Patents by Inventor Ryo Wakabayashi

Ryo Wakabayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154597
    Abstract: An acoustic resonator is provided that includes a substrate; a piezoelectric layer having a portion that forms a diaphragm over a cavity; and IDT on the piezoelectric layer that includes a first conductor level including first and second busbars disposed on respective portions of the piezoelectric layer, a first set of elongated fingers extending from the first bus bar onto the diaphragm, and a second set of elongated fingers extending from the second bus bar onto the diaphragm, the second set of elongated fingers interleaved with the first set of elongated fingers. The acoustic resonator also includes a second conductor level over the piezoelectric layer and covering at least portions of the first and second busbars.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 9, 2024
    Inventors: Greg DYER, Bryant GARCIA, Doug JACHOWSKI, Robert HAMMOND, Neal FENZI, Ryo WAKABAYASHI
  • Patent number: 11967943
    Abstract: An acoustic resonator is fabricated by forming a patterned first photoresist mask on a piezoelectric plate at locations of a desired interdigital transducer (IDT) pattern. An etch-stop layer is then deposited on the plate and first photoresist mask. The first photoresist mask is removed to remove parts of the etch-stop and expose the plate. An IDT conductor material is deposited on the etch stop and the exposed plate. A patterned second photoresist mask is then formed on the conductor material at locations of the IDT pattern. The conductor material is then etched over and to the etch-stop to form the IDT pattern which has interleaved fingers on a diaphragm to span a substrate cavity. A portion of the plate and the etch-stop form the diaphragm. The etch-stop and photoresist mask are impervious to this etch. The second photoresist mask is removed to leave the IDT pattern.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: April 23, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Patrick Turner, Ryo Wakabayashi
  • Publication number: 20240128932
    Abstract: A power amplifier circuit includes external input and output terminals; a first power amplifier with first input and output terminals, the first input terminal being connected to the external input terminal, the first output terminal being connected to the external output terminal; a second power amplifier having second input and output terminals, the second input terminal being connected to the external input terminal, the second output terminal being connected to the external output terminal; a power supply terminal that receives a power supply voltage that is supplied to the first power amplifier and controllably supplied to the second power amplifier; and a switch having first and second terminals, the first terminal being connected to the power supply terminal, the second terminal being connected to the second power amplifier.
    Type: Application
    Filed: December 26, 2023
    Publication date: April 18, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kenji TAHARA, Yoshiaki SUKEMORI, Kae YAMAMOTO, Ryo WAKABAYASHI
  • Publication number: 20240128936
    Abstract: A power amplifier circuit includes an amplifier transistor having a collector terminal, an emitter terminal, and a base terminal, bias circuits, and a current limiter circuit. The bias circuit includes a constant current amplifier transistor that supplies direct-current bias current from an emitter terminal to the base terminal. The current limiter circuit includes a current limiting transistor an emitter terminal of which is connected to the bias circuit, a resistive element connected between the current limiting transistor and a power supply terminal, and a resistive element connected between the current limiting transistor and the constant current amplifier transistor. The bias circuit includes a constant current amplifier transistor that supplies direct-current bias current i3 from an emitter terminal to the base terminal.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 18, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kenji TAHARA, Ryo WAKABAYASHI, Kae YAMAMOTO
  • Patent number: 11954804
    Abstract: Provided is an information processing device that enables a virtual object to be displayed at an appropriate position in the real world. The information processing device includes a position estimation unit that estimates a current position in a first coordinate system, a display position setting unit that sets a display position of a virtual object in a third coordinate system on the basis of an environment database, virtual object information including the display position of the virtual object in a second coordinate system, and an observed image captured near the current position, a meta information generation unit that generates observation meta information, and an environment database management unit that compares observation data with environment data of the environment database to determine whether to add the observation data to the environment database.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: April 9, 2024
    Assignee: SONY CORPORATION
    Inventors: Hajime Wakabayashi, Kuniaki Torii, Ryo Watanabe
  • Publication number: 20240097626
    Abstract: A radio frequency circuit includes a carrier amplifier, a peak amplifier, a transformer, and an impedance converting circuit. One end of an input coil is connected to an output of the carrier amplifier, one end of an output coil is connected to an output terminal. The impedance converting circuit includes main and auxiliary lines. One end of the main line is connected to an output of the peak amplifier, and the other end of the main line is connected to the other end of the input coil. One end of the auxiliary line is connected to the one end of the main line, and the other end of the auxiliary line is connected to ground. A first direction from the one end to the other end of the main line, and a second direction from the other end to the one end of the auxiliary line (302) are the same.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kenji TAHARA, Ryo WAKABAYASHI, Kae YAMAMOTO, Yoshiaki SUKEMORI
  • Publication number: 20240097629
    Abstract: A radio-frequency module includes a module substrate, a carrier amplifier and a peak amplifier, a transformer, and a phase adjustment circuit. The carrier amplifier and the peak amplifier are included in a semiconductor IC. One end of an input-side coil is connected to an output terminal of the carrier amplifier. One end of the output-side coil is connected to a signal output terminal.
