and the bypass pathway with respect to the change of the degree of deviation when the detected value is smaller than the target value.

An aspect of the invention of means 10 may comprise a bypass temperature detecting means that detects the temperature of the bypass pathway. In means 10, instead of performing feedback control, for a predetermined period of time after a change in the target value, the manipulating means manipulates the adjustment means so as to perform open loop control of the temperature of the fluid inside and/or near the temperature adjustment unit based upon the value detected by the bypass temperature detecting means.

When the target value is changed, an increase in the gain of the feedback control will be requested in order to quickly place the temperature of the detected value at the target value by means of that control. When the gain of the control increases, there will be an increase in the amount of variation in the detected value above and below the target value. Thus, with feedback control, there is a mutual trade-off between an increase in responsiveness and the inhibition of the amount of variation. With means 10, because open loop control is performed instead of feedback control over a predetermined period of time from when the target value is changed, responsiveness during the change in the target value can be increased, even if the feedback control was set so as to inhibit the amount of variation in the detected value above and below the target value.

In an aspect of the invention of means 11, the adjustment means may adjust the downstream side flow dimensions of each of the heating pathway, the cooling pathway, and the bypass pathway. For the predetermined period, the manipulating means open loop controls the temperature of the temperature adjustment unit to the target value by manipulating the adjustment means so as to adjust the path dimensions of the bypass pathway and the cooling pathway if the temperature of the fluid inside the bypass pathway is higher than the target value, and open loop controls the temperature of the temperature adjustment unit to the target value by manipulating the adjustment means so as to adjust the path dimensions of the bypass pathway and the heating pathway if the temperature of the fluid inside the bypass pathway is lower than the target value.

Means 11 can reduce the amount of energy consumption, compared to when the heating pathway is used, by manipulating the path dimensions of the bypass pathway and the cooling pathway when the temperature of the fluid inside the bypass pathway is higher than the target value. In addition, means 11 can reduce the amount of energy consumption, compared to when the cooling pathway is used, by manipulating the path dimensions of the bypass pathway and the heating pathway when the temperature of the fluid inside the bypass pathway is lower than the target value.

An aspect of the invention of means 12 further a transient target value setting means that changes the target value, when a desired temperature of the temperature adjustment unit is changed, so as to be larger than the change of the desired value.

In order for the temperature of the temperature adjustment unit to achieve the target value after the target value is changed, it will be necessary to change the temperature of the temperature adjustment unit by means of temperature-adjusted fluid, and thus a response lag will be created in achieving the target value. Furthermore, in order to change the temperature of the controlled object, the exchange of heat energy between the controlled object and the temperature adjustment unit must occur after the temperature of the temperature adjustment unit is changed, and thus the response lag in the change in temperature of the controlled object will become all the more prominent. Here, when the desired temperature is changed, means 12 can quickly change the temperature of the temperature adjustment unit and the controlled object to the desired temperature by making the change in the target value larger than the desired change.

An aspect of the invention of means 13 may comprise an open loop control adjustment support means that outputs prompt signals to select any one of a plurality of selections relating to at least one of open loop control gain, the period of time that open loop control is to continue, and the target value during open loop control, and performs temperature control in accordance with the selected value.

With open loop control, the optimal setting of the gain, the period of time control is to continue, and the target value, will depend on the controlled object. Thus, by fixing these parameters from the start in the temperature control device, open loop control may not be able to be performed on the controlled object. By providing the adjustment support means, means 13 can reduce the amount of work performed when a user of the temperature control device applies these parameters in response to the controlled object.

In an aspect of the invention of means 14, the adjustment means can adjust the downstream side flow dimensions of each of the heating pathway, the cooling pathway, and the bypass pathway. The manipulating means prevents the path dimensions of the heating pathway and the cooling pathway that are adjusted by the adjustment means from reaching zero when the temperature inside and/or near the temperature adjustment unit is in a steady state.

When the supply of fluid from the heating pathway and the cooling pathway to the temperature adjustment unit is prohibited, a temperature gradient will be created between the downstream side of the adjustment means and the prohibited pathway. Thus, due to the effects of the temperature gradient in the fluid to be supplied to the temperature adjustment unit immediately after the prohibition is eliminated, a longer period of time may be needed for the temperature of the temperature adjustment unit to achieve the desired temperature. When the temperature of the temperature adjustment unit is in a steady state, means 14 can suitably inhibit temperature gradients, and can more quickly place the temperature of the temperature adjustment unit at the desired temperature, by prohibiting the path dimensions adjusted by the adjustment means of the heating pathway and the cooling pathway from reaching zero.

Note that means 14 may be provided with heating side temperature detecting means that detects that temperature upstream from the adjustment means along the heating pathway, and cooling side temperature detecting means that detects that temperature upstream from the adjustment means along the cooling pathway. In this case, the effect of the temperature gradient on the detecting means can be suitably inhibited by prohibiting the supply of fluid from the heating pathway and the cooling pathway.

The above and other objects, features, and advantages of the present invention will be apparent from the following description when taken in conjunction with the accompanying drawings which illustrate preferred embodiments of the present invention by way of example.

BRIEF DESCRIPTION OF DRAWINGS

[FIG. 1] A drawing showing the overall construction of a temperature control device according to a first embodiment.

[FIG. 2] A flowchart showing the process sequence of feedback control according to the same embodiment.

[FIG. 3] A drawing showing a method of setting the manipulating variable of a cooling valve, a bypass valve, and a heating valve according to the same embodiment.

[FIG. 4] A time chart showing the change in temperature of a controlled object. when temperature control is temporarily performed only by feedback control in the same embodiment.

[FIG. 5] A flow chart showing the process sequence for setting a target value in the same embodiment.

[FIG. 6] A flow chart showing the process sequence of open loop control in the same embodiment.

[FIG. 7] A time chart showing the change in temperature of a controlled object. when also using open loop control.

[FIG. 8] A drawing showing the overall construction of a temperature control device according to a second embodiment.

[FIG. 9] A drawing showing a method of setting the manipulating variable of a cooling valve, a bypass valve, and a heating valve according to a third embodiment.

[FIG. 10] A flow chart showing the sequence of an open loop control adjustment support process according to a fourth embodiment.

[FIG. 11] A drawing showing the overall construction of a temperature control device according to a modification of the second embodiment.

[FIG. 12] A drawing showing the construction of a conventional temperature control device.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

First Embodiment

A first embodiment of the temperature control device according to the present invention will be described below with reference to the drawings.

FIG. 1 shows the overall construction of the temperature control device according to the present embodiment.

