Abstract: An object of the invention is to provide an LED drive circuit that can suppress the generation of harmonic noise. The LED drive circuit includes a rectifying circuit an LED array, and a current supply circuit which includes a capacitor and a time constant adjusting element, wherein the discharge time constant of the current supply circuit is set longer than the charge time constant of the current supply circuit, and wherein during a period of time when the magnitude of AC commercial power supply voltage is larger than the light emission threshold of the LED array, current to the light-emitting circuit is supplied mostly from the rectifying circuit, and during a period of time when the magnitude of AC commercial power supply voltage is not larger than the light emission threshold of the LED array, current to the light-emitting circuit is supplied from the current supply circuit.

Abstract: Disclosed herein is a printed circuit board including: an insulating layer including a stopper layer for trench formation disposed in an inner portion thereof and trenches formed to expose the stopper layer for trench formation; and circuit patterns formed in the trenches.

Abstract: A method of fabricating a multilayer printed circuit board includes forming a first circuit-forming pattern and a via-forming pattern on a first carrier, and forming a first insulation layer; repeatedly forming inner circuit patterns and inner insulation layers over the first insulation layer by forming circuit-forming patterns and imprinting, and forming inner vias connecting the inner circuit patterns positioned on different insulation layers; forming a second circuit-forming pattern on a second carrier and inserting the first circuit-forming pattern and the second circuit-forming pattern respectively into the first insulation layer and a second insulation layer; removing the first carrier and the second carrier; forming circuit-forming grooves by removing the first circuit-forming pattern and the second circuit-forming pattern, and forming via-forming indentations connected with the circuit-forming grooves; and forming outer circuit patterns and outer vias by filling the circuit-forming grooves and the via

Abstract: A fabrication method for a multilayer printed circuit board includes: forming a first circuit-forming pattern and a first insulation layer, into which the first circuit-forming pattern is inserted, on a first carrier; forming inner circuit patterns and inner insulation layers over the first insulation layer, and forming inner vias connecting the inner circuit patterns positioned on different insulation layers; forming a second circuit-forming pattern on a second carrier and inserting the second circuit-forming pattern into a second insulation layer on an outermost side; removing the first carrier and the second carrier; forming circuit-forming grooves by removing the first circuit-forming pattern and the second circuit-forming pattern, and forming via-forming indentations connected with the circuit-forming grooves; and forming outer circuit patterns and outer vias by filling the circuit-forming grooves and the via-forming indentations with a conductive material.

Abstract: A train car-to-car communication device includes: a terminal; an intra-composition transmission line connected to the terminal within the same composition for transmitting information; a composition-to-composition communication relay unit connected to the intra-composition transmission line for receiving first information from the terminal within the composition and transmitting the first information to an adjacent composition, and receiving second information from the adjacent composition and transmitting the second information to the terminal within the composition of interest; and a composition-to-composition transmission line for connecting the composition-to-composition communication relay units of the adjacent compositions and transmitting the information, and the composition-to-composition communication relay unit determines a difference between composition directions of the composition as a transmission source of the received information and the composition to which the composition-to-composition comm

Abstract: Disclosed herein is a printed circuit board and a method of manufacturing the same, in which a circuit pattern one end of which is embedded in a trench and the other end of which protrudes from an insulating layer is formed, so that the circuit pattern is not easily separated from the insulating layer and the separation problems of the circuit pattern due to undercutting are solved. Also, the adhesion between the insulating layer and the circuit pattern is enhanced, more stably forming a fine circuit pattern. Even when a plating resist is formed thin, it is possible to form the circuit pattern, resulting in a high-solution circuit pattern.

Abstract: Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on one side or both sides of the base substrate and including trenches formed in a circuit region and a dummy region positioned at a peripheral edge of the trench substrate, and a circuit layer formed in the trenches of the circuit region through a plating process and including a circuit pattern and vias. Thanks to formation of the trenches in the dummy region and the cutting region, deviation in thickness of a plating layer formed on the insulating layer in a plating process is improved upon.

Abstract: An object of the invention is to provide an LED drive circuit that can suppress the generation of harmonic noise. The LED drive circuit includes a rectifying circuit an LED array, and a current supply circuit which includes a capacitor and a time constant adjusting element, wherein the discharge time constant of the current supply circuit is set longer than the charge time constant of the current supply circuit, and wherein during a period of time when the magnitude of AC commercial power supply voltage is larger than the light emission threshold of the LED array, current to the light-emitting circuit is supplied mostly from the rectifying circuit, and during a period of time when the magnitude of AC commercial power supply voltage is not larger than the light emission threshold of the LED array, current to the light-emitting circuit is supplied from the current supply circuit.

Abstract: Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on one side or both sides of the base substrate and including trenches formed in a circuit region and a dummy region positioned at a peripheral edge of the trench substrate, and a circuit layer formed in the trenches of the circuit region through a plating process and including a circuit pattern and vias. Thanks to formation of the trenches in the dummy region and the cutting region, deviation in thickness of a plating layer formed on the insulating layer in a plating process is improved upon.

Abstract: A method of fabricating a printed circuit board is disclosed. A method of fabricating a printed circuit board that includes: stacking an insulation layer on at least one surface of a core layer, on which an inner circuit is formed, and forming an outer circuit pattern; burying the outer circuit pattern in the insulation layer; removing the outer circuit pattern to form minute grooves and curing the insulation layer; and forming an outer circuit by filling metal in the minute grooves, makes it possible to readily form high-resolution fine-line circuits, as well as to reduce fabrication costs and increase productivity.

