Abstract: In a voltage converter which is disposed in a semiconductor integrated circuit so as to lower an external supply voltage and to feed the lowered voltage to a partial circuit of the integrated circuit; the voltage converter is constructed so as to produce an output voltage suited to an ordinary operation in the ordinary operation state of the semiconductor integrated circuit and an aging voltage in the aging test of the circuit.

Abstract: A semiconductor memory device is provided which includes a substrate arrangement which is suitable for forming a large number of types of DRAMs having different package specifications, different bit structure and different operating modes. In conjunction with this, the bonding pads are arranged at optimum locations for accommodating the different package types. Various layout arrangements are also provided to minimize space and to improve access time. Additional features are provided, including improved output buffer circuitry, protection circuitry and testing methods to facilitate operation of the semiconductor memory device.

Abstract: In a voltage converter provided in a semiconductor memory and supplying an internal supply voltage to a circuit in the semiconductor memory, a circuit is provided for generating a first voltage whose dependency on an external supply voltage is regulated to a predetermined small value, while another circuit is provided for generating a second voltage whose dependency on the external supplying voltage is larger than the dependency of the first voltage. The voltage converter includes MOS transistors and differential amplifiers interconnected with one another, as well as voltage dividing means. The memory also includes a word line booster for boosting the internal supply voltage.

Abstract: A semiconductor integrated circuit comprises a semiconductor chip, a power supply terminal provided on the semiconductor chip for receiving a voltage from an external power supply source, an internal circuit provided on the semiconductor chip, a power supply circuit provided on the semiconductor chip for transforming an external power supply voltage received from the power supply terminal for supplying a source voltage resulting from the voltage transformation to the internal circuit, and a control circuit provided on the semiconductor chip for controlling the power supply circuit, wherein the control circuit includes external power supply voltage detecting means and/or temperature detecting means and responds to the signal from the external power supply voltage detecting means and/or the temperature detecting means by changing the power supply voltage to the internal circuit to thereby maintain the operating speed of the internal circuit to be constant.

Abstract: Disclosed is a semiconductor device, such as a semiconductor memory device, having structure wherein invasion of minority carriers from the semiconductor substrate into components of the device, formed on the substrate, can be avoided. The semiconductor memory device can be an SRAM or DRAM, for example, and includes a memory array and peripheral circuit on a substrate. In one aspect of the present invention, a buried layer of the same conductivity type as that of the substrate, but with a higher impurity concentration than that of the substrate, is provided beneath at least one of the peripheral circuit and memory array. A further region can extend from the buried layer, for example, to the surface of the semiconductor substrate, the buried layer and further region in combination acting as a shield to prevent minority carriers from penetrating to the device elements.

Abstract: A semiconductor integrated circuit comprises a semiconductor chip, a power supply terminal provided on the semiconductor chip for receiving a voltage from an external power supply source, an internal circuit provided on the semiconductor chip, a power supply circuit provided on the semiconductor chip for transforming an external power supply voltage received from the power supply terminal for supplying a source voltage resulting from the voltage transformation to the internal circuit, and a control circuit provided on the semiconductor chip for controlling the power supply circuit, wherein the control circuit includes external power supply voltage detecting means and/or temperature detecting means and responds to the signal from the external power supply voltage detecting means and/or the temperature detecting means by changing the power supply voltage to the internal circuit to thereby maintain the operating speed of the internal circuit to be constant.

Abstract: Disclosed is a semiconductor device, such as a semiconductor memory device, having structure wherein invasion of minority carriers from the semiconductor substrate into components of the device, formed on the substrate, can be avoided. The semiconductor memory device can be an SRAM or DRAM, for example, and includes a memory array and peripheral circuit on a substrate. In one aspect of the present invention, a buried layer of the same conductivity type as that of the substrate, but with a higher impurity concentration than that of the substrate, is provided beneath at least one of the peripheral circuit and memory array. A further region can extend from the buried layer, for example, to the surface of the semiconductor substrate, the buried layer and further region in combination acting as a shield to prevent minority carriers from penetrating to the device elements.