The illustrated temperature control device is employed in, for example, processes/manufacturing steps in the bioengineering field and the chemical engineering field, bioengineering/chemical experimentation, semiconductor manufacturing processes, manufacturing processes for precision machinery. The temperature control device comprises a temperature adjustment plate 10. The temperature adjustment plate 10 is a plate shaped member that is capable of supporting a controlled object from below by mounting the controlled object on top thereof, and exchanges heat energy with the controlled object. More specifically, a pathway (temperature adjustment unit 11) is provided in the interior of the temperature adjustment plate 10, and has a non-compressible fluid flowing therein that is drawn therein via a confluence unit 12 (preferably a liquid medium (liquid temperature medium) that mediates the exchange of heat energy). The temperature of the temperature adjustment plate 10 is adjusted by the temperature of this fluid. Note that the controlled object is, for example, an experimental chemical substance, a semiconductor wafer, precision machinery.

The fluid that flows in the interior of the temperature adjustment plate 10 flows into a tank 16 via an discharge pathway 14. The tank 16 stores the fluid and there is a gap in the upper portion thereof in which a gas is injected. Thus, even though a change in the volume of the fluid occurs due to a change in temperature, this change will be absorbed due to the gas acting as a compressible fluid. In this way, impedances to the flow of the fluid due to a change in the volume of the fluid will be avoided.

The fluid inside the storage tank 16 is drawn therein by a pump 18, and is discharged to a branching unit 19. Here, the pump 18 is, for example, a diaphragm pump, a vortex pump, a cascade pump. A cooling pathway 20, a bypass pathway 30, and a heating pathway 40 are connected to the branching unit 19.

The cooling pathway 20 cools the fluid that flows therein from the branching unit 19 and flows out from to the confluence unit 12. A cooling unit 22 is provided on the cooling pathway 20 so as to cover a portion thereof. The cooling unit 22 cools the fluid that flows therein from the branching unit 19. More specifically, a pathway is provided in the cooling unit 22 in which fluid cooled to a predetermined temperature (for example, water, oil and refrigerant) flows, and the fluid inside the cooling pathway 20 will be cooled by means of this fluid. The cooling pathway 20 winds between the upstream end and the downstream end of the cooling unit 22, and thereby enlarges the volume inside the cooling pathway 20 inside the cooling unit 22. Note that instead of this winding structure, the volume inside the cooling unit 22 may, for example, be enlarged by enlarging the path dimensions only inside the cooling unit 22.

A cooling valve 24 that continuously adjusts the path dimensions inside the cooling pathway 20 is provided on the downstream side of the cooling pathway 20. A cooling temperature sensor 26 that detects the temperature of the fluid inside the cooling pathway 20 is provided upstream from the cooling valve 24 along the cooling pathway 20, and a cooling flow meter 28 that detects the mass flow rate or the volume flow rate of the fluid inside the cooling pathway 20 is provided downstream from the cooling valve 24.

Note that the path dimensions of the cooling pathway 20 downstream from the cooling unit 22 are preferably substantially uniform.

In contrast, the bypass pathway 30 allows the fluid that flows therein from the branching unit 19 to flow to the temperature adjustment unit 11 as is via the confluence unit 12. A bypass valve 34 that continuously adjusts the path dimensions inside the bypass pathway 30 is provided on the downstream side of the bypass pathway 30. A bypass temperature sensor 36 that detects the temperature of the fluid inside the bypass pathway 30 is provided upstream from the bypass valve 34 along the bypass pathway 30, and a bypass flow meter 38 that detects the mass flow rate or the volume flow rate of the fluid inside the bypass pathway 30 is provided downstream from the bypass valve 34.

The heating pathway 40 heats the fluid that flows therein from the branching unit 19 and flows out from to the confluence unit 12. A heating unit 42 is provided on the heating pathway 40 so as to cover a portion thereof. The heating unit 42 heats the fluid that flows therein from the branching unit 19. More specifically, a pathway is provided in the heating unit 42 in which fluid heated to a predetermined temperature (for example, water, oil, and refrigerant) flows, and the fluid inside the heating pathway 40 will be heated by means of this fluid. The heating pathway 40 winds between the upstream end and the downstream end of the heating unit 42, and thereby enlarges the volume inside the heating pathway 40 inside the heating unit 42. Note that instead of this winding structure, the volume inside the heating unit 42 may, for example, be enlarged by enlarging the path dimensions only inside the heating unit 42.

A heating valve 44 that continuously adjusts the path dimensions inside the heating pathway 40 is provided on the downstream side of the heating pathway 40. A heating temperature sensor 46 that detects the temperature of the fluid inside the heating pathway 40 is provided upstream from the heating valve 44 along the heating pathway 40, and a heating flow meter 48 that detects the mass flow rate or the volume flow rate of the fluid inside the heating pathway 40 is provided downstream from the heating valve 44.

Note that the path dimensions of the heating pathway 40 downstream from the heating unit 42 are preferably substantially uniform.

The cooling pathway 20, the bypass pathway 30, and the heating pathway 40 are connected by the confluence unit 12 positioned downstream thereof. Here, it is preferable that the path dimensions inside the confluence unit 12 and the path dimensions between the confluence unit 12 and the temperature adjustment unit 11 are in a range that does not reduce the flow rate of the fluid, and no larger than the path dimensions of the cooling pathway 20, the bypass pathway 30, and the heating pathway 40. In other words, it is preferable that the flow dimensions of the confluence unit 12, and between the confluence unit 12 and the temperature adjustment unit 11, are, to the greatest degree possible, set such that the flow rate of the fluid that flows out from the cooling valve 24, the bypass valve 34, and the heating valve 44 is not reduced, and such that an accumulation of fluid caused by that volume can be inhibited.

A supply temperature sensor 51 that detects the temperature of the fluid supplied to the temperature adjustment unit 11 is provided between the confluence unit 12 and the temperature adjustment unit 11. In other words, the supply temperature sensor 51 detects the temperature of the fluid inside and/or near the temperature adjustment unit 11.

The control device 50 adjusts the temperature of the fluid inside the temperature adjustment unit 11 by manipulating the cooling valve 24, the bypass valve 34, and the heating valve 44 in response to a desired value of the temperature of the controlled object (desired temperature Tr), and thereby indirectly controls the temperature of the controlled object on the temperature adjustment plate 10. In this case, the control device 50 suitably references the detected values of the cooling temperature sensor 26, the bypass temperature sensor 36, the heating temperature sensor 46, the cooling flow rate meter 28, the bypass flow rate meter 38, the heating flow rate meter 48, the supply temperature sensor 51.

Note that the control device 50 comprises a driver unit for driving the cooling valve 24, the bypass valve 34, and the heating valve 44, and a calculation unit for calculating the manipulating signals that are output by the driver unit based upon the detected values of each detection means. The calculation unit may be constructed with specialized hardware means, or may comprise a microcomputer. Furthermore, the calculation unit may comprise a general purpose personal computer and a program for calculating these signals.

