Patents by Inventor Ryosuke IKEDA

Ryosuke IKEDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKING AND MANUFACTURING METHOD THEREFOR
    Publication number: 20190193015
    Abstract: The packing has one or more thin-layer packing elements that are installed upright, the packing element having a main body portion with a planar liquid film formation surface, and one or more wall portions that are provided upright relative to the liquid film formation surface along a linear direction. The side surface of each wall portion has a curved portion at the base thereof connected to the liquid film formation surface, the curved portion curbing so as to continue into the liquid film formation surface.
    Type: Application
    Filed: January 24, 2019
    Publication date: June 27, 2019
    Applicants: IHI Corporation, OSAKA CITY UNIVERSITY
    Inventors: Yoshiyuki ISO, Ryosuke IKEDA, Shiko NAKAMURA, Kenji KATOH, Tatsuro WAKIMOTO