Patents by Inventor Ryosuke Yamazaki

Ryosuke Yamazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210101435
    Abstract: A second electric suspension device includes a second electromagnetic actuator that is provided between the vehicle body and a wheel of a vehicle and generates a driving force for damping vibration of the vehicle. The second electromagnetic actuator includes a columnar rod member and a casing surrounding the rod member and being provided capable of moving forward and backward relative to the rod member in the axial direction. Casing-side armature coils are provided in the casing in the axial direction, whereas magnets are provided in the rod member in the axial direction in such a manner as to face part of the casing-side armature coils in the casing. The magnets are formed by permanent magnets and electromagnets including rod-side armature coils.
    Type: Application
    Filed: October 1, 2020
    Publication date: April 8, 2021
    Inventors: Ryosuke YAMAZAKI, Takashi YANAGI
  • Patent number: 10927278
    Abstract: The present invention pertains to a curable organopolysiloxane composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per module, (B) an organopolysiloxane resin represented by average unit formula: (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d. In the formula, R1's are the same or different from each other, and represent a hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond but at least two of the R1's per molecule represent hydrogen atoms, R2 represents a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0<a<1, 0<b<1, and 0?c?0.2, and 0<d<1, respectively, but are also numbers satisfying 0.6?a/d 1.5, 1.5?b/d?3, and a+b+c+d=1, and (C) a catalyst for hydrosilylation reaction. This composition has excellent adhesiveness to a semiconductor element, and can form a cured product in which only a small number of bubbles are produced.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: February 23, 2021
    Assignee: DUPONT TORAY SPECIALTY MATERIALS KABUSHIKI KAISHA
    Inventors: Ryosuke Yamazaki, Kazuhiro Nishijima, Tomohiro Iimura, Manabu Sutoh
  • Publication number: 20200392335
    Abstract: A curable particulate silicone composition is disclosed. The composition comprises: (A) hot-melt silicone fine particles having a specific reactive functional group; (B) an inorganic filler; and (C) a curing agent. The content of component (B) is in the range of from 87 to 95 vol. % of the total composition. The curable particulate silicone composition provides a cured product having an average linear expansion coefficient of not greater than 15 ppm/° C. in a range of from 25° C. to 200° C. The curable particulate silicone composition provides a cured product having a very low average linear expansion coefficient over a wide temperature range when cured and is particularly suitable for overmold molding and the like.
    Type: Application
    Filed: May 22, 2018
    Publication date: December 17, 2020
    Inventor: Ryosuke YAMAZAKI
  • Patent number: 10858043
    Abstract: A lock mechanism is provided in an actuator capable of changing a toe angle of a wheel by rotational drive of a motor and adapted to lock operation of the actuator when the rotational drive of the motor is stopped. The lock mechanism includes a casing secured to a housing of the actuator, an input-side shaft connected to a motor shaft of the motor and rotatably held in the casing, an output-side shaft to which rotational torque is transmitted from the input-side shaft, and an engaging part. The engaging part includes a pair of friction members displaceably provided along a guide groove, a claw part having an acute shape in cross section and a side end part which are provided on the input-side shaft, an abutting part provided on each friction member, and a coil spring for urging each friction member.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: December 8, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Ryosuke Yamazaki, Takumi Inagaki
  • Patent number: 10836425
    Abstract: A wheel steering system is provided that improves an environment of an actuator being mounted and reduces changes in toe angles of wheels at the time of a suspension stroke. The system includes: right and left hub carriers supported by a rear suspension mechanism; right and left tie rods having outer ends in a vehicle width direction thereof pivotally connected to the right and left hub carriers; and a Watts link having inner ends in the vehicle width direction of the right and left tie rod pivotally attached thereto so as to be pivotable about a pivot axis, wherein the actuator and the Watts link are arranged above springs, and the Watts link is connected with the actuator so as to be displaceable substantially along the vehicle width direction when a driving force of the actuator is inputted to the Watts link.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: November 17, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Ryosuke Yamazaki, Takumi Inagaki
  • Patent number: 10800453
