Abstract: There is provided a imaging device including: an N-type region formed for each pixel and configured to perform photoelectric conversion; an inter-pixel light-shielding wall penetrating a semiconductor substrate in a depth direction and formed between N-type regions configured to perform the photoelectric conversion, the N-type regions each being formed for each of pixels adjacent to each other; a P-type layer formed between the N-type region configured to perform the photoelectric conversion and the inter-pixel light-shielding wall; and a P-type region adjacent to the P-type layer and formed between the N-type region and an interface on a side of a light incident surface of the semiconductor substrate.

Abstract: The present technology relates to solid-state imaging apparatuses and electronic equipment, each of which is capable of contributing to an increased sense of resolution at an outer peripheral portion of an image photographed by using a wide-angle lens. The solid-state imaging apparatus includes a pixel array section in which a plurality of pixels is arranged such that a pixel pitch becomes smaller at a greater distance away from a central portion toward an outer peripheral portion. The present technology is applicable to, for example, solid-state imaging apparatuses and the like suited for photographing by using a wide-angle lens such as a fisheye lens used in a 360-degree panoramic camera.

Abstract: The present technique aims to provide a solid-state imaging device that reduces shading and color mixing between pixels. The present invention also provides a method of manufacturing the solid-state imaging device. The present technique further relates to a solid-state imaging device that enables provision of an electronic apparatus that uses the solid-state imaging device, a method of manufacturing the solid-state imaging device, and an electronic apparatus. The solid-state imaging device includes a substrate, pixels each including a photoelectric conversion unit formed in the substrate, and a color filter layer formed on the light incidence surface side of the substrate. The solid-state imaging device also includes a device isolating portion that is formed to divide the color filter layer and the substrate for the respective pixels, and has a lower refractive index than the refractive indexes of the color filter layer and the substrate.

Abstract: Color mixing between pixels is prevented in a solid-state imaging element in which a pair of pixels for detecting the phase difference of a pair of light rays are arranged. A pair of photoelectric conversion elements receive a pair of light rays made by pupil-splitting. A floating diffusion layer generates a pair of pixel signals from electric charge transferred from each of the pair of photoelectric conversion elements. A pair of transfer transistors transfer the electric charge from the pair of photoelectric conversion elements to the floating diffusion layer. In a case of detecting the phase difference of the pair of light rays from the pair of pixel signals, the control unit takes control so that back gate voltages that include the back gate potentials of both of the pair of transfer transistors with respect to the potential barrier between the pair of photoelectric conversion elements have values different from values in a case of synthesizing the pair of pixel signals.

Abstract: There is provided a imaging device including: an N-type region formed for each pixel and configured to perform photoelectric conversion; an inter-pixel light-shielding wall penetrating a semiconductor substrate in a depth direction and formed between N-type regions configured to perform the photoelectric conversion, the N-type regions each being formed for each of pixels adjacent to each other; a P-type layer formed between the N-type region configured to perform the photoelectric conversion and the inter-pixel light-shielding wall; and a P-type region adjacent to the P-type layer and formed between the N-type region and an interface on a side of a light incident surface of the semiconductor substrate.

Abstract: Provided is an imaging apparatus that includes a pixel array portion, a plurality of unit pixels in the pixel array portion, and a driving unit that controls an operation of the unit pixel. The unit pixel includes a photoelectric converter, a charge retention unit that retains a charge, a charge-voltage converter that converts the charge into a voltage, a first transmitting unit that transmits the charge from the photoelectric converter to the charge retention unit, a second transmitting unit that transmits the charge from the photoelectric converter to the charge-voltage converter, and a third transmitting unit that transmits the charge from the charge retention unit to the charge-voltage converter.

Abstract: A solid-state imaging element according to an embodiment of the present disclosure includes: a semiconductor substrate having a photoelectric converter for each of pixels; a pixel separation groove provided between the pixels, the pixel separation groove extending from one surface of the semiconductor substrate toward another surface of the semiconductor substrate that opposes the one surface; and a pixel coupling section provided between the pixels on the other surface of the semiconductor substrate.