    Type: Application
    Filed: November 15, 2023
    Publication date: March 21, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kenji TAHARA, Yoshiaki SUKEMORI, Kae YAMAMOTO, Ryo WAKABAYASHI
  • Publication number: 20240088841
    Abstract: A radio frequency circuit includes carrier amplifiers and peak amplifiers, transformers, a signal output terminal connected to a first end of an output-side coil, an LC series circuit, and a capacitor. An input-side coil is connected, at its first end, to the carrier amplifier, and is connected, at its second end, to the carrier amplifier. An input-side coil is connected, at its first end, to the peak amplifier, and is connected, at its second end, to the peak amplifier. The LC series circuit is connected between the peak amplifier and the ground. The capacitor is connected to a second end of the output-side coil and a first end of an output-side coil. The output-side coil is connected, at its second end, to the ground.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 14, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kenji TAHARA, Yoshiaki SUKEMORI, Kae YAMAMOTO, Ryo WAKABAYASHI, Isao TAKENAKA
  • Patent number: 11909374
    Abstract: Acoustic resonators are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate. The IDT includes: a first busbar and a second busbar disposed on respective portions of the piezoelectric plate other than the diaphragm; a first set of elongate fingers extending from the first bus bar onto the diaphragm; and a second set of elongate fingers extending from the second bus bar onto the diaphragm, the second set of elongate fingers interleaved with the first set of elongate fingers.
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: February 20, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Greg Dyer, Bryant Garcia, Doug Jachowski, Robert Hammond, Neal Fenzi, Ryo Wakabayashi
  • Publication number: 20240052203
    Abstract: The present invention is to provide a means for reducing surface roughness (Ra) while maintaining a high polishing rate in polishing of an object to be polished containing a resin and a filler. A polishing composition of the present invention comprises alumina particles, colloidal silica particles, and a dispersing medium for use in polishing an object to be polished containing a resin and a filler, in which the alumina particles have an average particle size of less than 2.8 ?m, and the colloidal silica particles have an average particle size less than the average particle size of the alumina particles.
    Type: Application
    Filed: November 10, 2021
    Publication date: February 15, 2024
    Applicant: FUJIMI INCORPORATED
    Inventor: RYO WAKABAYASHI
  • Patent number: 11888460
    Abstract: Acoustic resonators and filter devices. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A conductor pattern formed is formed on the front surface of the piezoelectric plate, including an interdigital transducer (IDT) with interleaved fingers of the IDT on the diaphragm. The substrate and the piezoelectric plate are the same material.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: January 30, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Neal Fenzi, Robert Hammond, Patrick Turner, Bryant Garcia, Ryo Wakabayashi
  • Publication number: 20240002697
    Abstract: The present invention is to provide a means for reducing residual abrasive grains on a surface of an object to be polished after polishing. The polishing composition of the present invention comprises abrasive grains and a dispersing medium, wherein the abrasive grains are silica particles having an average particle size (D50) of more than 1.0 ?m and a circularity of primary particles of 0.90 or more.
    Type: Application
    Filed: January 26, 2022
    Publication date: January 4, 2024
    Applicant: FUJIMI INCORPORATED
    Inventor: Ryo Wakabayashi
  • Publication number: 20230378759
    Abstract: An object of the invention is to provide a control technique capable of connecting a storage battery to a DC bus via a DC/DC converter and controlling charging and discharging of the storage battery by the DC/DC converter. A DC grid system according to the invention calculates a voltage command value of a DC bus using a present voltage of a storage battery and a target voltage of the storage battery, and provides the voltage command value as a command value for each of an AC/DC converter and a DC/DC converter (see FIG. 1).