According to the temperature control device, the temperature inside the temperature adjustment unit 11 can be quickly changed in response to a change in desired temperature Tr. In other words, the temperature inside the temperature adjustment unit 11 can be quickly changed to a desired temperature by adjusting the flow rate of the fluid from the cooling pathway 20, the bypass pathway 30, and the heating pathway 40, even when the desired temperature Tr is at any value within a range in which the temperature of the fluid inside the cooling pathway 20 is at or below the desired temperature Tr, and the temperature of the fluid inside the heating pathway 40 is at or above the desired temperature Tr.

Furthermore, by providing the bypass pathway 30, the temperature control device can also reduce energy consumption when maintaining the temperature inside the temperature adjustment unit 11 at a predetermined value. This will be explained below.

For example, assume that the fluid circulating in the temperature adjustment unit 11 is water, the temperature inside the cooling pathway 20 is “10° C.”, the temperature inside the heating pathway 40 is “70° C.”, and the flow rate of the fluid that flows inside the temperature adjustment unit 11 is “20 L/min.”. In addition, assume that the detected value Td of the supply temperature sensor 51 is controlled to “40° C.” so that a steady state is achieved, and the temperature of the fluid discharged from the temperature adjustment unit 11 is raised to “43° C.”. In this case, temperature control can be performed by causing the fluid of the cooling pathway 20 and the bypass pathway 30 to flow into the temperature adjustment unit 11, and not using the fluid inside the heating pathway 40. The energy consumption at this point will be considered.

Assuming that the flow rate of the fluid that flows from the cooling pathway 20 to the temperature adjustment unit 11 is “Wa”, the following formula will be realized.

20(L/min.)×40(° C.)=10(° C.)×Wa+43(° C.)×(20−Wa)

Because of this, Wa≈“1.8 L/min.”

Thus, the energy consumption Qa consumed in the cooling unit 22 is as follows.

$\mathrm{Qc}=\left(43-10\right)\times 1.8\times 60\left(\sec .\right)÷\left(860\text{:}\mathrm{conversion}\mathrm{coefficient}\right).=4.1\mathrm{kw}$

In contrast, with a construction in which the bypass pathway 30 is not provided, the energy consumption Qa of the cooling unit 22 and the energy consumption Qc of the heating unit 42 will be as follows.

Qa=(43−10)×10(L/min.)×60(sec.)÷860≈23 kW

Qc=(70−43)×10(L/min.)×60(sec.)÷860≈19 kW

Thus, the energy consumption Q is “42 kW”, and will be approximately “10” times that when the bypass pathway 30 is provided.

Next, the temperature control performed by the control device 50 according to the present embodiment will be described in detail. FIG. 2 shows the process sequence of feedback control from amongst the processes performed by the control device 50. These processes will be repeatedly executed at, for example, predetermined intervals by the control device 50.

In this series of processes, it will first be determined in Step S10 whether or not it is time for open loop control. In this step, it will be determined whether or not the conditions for executing feedback control have been created. Open loop control will be performed under the conditions described later, and during this time feedback control will not be performed.

In the event that a negative determination occurs in Step S10, the detected value Td of the supply temperature sensor 51 will be acquired in Step S12. Next, in Step S14, a basic manipulating variable MB for feedback controlling the detected value Td to a target value Tt will be calculated. Here, the target value Tt is established based upon the desired temperature Tr, and is assumed to be the desired temperature Tr during feedback control. The basic manipulating variable MB is calculated based upon the degree of deviation of the detected value Td with respect to the target value Tt. More specifically, in the present embodiment, the basic manipulating variable MB will be calculated by means of a PID (Proportional-Integral-Derivative) calculation of the difference Δ between the detected value Td and the target value Tt.

Next, in Step S16, the basic manipulating variable MB will be converted to each manipulating variable (ratio of opening Va, Vb and Vc) of the cooling valve 24, the bypass valve 34, and the heating valve 44. Here, the relationship shown in FIG. 3 will be employed. The ratio of opening Va of the cooling valve 24 will monotonically decrease in accordance with an increase in the basic manipulating variable MB when the basic manipulating variable MB is less than zero, and will be “0” when the basic manipulating variable MB is zero or more. This is a setting for causing the flow rate of the cooling pathway 20 to increase as the detected value Td grows higher than the target value Tt, and for not employing the cooling pathway 20 when the detected value Td is equal to or lower than the target value Tt. In addition, the ratio of valve opening Vc of the heating valve 44 will monotonically increase in accordance with an increase in the basic manipulating variable MB when the basic manipulating variable MB is greater than zero, and will be “0” when the basic manipulating variable MB is zero or less. This is a setting for causing the flow rate of the heating pathway 40 to increase as the detected value Td grows lower than the target value Tt, and for not employing the heating pathway 40 when the detected value Td is equal to or higher than the target value Tt. Furthermore, the ratio of opening of the bypass valve 34 will monotonically decrease in accordance with the basic manipulating variable MB moving away from zero. Note that in FIG. 3, it is preferable that each ratio of valve opening is set such that the total flow rate from the three pathways does not change due to the value of the basic manipulating variable MB.

According to this setting, the manipulating variables of the three valves, i.e., the cooling valve 24, the bypass valve 34, and the heating valve 44, can be set based upon a basic manipulating variable MB calculated by means of a single PID calculation of the difference Δ between the detected value Td and the target value Tt.

When the process of Step S16 in FIG. 2 is complete, the cooling valve 24, the bypass valve 34, and the heating valve 44 will be manipulated in Step S18. Note that in the event that a negative determination occurs in Step S10, or the process of Step S18 is complete, this series of processes will be temporarily complete.

By employing feedback control as described above, the detected value Td can be placed at the target value Tt with a high degree of accuracy. However, in order to increase the responsiveness of the detected value Td to a change in the target value Tt by means of feedback control, a request to increase the gain of the feedback control will occur, but when the gain is increased, the amount of variation in the detected value Td above and below the target value Tt will increase. Thus, with feedback control, there will be a mutual trade-off between an increase in responsiveness with respect to a change in the target value Tt and a reduction in the amount of variation in the detected value Td. Because of this, responsiveness will be sacrificed when the amount of variation is reduced. FIG. 4 shows the detected value Td and the change in temperature of the controlled object with respect to the use of feedback control when changing the target value Tt.

As shown in FIG. 4, a response lag will be created until the detected value Td reaches the target value Tt, and an additional long period of time will be needed until the temperature of the controlled object achieves the target value Tt. This is due to the fact that in order to change the temperature of the controlled object, the temperature of the temperature adjustment unit 11 must be changed, the temperature of the temperature adjustment plate 10 must be changed via the exchange of heat energy between the temperature adjustment plate 10 and the temperature adjustment unit 11, and the exchange of heat energy must occur between the temperature adjustment plate 10 and the controlled object. Because of this, setting the feedback control so as to reduce the amount of variation in the detected value Td will make it difficult for the temperature of the controlled object to quickly achieve the target value Tt by means of feedback control. Accordingly, in the present embodiment, open loop control will be employed in the event that the desired temperature Tr is changed. Furthermore, in this case, the target value Tt will temporarily change more than the change in the desired temperature Tr.