Abstract: Disclosed is a method of manufacturing a printed circuit board, including (A) forming a first circuit layer on a base substrate and forming a first insulating layer thereon, (B) forming trenches including dummy trenches and wiring trenches on the first insulating layer and plating the trenches, thus providing a trench circuit layer including a dummy circuit pattern and a wiring circuit pattern, (C) removing the dummy circuit pattern of the trench circuit layer, and (D) forming a second insulating layer on the trench circuit layer from which the dummy circuit pattern was removed. The method reduces deviation of plating thickness and thus realizes the design density of a trench circuit layer.

Abstract: Disclosed herein is a printed circuit board, including: a base substrate; insulation layers which are formed on both sides of the base substrate and in which trenches are formed; and circuit layers including circuit patterns and vias formed in the trenches using a plating process. The printed circuit board is advantageous in that trenches are formed in both sides of a base substrate, so that a fine circuit pattern can be simultaneously formed on both sides thereof, thereby simplifying the manufacturing process thereof.

Abstract: Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on one side or both sides of the base substrate and including trenches formed in a circuit region and a dummy region positioned at a peripheral edge of the trench substrate, and a circuit layer formed in the trenches of the circuit region through a plating process and including a circuit pattern and vias. Thanks to formation of the trenches in the dummy region and the cutting region, deviation in thickness of a plating layer formed on the insulating layer in a plating process is improved upon.

Abstract: A display device includes a lens array unit, a display unit which is configured such that a first substrate is attached to a second substrate that is disposed between the first substrate and the lens array unit, the display unit having a display area composed of matrix-arrayed pixels, a gap control layer which forms a predetermined gap between the display unit and the lens array unit, and a support member which fixes the display unit and the lens array unit on an outside of the display area of the display unit.

Abstract: A liquid crystal display device has a gradation display function of at least an n-number of gray levels and has a viewing angle characteristic of Mi/Mj?1.3 in a case where a display luminance range in a normal direction to a display surface in a gradation range of predetermined gray levels i to j is Li to Lj and a display luminance range in an oblique viewing-angle direction of 30° or more is Mi to Mj (where n, i and j are real numbers, and n?i>j?0). The liquid crystal display device has a display mode in which a display image is displayed with a display luminance range of the display image being limited to Li to Lj.

Abstract: A train car-to-car communication device includes: a terminal; an intra-composition transmission line connected to the terminal within the same composition for transmitting information; a composition-to-composition communication relay unit connected to the intra-composition transmission line for receiving first information from the terminal within the composition and transmitting the first information to an adjacent composition, and receiving second information from the adjacent composition and transmitting the second information to the terminal within the composition of interest; and a composition-to-composition transmission line for connecting the composition-to-composition communication relay units of the adjacent compositions and transmitting the information, and the composition-to-composition communication relay unit determines a difference between composition directions of the composition as a transmission source of the received information and the composition to which the composition-to-composition comm

Abstract: A method of fabricating a high density printed circuit board by applying a strippable adhesive layer on a reinforced substrate (rigid substrate or carrier film) used as a base substrate, forming a metal foil on the adhesive layer by means of plating, lamination or sputtering, and forming a high density circuit on the metal foil serving as a seed layer by means of pattern plating. Specifically, the method of the current invention includes the steps of attaching adhesive means to one surface of a reinforced substrate (rigid substrate or carrier film), forming a seed layer on the adhesive means and forming a circuit pattern on the seed layer, laminating an insulating layer on the circuit pattern and removing the reinforced substrate (rigid substrate or carrier film), and removing the seed layer.

Abstract: A display device includes a lens array unit including a lens array layer, and a display unit configured such that a first substrate and a second substrate, which is disposed between the first substrate and the lens array unit, are attached, the display unit including a display area and an alignment mark outside the display area, wherein the lens array unit includes a window portion formed at a position on the lens array layer, which corresponds to the alignment mark.

Abstract: A method of fabricating a circuit board is disclosed. The method includes: forming a trench in a base and forming an electroless plating layer over a surface of the base and an inner surface of the trench; providing a carrier, on one side of which a plating resist is coated; forming a transcribed part on the surface of the base by stacking the carrier onto the base and transcribing the plating resist onto the surface of the base; forming a pattern in the trench by plating, and removing the transcribed part; and removing portions of the electroless plating layer and the pattern. This method makes it possible to form circuit patterns with a uniform thickness and to provide high workability.

Abstract: A fabrication method for a multilayer printed circuit board includes: forming a first circuit-forming pattern and a first insulation layer, into which the first circuit-forming pattern is inserted, on a first carrier; forming inner circuit patterns and inner insulation layers over the first insulation layer, and forming inner vias connecting the inner circuit patterns positioned on different insulation layers; forming a second circuit-forming pattern on a second carrier and inserting the second circuit-forming pattern into a second insulation layer on an outermost side; removing the first carrier and the second carrier; forming circuit-forming grooves by removing the first circuit-forming pattern and the second circuit-forming pattern, and forming via-forming indentations connected with the circuit-forming grooves; and forming outer circuit patterns and outer vias by filling the circuit-forming grooves and the via-forming indentations with a conductive material.