Abstract: The present technique aims to provide a solid-state imaging device that reduces shading and color mixing between pixels. The present invention also provides a method of manufacturing the solid-state imaging device. The present technique further relates to a solid-state imaging device that enables provision of an electronic apparatus that uses the solid-state imaging device, a method of manufacturing the solid-state imaging device, and an electronic apparatus. The solid-state imaging device includes a substrate, pixels each including a photoelectric conversion unit formed in the substrate, and a color filter layer formed on the light incidence surface side of the substrate. The solid-state imaging device also includes a device isolating portion that is formed to divide the color filter layer and the substrate for the respective pixels, and has a lower refractive index than the refractive indexes of the color filter layer and the substrate.

Abstract: There is provided a imaging device including: an N-type region formed for each pixel and configured to perform photoelectric conversion; an inter-pixel light-shielding wall penetrating a semiconductor substrate in a depth direction and formed between N-type regions configured to perform the photoelectric conversion, the N-type regions each being formed for each of pixels adjacent to each other; a P-type layer formed between the N-type region configured to perform the photoelectric conversion and the inter-pixel light-shielding wall; and a P-type region adjacent to the P-type layer and formed between the N-type region and an interface on a side of a light incident surface of the semiconductor substrate.

Abstract: The present technology relates to a solid-state imaging element and electronic equipment that allow an increase in the signal charge amount Qs that each pixel can accumulate. A solid-state imaging element according to the first aspect of the present technology includes: a photoelectric conversion section formed in each pixel; and an inter-pixel separation section separating the photoelectric conversion section of each pixel, in which the inter-pixel separation section includes a protruding section having a shape protruding toward the photoelectric conversion section. The present technology can be applied to a back-illuminated CMOS image sensor, for example.

Abstract: The present technology relates to an imaging apparatus, a driving method, and an electronic device, which are capable of expanding a dynamic range of the imaging apparatus without impairing an image quality. An imaging apparatus includes: a pixel array portion, a plurality of unit pixels being arranged in the pixel array portion; and a driving unit configured to control an operation of the unit pixel, in which the unit pixel includes a photoelectric converter, a charge retention unit configured to retain a charge, a charge-voltage converter configured to convert the charge into a voltage, a first transmitting unit configured to transmit the charge from the photoelectric converter to the charge retention unit, a second transmitting unit configured to transmit the charge from the photoelectric converter to the charge-voltage converter, and a third transmitting unit configured to transmit the charge from the charge retention unit to the charge-voltage converter.

Abstract: The present technology relates to an imaging element that can increase the degree of freedom of element arrangement. A photoelectric conversion unit, a through trench penetrating a semiconductor substrate in a depth direction and formed between pixels each including the photoelectric conversion unit, and a PN junction region in a side wall of the trench are included, and the through trench has an opening portion, and a P-type region is formed in the opening portion. A photoelectric conversion unit, a holding unit, a through trench formed between the photoelectric conversion unit and the holding unit, and a PN junction region in a side wall of the through trench are included, and the through trench has an opening portion and a readout gate for reading the charge from the photoelectric conversion unit is formed in the opening portion. The present technology can be applied to, for example, an imaging element.

Abstract: A PD unit has a Tr-side Si/SiO2 interface formed to be p-type, and has an embedded PD. The PD, which is n-type, performs photoelectric conversion, and accumulates an electrical charge. A TG transfers the electrical charge accumulated in the PD to an FD. An Amp is connected to the FD. An RST is connected to a Reset Drain (RD), and resets the FD. An FDG is a conversion-efficiency switching switch. An FC is a MOS capacitance (gate electrode) that is connected to the FDG. A SEL selects a pixel that outputs a signal.

Abstract: The present technique aims to provide a solid-state imaging device that reduces shading and color mixing between pixels. The present invention also provides a method of manufacturing the solid-state imaging device. The present technique further relates to a solid-state imaging device that enables provision of an electronic apparatus that uses the solid-state imaging device, a method of manufacturing the solid-state imaging device, and an electronic apparatus. The solid-state imaging device includes a substrate, pixels each including a photoelectric conversion unit formed in the substrate, and a color filter layer formed on the light incidence surface side of the substrate. The solid-state imaging device also includes a device isolating portion that is formed to divide the color filter layer and the substrate for the respective pixels, and has a lower refractive index than the refractive indexes of the color filter layer and the substrate.