FIG. 5 shows the process sequence for setting the target value Tt during a transition according to the present embodiment. These processes will be repeatedly executed at, for example, predetermined intervals by the control device 50.

In this series of processes, it will first be determined in Step S20 whether or not a bias control flag is on. Here, the bias control flag is a flag that executes bias control for causing a temporary large change in the target value Tt. In the event that the bias control flag is off, the flow will move to Step S22. In Step S22, it will be determined whether or not the absolute value of the amount of change ΔTr in the desired temperature Tr is equal to or greater than a threshold α. Here, the threshold a serves to determine whether or not a state exists in which the temperature of the controlled object cannot quickly achieve a desired change by means of the feedback control shown in FIG. 2. In the event that it is determined that the absolute value of the amount of change ΔTr in the desired temperature Tr is equal to or greater than the threshold α, then in Step S24, the bias control flag will be turned on, and a measurement of the bias control time will begin.

In the event that the process of Step S24 is complete, or when a positive determination occurs in Step S20, then in Step S26 it will be determined whether or not the amount of change ΔTr is larger than zero. This process will determine whether or not a request to increase the temperature has occurred. In the event that it is determined that the amount of change ΔTr is larger than zero, the flow will move to Step S28. In Step S28, the target value Tt will be set to a value that is the temperature of the fluid inside the heating pathway 40 minus a predetermined offset value β. Here, the closer the target value Tt is brought to the temperature inside the heating pathway 40, the quicker the temperature of the controlled object can be increased. However, in the event that the target value Tt is higher than the temperature inside the heating pathway 40, control can no longer be performed. The temperature inside the heating pathway 40 can be varied by circulating the fluid in the heating pathway 40. Because of this, the target value Tt will be set lower by only the offset value β with respect to the temperature inside the heating pathway 40.

In contrast, in the event that it is determined in Step S26 that the amount of change ΔTr is equal to or greater than zero, then in Step S30 the target value Tt will be set to a value equal to the temperature of the fluid inside the cooling pathway 20 plus a predetermined offset value γ. Here, the setting of the offset value γ has the same meaning as the setting of the offset value β.

The setting of the target value Tt by the processes of Steps S28 and S30 will be continued across a bias continuation time Tbi (Step S32). When the bias continuation time Tbi has elapsed, the target value Tt will be assumed to be the desired temperature Td in Step S34. Furthermore, the bias control flag will be turned off and the measurement manipulation for measuring the bias control time will be completed. Note that in the event that the process of Step S34 is complete, or a negative determination occurs in Steps S22 and S32, this series of processes will be temporarily complete.

FIG. 6 shows the sequence of processes for temperature control during a transition according to the present embodiment. This process will be repeatedly executed at, for example, predetermined intervals by the control device 50.

In this series of processes, it will first be determined in Step S40 whether or not an open loop control flag that indicates that open loop control will be performed is on. In the event that the open loop control flag is on, the flow will move to Step S42. In Step S42, it will be determined whether or not the absolute value of the amount of change ΔTr in the target value Tt is equal to or greater than a threshold ε. In the event that it is determined that the absolute value of the amount of change ΔTr in the target value Tt is equal to or greater than the threshold ε, then in Step S44, the open loop control flag that indicates that open loop control will be performed will be turned on, and a measurement manipulation that measures the open loop control time will begin.

In the event that the process of Step S44 is complete, or in the event that a positive determination occurs in Step S40, the flow will move to Step S46. In Step S46, it will be determined whether or not the target value Tt is higher than the temperature Tb of the fluid inside bypass pathway 30 detected by the bypass temperature sensor 36. In this step it will be determined whether the bypass pathway 30 and the heating pathway 40 will be used to perform open loop control, or whether the bypass pathway 30 and the cooling pathway 20 will be used to perform open loop control.

In the event that it is determined that the target temperature Tt is higher than the temperature Tb of the fluid inside the bypass pathway 30, the flow will move to Step S48. In Step S48, the bypass pathway 30 and the heating pathway 40 will be used to perform open loop control. In other words, if the target temperature Tt is higher than the temperature Tb of the fluid inside the bypass pathway 30, the bypass pathway 30 and the heating pathway 40 will be used to perform open loop control because using the cooling pathway 20 will only waste energy. More specifically, the temperature Tc of the heating temperature sensor 46 and the flow rate Fc of the heating flow rate meter 48, and the temperature Tb of the bypass temperature sensor 36 and the flow rate Fb of the bypass flow rate meter 38, will be used to manipulate the heating valve 44 and the bypass valve 34 so that the temperature of the fluid supplied to the temperature adjustment unit 11 will be the target value Tt. In other words, the heating valve 44 and the bypass valve 34 will be manipulated so as to achieve the following formula.

Tt×(Fc+Fb)=Tc×Fc+Tb×Fb

In contrast, in the event that it is determined in Step S46 that the target temperature Tt is equal to or lower than the temperature Tb of the fluid inside the bypass pathway 30, the flow will move to Step S50. In Step S50, the bypass pathway 30 and the cooling pathway 20 will be used to perform open loop control. In other words, if the target temperature Tt is equal to or lower than the temperature Tb of the fluid inside the bypass pathway 30, the bypass pathway 30 and the cooling pathway 20 will be used to perform open loop control because using the heating pathway 40 will only waste energy. More specifically, the temperature Ta of the cooling temperature sensor 26 and the flow rate Fa of the cooling flow rate meter 28, and the temperature Tb of the bypass temperature sensor 36 and the flow rate Fb of the bypass flow rate meter 38, will be used to manipulate the cooling valve 24 and the bypass valve 34 so that the temperature of the fluid supplied to the temperature adjustment unit 11 will be the target value Tt. In other words, the cooling valve 24 and the bypass valve 34 will be manipulated so as to achieve the following formula.

Tt×(Fa+Fb)=Ta×Fa+Tb×Fb

When the processes of Steps S48 and S50 are complete, the flow will move to Step S52. In Step S52, it will be determined whether or not a predetermined time period Top has elapsed. Here, the predetermined time period Top establishes the time period in which open loop control will continue. In the present embodiment, the predetermined time period Top is set to be a longer time period than the bias continuation time period Tbi, in which the target value Tt differs from the desired temperature Tr due to the process shown in FIG. 5, so that feedback control does not proceed within the bias continuation time period Tbi. In the event that it is determined that the predetermined time period Top has elapsed, then in Step S54, the open loop control flag will be turned off, and the measurement manipulation that measures the open loop control time period will be complete.