Abstract: In a voltage converter provided in a semiconductor device and supplying an internal supply voltage to a circuit in the semiconductor device, a circuit is provided for generating a first voltage whose dependency on an external supply voltage is regulated to a predetermined small value, while another circuit is provided for generating a second voltage whose dependency on the external supplying voltage is larger than the dependency of the first voltage. Another circuit selects the first voltage when the semiconductor device is in a state of a standard operation and selects the second voltage when the device is in another state of operation, such as testing or aging. The selected voltage may be converted by a differential amplifier which is constituted by a load of P-channel MOS transistors and a source-coupled pair of N-channel MOS transistors. An output of the differential amplifier is fed back through a directly coupled voltage lowering circuit which generates the converted output.

Abstract: A semiconductor memory device is provided which includes a substrate arrangement which is suitable for forming a large number of types of DRAMs having different package specifications, different bit structure and different operating modes. In conjunction with this, the bonding pads are arranged at optimum locations for accommodating the different package types. Various layout arrangements are also provided to minimize space and to improve access time. Additional features are provided, including improved output buffer circuitry, protection circuitry and testing methods to facilitate operation of the semiconductor memory device.

Abstract: A semiconductor integrated circuit memory structure is provided which uses macro-cellulated circuit blocks that can permit a very large storage capability (for example, on the order of 64 Mbits in a DRAM) on a single chip. To achieve, this, a plurality of macro-cellulated memory blocks can be provided, with each of the memory blocks including a memory array as well as additional circuitry such as address selection circuits and input/output circuits. Other peripheral circuits are provided on the chip which are common to the plurality of macro-cell memory blocks. The macro-cell memory blocks themselves can be formed in an array so that their combined storage capacity will form the large overall storage capacity of the chip. The combination of the macro-cell memory blocks and the common peripheral circuitry for controlling the memory blocks permits a faster and more efficient refreshing operation for a DRAM. This is enhanced by a LOC (Lead On Chip) arrangement used in conjunction with the memory blocks.

Abstract: A semiconductor integrated circuit comprises a semiconductor chip, a power supply terminal provided on the semiconductor chip for receiving a voltage from an external power supply source, an internal circuit provided on the semiconductor chip, a power supply circuit provided on the semiconductor chip for transforming an external power supply voltage received from the power supply terminal for supplying a source voltage resulting from the voltage transformation to the internal circuit, and a control circuit provided on the semiconductor chip for controlling the power supply circuit, wherein the control circuit includes external power supply voltage detecting means and/or temperature detecting means and responds to the signal from the external power supply voltage detecting means and/or the temperature detecting means by changing the power supply voltage to the internal circuit to thereby maintain the operating speed of the internal circuit to be constant.

Abstract: Disclosed is a semiconductor device, such as a semiconductor memory device, having structure wherein invasion of minority carriers from the semiconductor substrate into components of the device, formed on the substrate, can be avoided. The semiconductor memory device can be an SRAM or DRAM, for example, and includes a memory array and peripheral circuit on a substrate. In one aspect of the present invention, a buried layer of the same conductivity type as that of the substrate, but with a higher impurity concentration than that of the substrate, is provided beneath at least one of the peripheral circuit and memory array. A further region can extend from the buried layer, for example, to the surface of the semiconductor substrate, the buried layer and further region in combination acting as a shield to prevent minority carriers from penetrating to the device elements.

Abstract: A semiconductor integrated circuit includes a semiconductor chip, a power supply terminal provided on the semiconductor chip for receiving a voltage from an external power supply source, an internal circuit provided on the semiconductor chip, a power supply circuit provided on the senmiconductor chip for transforming an external power supply voltage received from the power supply terminal for supplying a source voltage resulting from the voltage transformation to the internal circuit. A control circuit provided on the semiconductor chip controls the power supply circuit, wherein the control circuit includes external power supply voltage detector and/or temperature detector and responds to the signal from the external power supply voltage detector by changing the power supply voltage to the internal circuit. Thus, the operating speed of the internal circuit is kept substantially constant.