    Abstract: A wheel steering system includes: a rear suspension mechanism inclusive of a knuckle member for rotatably holding a right rear wheel; a first cam and a second cam that are rotatably supported; a first cam follower 18 that follows the first cam; a second cam follower 20 that follows the second cam 16; cam grooves 48 respectively provided in the first and second cams; a first engaging pin and a second engaging pin that engage with the respective cam grooves; and a rotational driving force transmitter that transmits a rotational driving force of an electric motor to the first and second cams, wherein the first cam and the first cam follower are arranged on a front side in the vehicle front-rear direction of an axle, and the second cam and the second cam follower are arranged on a rear side in the vehicle front-rear direction of the axle.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: October 13, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Ryosuke Yamazaki, Takumi Inagaki
  • Patent number: 10729892
    Abstract: A medical elongated body is disclosed, which is able to make a nick in a stenosed site and is capable of preferably widening the stenosed site in which the nick is made. A balloon catheter is disclosed, which includes a shaft, a dilation member that is fixed to the shaft on a distal side, and an elastic member that is disposed on an inner surface of the dilation member. The dilation member includes a projection portion, which is a part of the dilation member protruding in a radial direction due to the elastic member disposed at a position where the inner surfaces of the dilation member face each other. A material of the elastic member is configured to be a material, which is further stretched than a material of the dilation member in a circumferential direction when the dilation member dilates.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: August 4, 2020
    Assignee: TERUMO KABUSHIKI KAISHA
    Inventor: Ryosuke Yamazaki
  • Publication number: 20200115603
    Abstract: A curable silicone composition for die bonding use contains at least (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least two siloxane units each represented by the formula: RHSiO (wherein R represents a monovalent hydrocarbon group having 1 to 12 carbon atoms and having no aliphatic unsaturated bond) per molecule, (C) a platinum-group metal-based catalyst for hydrosilylation reactions, (D) a hydrosilylation reaction inhibitor and (E) an adhesiveness-imparting agent, wherein the scorch time (ts1), which is defined in JIS K 6300-2, at a die bonding temperature is 20 to 60 seconds, and the 90% vulcanization time [tc(90)] with respect to the maximum torque value during the vulcanization time of 600 seconds is 300 to 500 seconds. The curable silicone composition for die bonding use according to the present invention can adhere a semiconductor chip to a support strongly.
    Type: Application
    Filed: June 19, 2018
    Publication date: April 16, 2020
    Applicant: Dow Corning Toray Co., Ltd.
    Inventors: Ryosuke Yamazaki, Shinichi Yamamoto
  • Publication number: 20200102004
    Abstract: A four wheel steering vehicle (1), in which front wheels (2f) and rear wheels (2r) can be steered in response to a steering input from a steering wheel (11), includes a rear wheel steering control unit (50) that variably controls a rear wheel steering device such that the rear wheels are steered in a prescribed relation to a steered angle of the front wheels. When the steering input is determined while the front wheel brake and the rear wheel brake are engaged, the rear wheel steering control unit disengages the rear wheel brake and steers the rear wheels. When the fore and aft inclination angle detected by an inclination sensor (40) provided on the vehicle is greater than a threshold value, the rear wheel steering control unit prohibits a steering of the rear wheels and keeps the rear wheel brake engaged even if the steering input is determined.
    Type: Application
    Filed: September 17, 2019
    Publication date: April 2, 2020
    Inventors: Ryosuke YAMAZAKI, Takumi INAGAKI
  • Patent number: 10604612
    Abstract: Disclosed is a curable organopolysiloxane composition, comprising: (A) a curing reactive organopolysiloxane component formed by curing or semi-curing and reacting at least two or more types of organopolysiloxanes in the presence of one or more types of catalysts; and (B) a peroxide. The composition is a non-fluid at 25° C., and the melt viscosity at 100° C. is 8000 Pa·s or lower. A sealing agent comprising the curable organopolysiloxane composition and a cured product of the curable organopolysiloxane composition are also disclosed, along with a method of molding a cured product and a semiconductor device comprising the cured product.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: March 31, 2020
    Assignee: Dow Toray Co., Ltd.
    Inventors: Toyohiko Fujisawa, Nohno Toda, Ryosuke Yamazaki
  • Publication number: 20190375969
    Abstract: The present invention pertains to a curable organopolysiloxane composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per module, (B) an organopolysiloxane resin represented by average unit formula: (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d. In the formula, R1's are the same or different from each other, and represent a hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond but at least two of the R1's per molecule represent hydrogen atoms, R2 represents a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0<a<1, 0<b<1, and 0?c?0.2, and 0<d<1, respectively, but are also numbers satisfying 0.6?a/d 1.5, 1.5?b/d?3, and a+b+c+d=1, and (C) a catalyst for hydrosilylation reaction. This composition has excellent adhesiveness to a semiconductor element, and can form a cured product in which only a small number of bubbles are produced.