Note that in the event that the process of Step S54 is complete, or a negative determination occurs in Steps S42 and S52, this series of processes will be temporarily complete.

FIG. 7 shows a temperature control graph that uses the processes of FIG. 6 and FIG. 5. As shown in FIG. 7, the temperature of the controlled object can more quickly achieve the target value Tt than as shown in FIG. 4.

According to the present embodiment described in detail above, the following effects are obtained.

(1) The temperature control device of the present embodiment comprises the heating pathway 40 that heats the fluid and circulates the same in the temperature adjustment unit 11, a cooling pathway 20 that cools the fluid and circulates the same in the temperature adjustment unit 11, a bypass pathway 30 that circulates the fluid in the temperature adjustment unit 11 but does not pass the fluid through the heating pathway 40 and the cooling pathway 20, and a heating valve 44, a cooling valve 24, and a bypass valve 34 that adjust the path dimensions downstream of each of the heating pathway 40, the cooling pathway 20, and the bypass pathway 30. In this way, when the temperature of the controlled object is to be controlled to a desired level, the temperature of the controlled object can quickly achieve the desired level.

(2) The heating pathway 40 and the cooling pathway 20 share the bypass pathway 30. In this way, a shared bypass pathway 30 can be used when fluid is to be supplied from the heating pathway 40 and the bypass pathway 30 to the temperature adjustment unit 11, and when fluid is to be supplied from the cooling pathway 20 and the bypass pathway 30 to the temperature adjustment unit 11. Because of this, compared to situations in which different bypass pathways must be used, the structure of the temperature control device can be simplified.

(3) The temperature control device of the present embodiment further comprises the pump 18 that draws in the fluid of the temperature adjustment unit 11 and discharges the same to the heating pathway 40, the cooling pathway 20, and the bypass pathway 30. By arranging the pump 18 upstream from the heating pathway 40, the cooling pathway 20, and the bypass pathway 30, the length of the fluid pathway between the heating valve 44, the cooling valve 24, and the bypass valve 34 and the temperature adjustment unit 11 can be shortened compared to when arranged downstream from the heating pathway 40, the cooling pathway 20, and the bypass pathway 30 and upstream from the temperature adjustment unit 11. Because of this, the fluid supplied from the heating valve 44, the cooling valve 24, and the bypass valve 34 can be quickly delivered to the temperature adjustment unit 11, and the temperature of the temperature adjustment unit 11 can quickly achieve the desired temperature.

(4) With the temperature control device of the present embodiment, the tank 16 that stores the fluid is provided upstream from the heating pathway 40, the cooling pathway 20, and the bypass pathway 30 and downstream from the temperature adjustment unit 11, and a gas is filled into the upper portion of the tank 16. In this way, changes in the volume of the fluid caused by a change in temperature can be absorbed, and the circulation of the fluid can be suitably maintained regardless of the change in volume of the fluid due to temperature.

(5) The detected value Td is feedback controlled to the target value Tt by means of the supply temperature sensor 51 that detects the temperature of the fluid inside and/or near the temperature adjustment unit 11. In this way, the detected value Td can achieve the target value Tt with a high degree of accuracy.

(6) During feedback control, the basic manipulating variable MB that is based upon the degree of deviation of the detected value Td from the target value Tt was converted manipulating variable of the path dimension (ratio of opening Va, Vb and Vc) of each of the heating pathway 40, the cooling pathway 20, and the bypass pathway 30. In this way, the path dimensions of the three pathways can be adjusted (manipulated) based upon the single basic manipulating variable MB.

(7) Instead of performing feedback control over a predetermined time period after the target value Tt changes, the temperature of the fluid inside and/or near the temperature adjustment unit 11 is open loop controlled based upon the detected value of the bypass temperature sensor 36 that detects the temperature of the bypass pathway 30. In this way, the responsiveness during the change in the target value Tt can be increased, even if the feedback control is set so as to inhibit the amount of variation in the detected value Td above and below the target value Tt.

(8) When the target value Tt is changed, the temperature of the temperature adjustment unit 11 is open loop controlled to the target value Tt by manipulating the path dimensions of the bypass pathway 30 and the cooling pathway 20 when the temperature of the fluid inside the bypass pathway 30 is higher than the target value Tt, and the temperature of the temperature adjustment unit 11 is open loop controlled to the target value Tt by manipulating the path dimensions of the bypass pathway 30 and the heating pathway 40 when the temperature of the fluid inside the bypass pathway 30 is lower than the target value Tt. In this way, energy consumption can be reduced to the greatest degree possible while performing open loop control.

(9) When a requirement relating to the temperature of the temperature adjustment unit 11 is changed, the target value Tt is changed to be larger than the change of the requirement. In this way, the temperature of the temperature adjustment unit 11 and the controlled object can be all the more quickly changed to the desired temperature.

Second Embodiment

A second embodiment will be described below with reference to the drawings that are focused on the points that differ from the first embodiment.

FIG. 8 shows the overall construction of the temperature control device according to the present embodiment. As shown in FIG. 8, in the present embodiment, a effusion pathway 60 that effuses the fluid inside the cooling pathway 20 to the discharge pathway 14 is connected between the cooling temperature sensor 26 and the cooling valve 24 along the cooling pathway 20. In addition, a effusion pathway 62 that effuses the fluid inside the heating pathway 40 to the discharge pathway 14 is connected between the heating temperature sensor 46 and the heating valve 44 along the heating pathway 40.

These effusion pathways 60 and 62 are sufficiently smaller than the path dimensions of either of the cooling pathway 20 and the heating pathway 40. This is in order to allow a minute amount of fluid to be effused from the cooling pathway 20 and the heating pathway 40 to the discharge pathway 14 when the cooling valve 24 and the heating valve 44 are closed.

In other words, when the supply of fluid from the heating pathway 40 and the cooling pathway 20 to the temperature adjustment unit 11 is prohibited, a temperature gradient will be created between the downstream side of the heating valve 44 and the cooling valve 24 and the prohibited pathway. Thus, due to the effects of the temperature gradient on the temperature of the fluid to be supplied to the temperature adjustment unit 11 immediately after the prohibition is eliminated, a longer period of time may be needed for the temperature of the temperature adjustment unit 11 to achieve the desired temperature. In addition, in this case, because the temperatures of the cooling temperature sensor 26 and the heating temperature sensor 46 will be affected by this temperature gradient, they will detect temperatures separated from the temperature near the cooling unit 22 and the temperature near the heating unit 42. Because of this, the ability to control the open loop control when the target value Tt is changed may also decline.

In contrast to this, by providing the effusion pathways 60 and 62 in the present embodiment, temperature gradients upstream from the effusion pathways 60 and 62 can be suitably inhibited when the heating valve 44 and the cooling valve 24 are in the closed state, and the temperature of the temperature adjustment unit 11 can more quickly achieve the desired temperature.