    Type: Application
    Filed: October 6, 2021
    Publication date: November 23, 2023
    Inventors: Ryo WAKABAYASHI, Toru KOUNO, Satoru AKIYAMA, Emha Bayu MIFTAHULLATIF, Katsutoshi KONDO
  • Patent number: 11817845
    Abstract: Methods of making acoustic resonators and filter devices. A method includes attaching a piezoelectric plate to a substrate, and forming a conductor pattern including an interdigital transducer (IDT) on a portion of the piezoelectric plate that forms a diaphragm spanning a cavity such that interleaved fingers of the IDT are on the diaphragm. The substrate and the piezoelectric plate are the same material.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: November 14, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Neal Fenzi, Robert Hammond, Patrick Turner, Bryant Garcia, Ryo Wakabayashi
  • Patent number: 11811391
    Abstract: An acoustic resonator is fabricated by forming a patterned first photoresist mask on a piezoelectric plate at locations of a desired interdigital transducer (IDT) pattern. An etch-stop layer is then deposited on the plate and first photoresist mask. The first photoresist mask is removed to remove parts of the etch-stop and expose the plate. An IDT conductor material is deposited on the etch stop and the exposed plate. A patterned second photoresist mask is then formed on the conductor material at locations of the IDT pattern. The conductor material is then etched over and to the etch-stop to form the IDT pattern which has interleaved fingers on a diaphragm to span a substrate cavity. A portion of the plate and the etch-stop form the diaphragm. The etch-stop and photoresist mask are impervious to this etch. The second photoresist mask is removed to leave the IDT pattern.
    Type: Grant
    Filed: November 7, 2020
    Date of Patent: November 7, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Patrick Turner, Ryo Wakabayashi
  • Publication number: 20230344460
    Abstract: A high-frequency module is capable of two-uplink of a transmission signal in Band A and transmission of Band C, and includes a module substrate, a metal shield plate arranged on a principal surface, power amplifiers, a transmission filter of Band A, and a transmission filter of Band C. In a plan view, the metal shield plate is arranged between a first transmission component and a second transmission component. The first transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a first inductor and a first capacitor arranged in a first transmission path, and the second transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a second inductor and a second capacitor arranged in a second transmission path.
    Type: Application
    Filed: June 28, 2023
    Publication date: October 26, 2023
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Masanari MIURA, Kiyoshi AIKAWA, Hiroyuki NAGAMORI, Takanori UEJIMA, Yuji TAKEMATSU, Takahiro YAMASHITA, Ryo WAKABAYASHI, Yoshihiro YOSHIMURA, Takashi HIROSE
  • Publication number: 20230298959
    Abstract: A possible benefit of the present disclosure is to further improve a heat dissipation property of an electronic component. A high-frequency module includes a mounting substrate, a filter (for example, a transmission filter), a resin layer, a shielding layer, and a metal member. The resin layer covers at least a portion of an outer peripheral surface (for example, an outer peripheral surface) of the filter. The shielding layer covers at least a portion of the resin layer. The metal member is disposed at a first principal surface of the mounting substrate. The metal member is connected to a surface of the filter on the opposite side from the mounting substrate, the shielding layer, and the first principal surface of the mounting substrate.
    Type: Application
    Filed: May 26, 2023
    Publication date: September 21, 2023
    Inventors: Hiroyuki KANI, Yoshihiro YOSHIMURA, Takahiro YAMASHITA, Ryo WAKABAYASHI, Takashi HIROSE, Kiyoshi AIKAWA
  • Patent number: 11632096
    Abstract: Acoustic resonator devices are disclosed. An acoustic resonator device includes a plurality of cells electrically connected in parallel. Each cell includes an interdigital transducer (IDT) on a piezoelectric plate, the IDT having at least 15 and not more than 35 interleaved fingers.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: April 18, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Neal Fenzi, Ryo Wakabayashi, Bryant Garcia, Greg Dyer
  • Publication number: 20230006632
    Abstract: Acoustic resonators and filter devices. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A conductor pattern formed is formed on the front surface of the piezoelectric plate, including an interdigital transducer (IDT) with interleaved fingers of the IDT on the diaphragm. The substrate and the piezoelectric plate are the same material.
    Type: Application
    Filed: August 30, 2022
    Publication date: January 5, 2023
    Inventors: Neal Fenzi, Robert Hammond, Patrick Turner, Bryant Garcia, Ryo Wakabayashi
  • Publication number: 20230006633
    Abstract: Acoustic resonators are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate. The IDT includes: a first busbar and a second busbar disposed on respective portions of the piezoelectric plate other than the diaphragm; a first set of elongate fingers extending from the first bus bar onto the diaphragm; and a second set of elongate fingers extending from the second bus bar onto the diaphragm, the second set of elongate fingers interleaved with the first set of elongate fingers.
    Type: Application
    Filed: September 1, 2022
    Publication date: January 5, 2023
    Inventors: Greg Dyer, Bryant Garcia, Doug Jachowski, Robert Hammond, Neal Fenzi, Ryo Wakabayashi