    Type: Application
    Filed: February 2, 2018
    Publication date: December 12, 2019
    Inventors: Ryosuke Yamazaki, Kazuhiro Nishijima, Tomohiro Iimura, Manabu Sutoh
  • Patent number: 10479910
    Abstract: A primer composition is provided. The primer composition comprises: (A) an organosiloxane block copolymer represented by the average unit formula: (R12SiO2/2)a(R2SiO3/2)b, wherein each R1 and R2 is independently an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms, “a” is a number in the range of 0.40 to 0.90, “b” is a number in the range of 0.10 to 0.60, and “a+b”=1.00, and having 0.5 to 35.0 mol % of silicon atom-bonded hydroxyl groups or silicon atom-bonded alkoxy groups, in which resinous siloxane blocks are connected by linear siloxane blocks; (B) a curing catalyst; and (C) an organic solvent. The primer composition improves the adhesion of silicone-cured products to base materials of optical semiconductor elements, package materials, substrates etc., and can suppress peeling or cracking caused by heat cycles.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: November 19, 2019
    Assignee: Dow Toray Co., Ltd.
    Inventors: Ryosuke Yamazaki, Hiroaki Yoshida, Shin Yoshida
  • Publication number: 20190177488
    Abstract: Provided is a curable particulate silicone composition that is hot-meltable, has excellent handling workability, curing properties, and gap fill properties when melted, and gives a cured product having excellent flexibility and resilience from room temperature to high temperatures of about 150° C. Also provided are pellets or the like formed by molding the curable particulate silicone composition. The curable particulate silicone composition comprises: (A) hot-meltable silicone particles that have a softening point of 30° C. or higher and have a hydrosilylatable group and/or a radical reactive group; (B) an inorganic filler (particulates) that is substantially free of coarse particles having an average particle diameter of 10.0 ?m or larger; and (C) a curing agent. When cured, the composition gives a cured product having a storage modulus of 2000 Mpa or lower at 25° C. and of 100 Mpa or lower at 150° C.
    Type: Application
    Filed: August 4, 2017
    Publication date: June 13, 2019
    Inventor: Ryosuke YAMAZAKI
  • Publication number: 20190169398
    Abstract: Provided are a curable particulate silicone composition having hot-melt properties, excellent handling workability and curing characteristics, high light reflectance in the visible wavelength region, and excellent flexibility and toughness at a temperature of from room temperature to a high temperature of about 250° C., and a pellet or the like formed by molding the composition. The curable particulate silicone composition comprises: (A) 100 parts by mass of hot-melt silicone fine particles having a softening point of 30° C. or higher and having a hydrosilylation reactive group and/or a radical reactive group; (B) 100 to 4000 parts by mass of an inorganic filler; and (C) a curing agent. A cured product of the curable particulate silicone composition has an average linear expansion coefficient of 30 ppm/° C. or less at 25° C. to 200° C. and the ratio of the storage modulus at ?50° C. to the storage modulus at 250° C. is 1/1 to 1/50.
    Type: Application
    Filed: August 4, 2017
    Publication date: June 6, 2019
    Inventor: Ryosuke YAMAZAKI
  • Publication number: 20190169435
    Abstract: A curable particulate silicone composition is provided which has hot-melt properties, excellent handling workability and curing characteristics, high light reflectance in the visible wavelength region, and excellent flexibility and toughness at a temperature of from room temperature to a high temperature of about 150° C. The composition comprises: (A) hot-melt silicone fine particles having a softening point of 30° C. or higher and having a hydrosilylation reactive group and/or a radical reactive group; (B) an inorganic filler substantially free of coarse particles having an average particle diameter of 5 ?m or more (fine particles); and (C) a curing agent. When cured, the composition provides a cured product that has: a storage modulus (G?) at 25° C. of 2000 MPa or less; and a storage modulus (G?) at 150° C. of 100 MPa or less; and a spectral reflectance of 90% or more at a wavelength of 450 nm at a thickness of 100 ?m.