According to the present embodiment described above, the following effect will be obtained in addition to the effects (1) to (9) of the first embodiment.

(10) The effusion pathways 60 and 62 are provided upstream from the heating valve 44 along the heating pathway 40 and upstream from the cooling valve along the cooling pathway. In this way, temperature control when the target value Tt is changed can be more suitably performed.

Third Embodiment

A third embodiment will be described below with reference to the drawings that are focused on the points that differ from the first embodiment.

FIG. 9 shows the relationship between the basic manipulating variable MB according to the present embodiment and the ratio of opening Va, Vb and Vc of the cooling valve 24, the bypass valve 34, and the heating valve 44. As shown in FIG. 9, in the present embodiment, the ratio of opening Va of the cooling valve 24 and the ratio of opening Vc of the heating valve 44 are set so as not to be in a completely closed state. In other words, the ratio of opening Va of the cooling valve 24 will monotonically decrease in accordance with an increase in the basic manipulating variable MB when the basic manipulating variable MB is less than zero, and will be at the minimum ratio (>0) when the basic manipulating variable MB is zero or more. In addition, the ratio of opening Vc of the heating valve 44 will monotonically increase in accordance with an increase in the basic manipulating variable MB when the basic manipulating variable MB is greater than zero, and will be at a minimum ratio (>0) when the basic manipulating variable MB is zero or less.

In this way, without providing the effusion pathways 60 and 62 shown in FIG. 8, when the supply of the fluid from the bypass pathway 30 becomes the main supply route and the temperature control inside the temperature adjustment unit 11 is stable, temperature gradients upstream of the cooling valve 24 and the heating valve 44 can be inhibited.

According to the present embodiment described above, the following effect will be obtained in addition to the effects (1) to (9) of the first embodiment.

(11) The ratio of opening Va of the cooling valve 24 and the ratio of opening Vc of the heating valve 44 are set so as not to be continuously in a completely closed state. In this way, temperature gradients upstream of the cooling valve 24 and the heating valve 44 can be inhibited, and the temperature of the temperature adjustment unit 11 can more quickly achieve the desired temperature.

Fourth Embodiment

A fourth embodiment will be described below with reference to the drawings that are focused on the points that differ from the first embodiment.

In the first embodiment, the temperature of the controlled object was quickly brought to the desired value by performing open loop control of the temperature near the temperature adjustment unit 11 when the target value Tt changes. The optimal value of the control gain of the open loop control, the bias continuation time period Tbi, and the predetermined interval Top in which open loop control continues will depend upon the temperature plate 10 and the controlled object, and can be changed. On the other hand, each time a user changes the controlled object, manually changing these parameters requires a great deal of work in order to adjust them. Accordingly, in the present embodiment, an adjustment support function is installed in the control device 50. FIG. 10 shows the process sequence of the adjustment support according to the present embodiment. This process will be repeatedly executed at, for example, predetermined intervals by the control device 50.

In this series of processes, it will first be determined in Step S70 whether or not there is a mode that performs adjustment of open loop control (test mode). Here, the presence or absence of the test mode may be determined by providing a function in, for example, the manipulating unit of the control device 50, for a user to request the test mode. In the event that it is determined that the test mode is present, then in Step S72, suggested bias continuation time periods Tbi will be displayed to the user on a viewable display means. Here, the suggested bias continuation time periods Tbi are preset in a range of suitable values for the presumed controlled object.

Next, in Step S74, it will be determined whether or not the input of a bias continuation time period Tbi has occurred. In this step it will be determined whether or not the user has selected one of the suggested bias continuation time periods Tbi. In the event that it is determined that the user has selected a specific suggestion (Step S74: YES), then in Step S76, the selected suggestion will be used to begin temperature control. If the temperature control is complete, then in Step S78, the viewer will be notified via the viewable display means whether or not the bias continuation time period Tbi has been set. In the event that a declaration of intent is input from the user indicating that it will not be set (Step S80: NO), the processes of Steps S72-S78 will be repeated.

In contrast, in the event that a command is input indicating that one of the suggestions has been selected by the user and that the bias continuation time Tbi has been set (Step S80: YES), the bias continuation time period Tbi will be stored in Step S82. Note that in the event that the process of Step S82 is complete, or a negative determination occurs in Steps S70, this series of processes will be temporarily complete.

According to the present embodiment described above, the following effect will be obtained in addition to the effects (1) to (9) of the first embodiment.

(12) An open loop control adjustment support function was provided that prompts a user to select any one of a plurality of selections relating to the bias continuation time period Tbi, and performs temperature control in accordance with the selected value. In this way, the burden on a user of the temperature control device when adjusting open loop control in accordance with the controlled object can be reduced.

Other Embodiments

Note that each of the aforementioned embodiments can be modified as follows.