Abstract: A small and reliable semiconductor device is provided in a substrate which has an isolation trench and a capacitor trench. The isolation trench isolates a bipolar transistor from other semiconductor devices, and the capacitor trench provides capacitance to a memory cell which is formed in the substrate. The interior of the device isolation trench is kept in a floating state with respect to the surrounding semiconductor regions by forming an insulating film over the inner surface of the trench. In the capacitor trench, insulating layers and resilient conductive layers are formed alternately to form capacitance between the opposing conductive layers.

Abstract: An ECL circuit wherein a current switch and an emitter follower are coupled, is so constructed that, in a standby mode, the current switch has its current cut off or rendered smaller than in an operating mode. In addition, the ECL circuit comprises means for decoupling a load resistance of the current switch and a base of the emitter follower in the case of cutting off the current of the current switch, or means for increasing the load resistance of the current switch in the case of rendering the current of the current switch smaller. The semiconductor circuit of the present invention can reduce the power consumption of the ECL circuit and can suppress fluctuations in the voltage levels of the outputs of the ECL circuit.

Abstract: A semiconductor memory having a structure wherein each of data lines intersecting word lines is divided into a plurality of sub lines in its lengthwise direction, memory cells are arranged at the points of intersection between the divided sub lines and the word lines, common input/output lines are disposed in common to a plurality of such sub lines, the common input/output lines and the plurality of sub lines are respectively connected by switching elements, and the switching elements are connected to a decoder through control lines and are selectively driven by control signals generated from the decoder.

Abstract: A semiconductor memory having a plurality of word lines, and a plurality of data lines arranged to intersect the word lines. Memory cells are arranged at nodes of the word lines and the data lines. Each of the memory cells has a field effect transistor and a capacitor. A word line multiple selection circuit is provided for selecting a plurality of the word lines. The multiple selection circuit simultaneously accesses all of the memory cells by selecting all the word lines of a memory array when a semiconductor memory is in a clear mode. In the clear mode a detector selects data lines of the memory array. A plate voltage control circuit controls a voltage at one plate of each of the capacitors in the memory cells. The plate control circuit changes a voltage at the plate to a preselected clear mode voltage when a semiconductor memory is in a clear mode. It is a feature of the invention that preselected data is written in the memory cells by data communication through the data lines during the clear mode.

Abstract: A semiconductor device comprising a plurality of circuits driven by at least one external power source, and at least one voltage converter transforming the voltage of the external power source into another voltage. At least a part of the plurality of circuits are driven by the output voltage of the at least one voltage converter, which is provided with a controller for controlling its load driving power, corresponding to the operation of the part of the plurality of circuits. The voltage converter includes a voltage limiter which is used exclusively for each of the different natures of the loads, and its operation and load driving power are controlled, depending on the operations of each of the loads.

Abstract: In a voltage converter which is disposed in a semiconductor integrated circuit so as to lower an external supply voltage and to feed the lowered voltage to a partial circuit of the integrated circuit, the voltage converter is constructed so as to produce an output voltage suited to an ordinary operation in the ordinary operation state of the semiconductor integrated circuit and an aging voltage in the aging test of the circuit.

Abstract: A very highly integrated semiconductor memory which enables the dynamic random access memory to develop less soft error and to eliminate margin for aligning the masks, that hinders the device from being highly integrated. The memory cell capacitor is constituted by a trench which is provided at a position defined by an insulator formed on the side of gate electrode of a MOS transistor that constitutes the memory cell. Therefore, the MOS transistor and the trench capacitor are self-aligned, and no margin is required for alignment.