    Type: Application
    Filed: August 4, 2017
    Publication date: June 6, 2019
    Inventor: Ryosuke YAMAZAKI
  • Publication number: 20190161122
    Abstract: A lock mechanism is provided in an actuator capable of changing a toe angle of a wheel by rotational drive of a motor and adapted to lock operation of the actuator when the rotational drive of the motor is stopped. The lock mechanism includes a casing secured to a housing of the actuator, an input-side shaft connected to a motor shaft of the motor and rotatably held in the casing, an output-side shaft to which rotational torque is transmitted from the input-side shaft, and an engaging part. The engaging part includes a pair of friction members displaceably provided along a guide groove, a claw part having an acute shape in cross section and a side end part which are provided on the input-side shaft, an abutting part provided on each friction member, and a coil spring for urging each friction member.
    Type: Application
    Filed: November 27, 2018
    Publication date: May 30, 2019
    Inventors: Ryosuke YAMAZAKI, Takumi INAGAKI
  • Publication number: 20190161115
    Abstract: A wheel steering system includes: a rear suspension mechanism inclusive of a knuckle member for rotatably holding a right rear wheel; a first cam and a second cam that are rotatably supported; a first cam follower 18 that follows the first cam; a second cam follower 20 that follows the second cam 16; cam grooves 48 respectively provided in the first and second cams; a first engaging pin and a second engaging pin that engage with the respective cam grooves; and a rotational driving force transmitter that transmits a rotational driving force of an electric motor to the first and second cams, wherein the first cam and the first cam follower are arranged on a front side in the vehicle front-rear direction of an axle, and the second cam and the second cam follower are arranged on a rear side in the vehicle front-rear direction of the axle.
    Type: Application
    Filed: November 26, 2018
    Publication date: May 30, 2019
    Inventors: Ryosuke YAMAZAKI, Takumi INAGAKI
  • Publication number: 20190161114
    Abstract: A wheel steering system is provided that improves an environment of an actuator being mounted and reduces changes in toe angles of wheels at the time of a suspension stroke. The system includes: right and left hub carriers supported by a rear suspension mechanism; right and left tie rods having outer ends in a vehicle width direction thereof pivotally connected to the right and left hub carriers; and a Watts link having inner ends in the vehicle width direction of the right and left tie rod pivotally attached thereto so as to be pivotable about a pivot axis, wherein the actuator and the Watts link are arranged above springs, and the Watts link is connected with the actuator so as to be displaceable substantially along the vehicle width direction when a driving force of the actuator is inputted to the Watts link.
    Type: Application
    Filed: November 26, 2018
    Publication date: May 30, 2019
    Inventors: Ryosuke YAMAZAKI, Takumi INAGAKI
  • Publication number: 20190111746
    Abstract: A suspension device includes knuckles that rotatably retain rear wheels, an electric actuator that steers the rear wheels, paired tie rods that are connected to the electric actuator via a link mechanism and driven back and forth by the electric actuator, brackets that are rotated by the tie rods, and a lower arm attached to the brackets. Each bracket is rotatable between the knuckle and the lower arm.
    Type: Application
    Filed: October 10, 2018
    Publication date: April 18, 2019
    Inventors: Ryosuke YAMAZAKI, Takumi INAGAKI
  • Patent number: 10167418
    Abstract: A hot melt silicone that is non-flowable at 25° C. and that has a melt viscosity at 100° C. of 5,000 Pa·s or less, the hot melt silicone being formed by subjecting (A) an alkenyl group-containing organopolysiloxane in which 10 mol % or greater of all of silicon atom-bonded organic groups is a phenyl group, and (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule to hydrosilylation reaction in the presence of (C) a hydrosilylation reaction catalyst; and a curable hot melt composition comprising: (I) the hot melt silicone; (II) an organopolysiloxane which has at least two silicon atom-bonded hydrogen atoms in a molecule and in which the amount of silicon atom-bonded hydrogen atom is 0.5 mass % or greater; and (III) a hydrosilylation reaction catalyst. The hot melt silicone is non-flowable at 25° C., has a low surface stickiness, and easily melts by heating. Furthermore, this curable hot melt composition has both hot melt properties and curability.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: January 1, 2019
    Assignee: Dow Corning Co., Ltd.
    Inventors: Haruna Yamazaki, Makoto Yoshitake, Ryosuke Yamazaki