• • The changes from the first embodiment applied to the fourth embodiment may also be applied to the second and third embodiments.
  • In the fourth embodiment, the adjustment parameter used when performing adjustment support of open loop control was the bias continuation time period Tbi, but the present invention is not limited thereto. For example, the continuation time period of open loop control (predetermined interval Top) may be the adjustment parameter. In addition, the setting of the target value in the bias control shown in FIG. 5 (offset values β, γ) may, for example, be the adjustment parameter. Furthermore, a plurality of these parameters may be the adjustment parameters.
  • In the fourth embodiment, the user was supported so as to be able to select a suitable parameter in accordance with the controlled object, but the present invention is not limited thereto. For example, a process may be performed such that when initializing each of the parameters arbitrarily, i.e., the bias continuation time period Tbi, the predetermined interval Top, and the offset values β, γ, in order to perform temperature control, the temperature of the controlled object (or the temperature of the temperature adjustment plate 10) will be monitored, and in the event that the time lag needed to bring the temperature to the target value is not within an allowable range, at least one of the parameters will be automatically changed. In this way, the burden on the user can be lightened because the open loop control can be automatically adjusted so that the time lag needed to bring the temperature to the target value will be within an allowable range.
  • The method in which the basic manipulating variable MB is converted to the manipulating variables of the cooling valve 24, the bypass valve 34, and the heating valve 44 is not limited to that shown in FIGS. 3 and 9. In FIGS. 3 and 9, any two of the manipulating variables of the cooling valve 24, bypass valve 34 and the heating valve 44 are changed in response to a change in the temperature difference Δ between target value Tt and detected value Td. However, the present invention is not limited thereto, and for example, all the manipulating variables may be changed. In addition, in FIGS. 3 and 9, each of the manipulating variables of the cooling valve 24, the bypass valve 34, and the heating valve 44 are a zero order function or a first order function of the temperature difference Δ, but the present invention is not limited thereto.
  • In the third embodiment, the cooling valve 24 and the heating valve 44 are prohibited from being placed in the closed state regardless of the value of the basic manipulating variable MB, however the present invention is not limited thereto. The cooling valve 24 and the heating valve 44 may be prohibited from being placed in the closed state only when the basic manipulating variable MB is near zero. In other words, because it is assumed that the detected value Td tracks the target value Tt and the detected value Td is in the steady state prior to the change of the desired temperature Tr. Only in this situation, the cooling valve 24 and the heating valve 44 may be prohibited from being placed in the fully closed state only when the basic manipulating variable MB is near zero so as to provide for a change in the target value Tt. Note that in this case, it is preferable that the amount of change in the manipulating variable of the cooling valve 24 be larger than the amount of change in the manipulating variable of the heating valve 44 when the basic manipulating variable MB is smaller than zero, and the amount of change in the manipulating variable of the heating valve 44 be smaller than the amount of change in the manipulating variable of the cooling valve 24 when the basic manipulating variable MB is larger than zero.
  • The effusion pathways 60 and 62 are not limited to those illustrated in the second embodiment (FIG. 8). For example, as shown in FIG. 11, the temperature control device may comprise a effusion pathway 60 that bypasses the cooling valve 24 and is connected to the upstream and downstream sides of the cooling valve 24 along the cooling pathway 20, and a effusion pathway 62 that bypasses the heating valve 44 and is connected to the upstream and downstream sides of the heating valve 44 along the heating pathway 20. Note that here as well, it is preferable that the effusion pathways 60 is downstream from the cooling temperature meter 26 and the effusion pathways 62 is downstream from the heating temperature meter 46.
  • In each of the aforementioned embodiments, the predetermined interval Top and the bias continuation time period Tbi in which open loop control will continue may be set independently, but they may be corresponding with each other.
  • Feedback control is not limited to PID control. For example, PI control or I control is also possible. Here, for example, as with each of the aforementioned embodiments, in a construction that performs open loop control during a transition in which the target value is changed, the goal of feedback control is matching the detected value Td with the target value Tt with a high degree of accuracy during normal times, and reducing variation in the detected value Td as much as possible. Because of this, performing feedback control on the detected value Td in order to achieve the target value Tt based upon the cumulative value of amounts indicating the degree of deviation between the detected value Td and the target value Tt as integral control is particularly effective.
  • Open loop control is not limited to that illustrated in the aforementioned embodiments. For example, when the temperature of the fluid inside the bypass pathway 30 is higher than the target value Tt, the ratio of opening of the cooling valve 24 and the bypass valve 30 will be set with reference to the ratio shown in FIG. 3, and when the temperature of the fluid inside the bypass pathway 30 is lower than the target value Tt, the ratio of opening of the heating valve 44 and the bypass valve 30 will be set with reference to the ratio shown in FIG. 3. Here, open loop control can be performed by calculating the opening ratio of two valves so that the target value Tt can be achieved in response to the temperature of the fluid inside the pathway being used. According to this method in particular, the use of a flow meter can be avoided. Because a flow meter is immersed in fluid, it is difficult to expect it to be reliable over a long period of use across the entire temperature range between the temperature of the fluid inside the heating pathway 40 and the temperature of the fluid inside the cooling pathway 20, and thus it is preferable to simply perform open loop control instead of using a flow meter. Note that when, for example, the temperature of the fluid inside the bypass pathway 30 is higher than the target value Tt, the ratios of opening of the cooling valve 24 and the bypass valve 30 may be set in accordance with the ratio between the difference of the fluid temperature inside the cooling pathway 20 with respect to the target value Tt, and the difference of the target value Tt with respect to the fluid temperature inside the bypass pathway 30, without using the opening ratio shown in FIG. 3. Likewise, when the temperature of the fluid inside the bypass pathway 30 is lower than the target temperature Tt, the ratios of opening of the heating valve 44 and the bypass valve 30 may be set in accordance with the ratio between the difference of the fluid temperature inside the bypass pathway 30 with respect to the target value Tt, and the difference of the target value Tt with respect to the fluid temperature inside the heating pathway 40.
  • Without limiting the use of feedback control, only the open loop control illustrated in Steps S48 and S50 of FIG. 6 may be performed. In addition, regardless of the presence or absence of a change in the target value, the final basic manipulating variable MB may be calculated by revising the basic manipulating variable determined by the open loop control illustrated in S48 and S50 with feedback control. In addition, conversely, regardless of the presence or absence of a change in the target value, only feedback control may be performed. Even in this case, when the desired temperature Td is changed, the aforementioned bias control is effective to cause a larger change in the target value Tt than the desired temperature Td With feedback control, there is a mutual trade-off between reducing the response lag and reducing variations in the detected value Td with respect to the target value Tt. However, because the response lag can be reduced regardless of feedback control gain by performing bias control, the variations can be reduced while reducing the response lag.
  • The feedback control is not limited to being performed by converting the desired amount of feedback control (the basic manipulating variable MB) to the manipulating variables of the cooling valve 24, the bypass valve 34, and the heating valve 44. For example, the manipulating variables of the cooling valve 24, the bypass valve 34, and the heating valve 44 may each be independently set based upon the degree of deviation between the target value Tt and the detected value Td. However, even in this case, it is preferable that only the manipulating variables of the bypass valve 34 and the cooling valve 24 be targeted for change when the target value Tt is higher than the detected value Td, and only the manipulating variables of the bypass valve 34 and the heating valve 44 be targeted for change when the target value Tt is lower than the detected value Td.
  • A storage means having a function that absorbs a change in the volume of the fluid due to temperature is not limited to that illustrated in each of the aforementioned embodiments, in which the entire tank 16 is not filled with fluid, and has a space filled with a gas. For example, a construction is possible in which the tank 16 is filled with fluid and has no gap, and the volume of the tank 16 is changed in response to a force applied by the fluid to the inner wall of the tank 16.
  • In each of the aforementioned embodiments, the adjustment means that adjust the flow ratio of the fluid supplied from the cooling pathway 20, the bypass pathway 30, and the heating pathway 40 to the temperature adjustment plate 10 employed the cooling valve 24, the bypass valve 34, and the heating valve 44. However, the present invention is not limited thereto. For example, it is possible to provide a plurality of each of these pathways, provide a valve on each of these that manipulates by fully opening and fully closing, and set the number of pathways that supply fluid to the temperature adjustment plate 10 as the manipulating variable. Furthermore, a plurality of pathways may be prepared, and manipulations may be performed to connect each of the pathways to anywhere downstream of the cooling unit 22, the heating unit 42, and the pump 18. In addition, a pump may be provided on each of the cooling pathway 20, the bypass pathway 30, and the heating pathway 40, and the flow ratio may be adjusted by individually manipulating the discharge capabilities thereof.
  • Moreover, the temperature adjustment plate 10 is not limited to a thin rectangular plate member, and may be a thin cylindrical plate member. Furthermore, the temperature adjustment unit 11 is not limited to be provided in an internal plate member capable of supporting a controlled object from directly below, and may for example directly contact a plurality of side surfaces of the controlled object to control the temperature thereof.