Abstract: The present technology relates to a solid-state imaging device capable of suppressing deterioration in dark characteristics, and an electronic apparatus. The present invention is provided with: a photoelectric conversion section that performs photoelectric conversion; a charge retaining section that temporarily retains electric charge converted by the photoelectric conversion section; and a first trench formed in a semiconductor substrate between the photoelectric conversion section and the charge retaining section, the first trench being higher than the photoelectric conversion section in a depth direction of the semiconductor substrate. Alternatively, the first trench is lower than the photoelectric conversion section and higher than the charge retaining section in the depth direction of the semiconductor substrate. The present technology can be applied to, for example, a back-illuminated CMOS image sensor.

Abstract: The present disclosure relates to a solid-state image pickup device that is capable of increasing an area efficiency of a Si interface on the transistor element side, and an electronic apparatus. A PD unit has a Tr-side Si/SiO2 interface formed to be p-type, and has an embedded PD. The PD, which is n-type, performs photoelectric conversion, and accumulates an electrical charge. A TG transfers the electrical charge accumulated in the PD to an FD. An Amp is connected to the FD. An RST is connected to a Reset Drain (RD), and resets the FD. An FDG is a conversion-efficiency switching switch. An FC is a MOS capacitance (gate electrode) that is connected to the FDG. A SEL selects a pixel that outputs a signal. The present disclosure can be applied to a CMOS solid-state image pickup device used for, for example, an image pickup device such as a camera.

Abstract: A subjective optometry apparatus has a projection optical system including a visual target presenting portion and an optical member to project a target light flux toward a subject eye, and causing the target light flux to be incident on the optical member with a deviation of the incident target light flux from an optical axis of the optical member, a housing accommodating the projection optical system, a presentation window for emitting the target light flux from the inside of the housing to the outside thereof, an eye refractive power measurement unit provided outside the housing, and holding means integrally connecting the housing to the eye refractive power measurement unit to hold the eye refractive power measuring unit. When using the eye refractive power measuring unit, a distance from the presentation window to the eye refractive power measurement unit in an optical path is equal to or less than 180 mm.

Abstract: The present technology relates to an imaging device designed to be able to reduce luminance unevenness. An imaging device includes a photodiode and a wiring layer formed on a surface facing the incident surface of the photodiode. A wiring line is formed in the wiring layer, and the wiring line in a pixel is formed in a different pattern from a pattern in a different pixel. Another imaging device including a photodiode and a wiring layer formed on a surface facing the incident surface of the photodiode. A wiring line is formed in the wiring layer. A gap having a different dielectric constant from the dielectric constant of the material forming the wiring layer is formed in the wiring layer, and the gap in a pixel is formed in a different pattern from a pattern in a different pixel. The present technology can be applied to imaging devices.

Abstract: The present technique aims to provide a solid-state imaging device that reduces shading and color mixing between pixels. The present invention also provides a method of manufacturing the solid-state imaging device. The present technique further relates to a solid-state imaging device that enables provision of an electronic apparatus that uses the solid-state imaging device, a method of manufacturing the solid-state imaging device, and an electronic apparatus. The solid-state imaging device includes a substrate, pixels each including a photoelectric conversion unit formed in the substrate, and a color filter layer formed on the light incidence surface side of the substrate. The solid-state imaging device also includes a device isolating portion that is formed to divide the color filter layer and the substrate for the respective pixels, and has a lower refractive index than the refractive indexes of the color filter layer and the substrate.

Abstract: An audio signal processing device includes a neural network circuit that includes an input layer including input units, an intermediate layer, and an output layer including output units, an input section that executes simultaneous inputting of, at each of unit time intervals, each of pieces of unit data of consecutive sampling units in an input signal data string generated through sampling based on an audio signal string into each of the input units on a one-to-one basis, one of the pieces of unit data input into one of the input units at one of the unit time intervals being input into another of the input units at another of the unit time intervals in the simultaneous inputting at each of the unit time intervals, and an output section that outputs, in accordance with the simultaneous inputting over a plurality of the unit time intervals that are consecutive, a computation result at each of the unit time intervals, the computation result being based on pieces of data output from the output units at each of th