Claims

1. A temperature control device that controls the temperature of a controlled object by circulating a fluid in a temperature adjustment unit arranged near the controlled object, comprising:

a heating pathway that heats and circulates the fluid in the temperature adjustment unit,

a cooling pathway that cools and circulates the fluid in the temperature adjustment unit,

a bypass pathway that does not pass the fluid through the heating pathway and cooling pathway, but circulates the fluid in the temperature adjustment unit, and

adjustment means that adjust a flow ratio of the fluid that is supplied from the heating pathway, cooling pathway, and bypass pathway to the temperature adjustment unit via a confluence unit that combines these flows,

wherein the adjustment means are provided on a downstream side of each of the heating pathway, the cooling pathway, and the bypass pathway and on the upstream side of the confluence unit.

2-18. (canceled)

19. The temperature control device according to claim 1, wherein the bypass pathway is shared between the heating pathway and the cooling pathway.

20. The temperature control device according to claim 1, wherein an effusion pathway that diverts the fluid from the adjustment means and effuses the fluid is provided on the upstream side of the heating pathway and the cooling pathway.

21. The temperature control device according to claim 1, further comprising a pump that draws in the fluid downstream from the temperature adjustment unit, and discharges the fluid to the heating pathway, the cooling pathway, and the bypass pathway.

22. The temperature control device according to claim 1, wherein a storage means that stores the fluid is provided on the upstream side of each of the heating pathway, the cooling pathway, and the bypass pathway, and on the downstream side of the temperature adjustment unit, and

the storage means absorbs a change in the volume of the fluid due to a change in temperature.

23. The temperature control device according to claim 1, further comprising a manipulating means that manipulates the adjustment means so as to control the temperature of the fluid inside and/or near the temperature adjustment unit to a target value.

24. The temperature control device according to claim 23, further comprising a supply temperature detection means that detects the temperature of the fluid inside and/or near the temperature adjustment unit, and the manipulating means feedback controls the value detected by the supply temperature detection means to the target value.

25. The temperature control device according to claim 24, wherein the adjustment means adjusts the downstream side flow dimensions of each of the heating pathway, the cooling pathway, and the bypass pathway, and

the manipulating means comprises a conversion means that converts an amount based upon a degree of deviation from the target value of the detected value to manipulating variable of the flow ratio of each of the heating pathway, the cooling pathway, and the bypass pathway.

26. The temperature control device according to claim 24, further comprising a bypass temperature detecting means that detects the temperature of the bypass pathway,

wherein instead of performing feedback control, for a predetermined period of time after a change in the target value, the manipulating means manipulates the adjustment means so as to perform open loop control of the temperature of the fluid inside and/or near the temperature adjustment unit based upon the value detected by the bypass temperature detecting means.

27. The temperature control device according to claim 26, wherein the adjustment means adjusts the downstream side flow dimensions of each of the heating pathway, the cooling pathway, and the bypass pathway, and

for the predetermined period, the manipulating means open loop controls the temperature of the temperature adjustment unit to the target value by manipulating the adjustment means so as to adjust the flow ratio of the bypass pathway and the cooling pathway if the temperature of the fluid inside the bypass pathway is higher than the target value, and open loop controls the temperature of the temperature adjustment unit to the target value by manipulating the adjustment means so as to adjust the flow ratio of the bypass pathway and the heating pathway if the temperature of the fluid inside the bypass pathway is lower than the target value.

28. The temperature control device according to claim 23, further comprising a transient target value setting means that changes the target value, when a desired temperature of the temperature adjustment unit is changed, so as to be larger than the change of the desired value.

29. The temperature control device according to claim 26, further comprising an open loop control adjustment support means that outputs prompt signals to select any one of a plurality of selections relating to at least one of open loop control gain, the period of time that open loop control is to continue, and the target value during open loop control, and performs temperature control in accordance with the selected value.

30. The temperature control device according to claim 23, wherein the adjustment means adjusts the downstream side flow dimensions of each of the heating pathway, the cooling pathway, and the bypass pathway, and

the manipulating means prevents the flow ratio of the heating pathway and the cooling pathway that are adjusted by the adjustment means from reaching zero when the temperature inside and/or near the temperature adjustment unit is in a steady state.

31. A temperature control device that controls the temperature of a controlled object by circulating a fluid in a temperature adjustment unit arranged near the controlled object, comprising:

a heating pathway that heats and circulates the fluid in the temperature adjustment unit,

a cooling pathway that cools and circulates the fluid in the temperature adjustment unit,

a bypass pathway that does not pass the fluid through the heating pathway and cooling pathway, but circulates the fluid in the temperature adjustment unit, and

adjustment means that adjust the downstream side flow dimensions of each of the heating pathway, cooling pathway, and bypass pathway.

32. The temperature control device according to claim 31, further comprising a manipulating means that manipulates the adjustment means so as to control the temperature of the fluid inside and/or near the temperature adjustment unit to a target value, and a supply temperature detection means that detects the temperature of the fluid inside and/or near the temperature adjustment unit,

wherein the manipulating means feedback controls the value detected by the supply temperature detection means to the target value.

33. The temperature control device according to claim 31, further comprising a manipulating means that manipulates the adjustment means so as to control the temperature of the fluid inside and/or near the temperature adjustment unit to a target value,

wherein the manipulating means comprises a conversion means that converts an amount based upon a degree of deviation from the target value of the detected value to manipulating variable of a path dimension for each of the heating pathway, the cooling pathway, and the bypass pathway.

34. The temperature control device according to claim 31, further comprising a manipulating means that manipulates the adjustment means so as to control the temperature of the fluid inside and/or near the temperature adjustment unit to a target value,

wherein for the predetermined period, the manipulating means open loop controls the temperature of the temperature adjustment unit to the target value by manipulating the adjustment means so as to adjust the path dimensions of the bypass pathway and the cooling pathway if the temperature of the fluid inside the bypass pathway is higher than the target value, and open loop controls the temperature of the temperature adjustment unit to the target value by manipulating the adjustment means so as to adjust the path dimensions of the bypass pathway and the heating pathway if the temperature of the fluid inside the bypass pathway is lower than the target value.

35. The temperature control device according to claim 31, further comprising a manipulating means that manipulates the adjustment means so as to control the temperature of the fluid inside and/or near the temperature adjustment unit to a target value,

wherein the manipulating means prevents the path dimensions of the heating pathway and the cooling pathway that are adjusted by the adjustment means from reaching zero when the temperature inside and/or near the temperature adjustment unit is in a steady state.