Patents by Inventor Ryosuke Yamazaki
Ryosuke Yamazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10167418Abstract: A hot melt silicone that is non-flowable at 25° C. and that has a melt viscosity at 100° C. of 5,000 Pa·s or less, the hot melt silicone being formed by subjecting (A) an alkenyl group-containing organopolysiloxane in which 10 mol % or greater of all of silicon atom-bonded organic groups is a phenyl group, and (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule to hydrosilylation reaction in the presence of (C) a hydrosilylation reaction catalyst; and a curable hot melt composition comprising: (I) the hot melt silicone; (II) an organopolysiloxane which has at least two silicon atom-bonded hydrogen atoms in a molecule and in which the amount of silicon atom-bonded hydrogen atom is 0.5 mass % or greater; and (III) a hydrosilylation reaction catalyst. The hot melt silicone is non-flowable at 25° C., has a low surface stickiness, and easily melts by heating. Furthermore, this curable hot melt composition has both hot melt properties and curability.Type: GrantFiled: June 16, 2015Date of Patent: January 1, 2019Assignee: Dow Corning Co., Ltd.Inventors: Haruna Yamazaki, Makoto Yoshitake, Ryosuke Yamazaki
-
Publication number: 20180280666Abstract: A medical elongated body is disclosed, which is able to make a nick in a stenosed site and is capable of preferably widening the stenosed site in which the nick is made. A balloon catheter is disclosed, which includes a shaft, a dilation member that is fixed to the shaft on a distal side, and an elastic member that is disposed on an inner surface of the dilation member. The dilation member includes a projection portion, which is a part of the dilation member protruding in a radial direction due to the elastic member disposed at a position where the inner surfaces of the dilation member face each other. A material of the elastic member is configured to be a material, which is further stretched than a material of the dilation member in a circumferential direction when the dilation member dilates.Type: ApplicationFiled: March 29, 2018Publication date: October 4, 2018Applicant: TERUMO KABUSHIKI KAISHAInventor: Ryosuke YAMAZAKI
-
Publication number: 20180208816Abstract: A hot melt silicone that is non-flowable at 25° C. and that has a melt viscosity at 100° C. of 5,000 Pa·s or less, the hot melt silicone being formed by subjecting (A) an alkenyl group-containing organopolysiloxane in which 10 mol % or greater of all of silicon atom-bonded organic groups is a phenyl group, and (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule to hydrosilylation reaction in the presence of (C) a hydrosilylation reaction catalyst; and a curable hot melt composition comprising: (I) the hot melt silicone; (II) an organopolysiloxane which has at least two silicon atom-bonded hydrogen atoms in a molecule and in which the amount of silicon atom-bonded hydrogen atom is 0.5 mass % or greater; and (III) a hydrosilylation reaction catalyst. The hot melt silicone is non-flowable at 25° C., has a low surface stickiness, and easily melts by heating. Furthermore, this curable hot melt composition has both hot melt properties and curability.Type: ApplicationFiled: June 16, 2015Publication date: July 26, 2018Inventors: Haruna Yamazaki, Makoto Yoshitake, Ryosuke Yamazaki
-
Publication number: 20180105720Abstract: A primer composition is provided. The primer composition comprises: (A) an organosiloxane block copolymer represented by the average unit formula: (R12SiO2/2)a(R2SiO3/2)b, wherein each R1 and R2 is independently an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms, “a” is a number in the range of 0.40 to 0.90, “b” is a number in the range of 0.10 to 0.60, and “a+b”=1.00, and having 0.5 to 35.0 mol % of silicon atom-bonded hydroxyl groups or silicon atom-bonded alkoxy groups, in which resinous siloxane blocks are connected by linear siloxane blocks; (B) a curing catalyst; and (C) an organic solvent. The primer composition improves the adhesion of silicone-cured products to base materials of optical semiconductor elements, package materials, substrates etc., and can suppress peeling or cracking caused by heat cycles.Type: ApplicationFiled: February 23, 2016Publication date: April 19, 2018Inventors: Ryosuke YAMAZAKI, Hiroaki YOSHIDA, Shin YOSHIDA
-
Publication number: 20180105692Abstract: A curable granular silicone composition is provided, which may be in a pellet form. The curable granular silicone composition comprises: (A) hot meltable silicone fine particles having a hydrosilylation reactive group and/or radical reactive group, with a softening point of 30° C. or higher; (B) a filler that does not have a softening point or does not soften below the softening point of component (A); and (C) a curing agent. The curable granular silicone composition has hot melt properties, and has excellent handling workability and curability.Type: ApplicationFiled: February 23, 2016Publication date: April 19, 2018Inventors: Toru IMAIZUMI, Kouichi OZAKI, Ryosuke YAMAZAKI
-
Publication number: 20170355804Abstract: Disclosed is a curable organopolysiloxane composition, comprising: (A) a curing reactive organopolysiloxane component formed by curing or semi-curing and reacting at least two or more types of organopolysiloxanes in the presence of one or more types of catalysts; and (B) a peroxide. The composition is a non-fluid at 25° C., and the melt viscosity at 100° C. is 8000 Pa·s or lower. A sealing agent comprising the curable organopolysiloxane composition and a cured product of the curable organopolysiloxane composition are also disclosed, along with a method of molding a cured product and a semiconductor device comprising the cured product.Type: ApplicationFiled: December 17, 2015Publication date: December 14, 2017Inventors: Toyohiko FUJISAWA, Nohno TODA, Ryosuke YAMAZAKI
-
Patent number: 9808603Abstract: A medical instrument includes a first elongated member including: a fluid lumen through which a fluid is flowable, an aperture opening located in a distal end surface of the first elongated member; a second elongated member including: an insertion lumen in which the first elongated member is insertable, and a discharge section through which the fluid can be discharged; and a movement section configured to form a seal between the first elongated member and the second elongated member in a state where the first elongated member is disposed in the insertion lumen of the second elongated member, the movement section being configured to allow the first elongated member and the second elongated member to move relative to each other such that the discharge section of the second elongated member is positionable on a distal side of the aperture of the first elongated member.Type: GrantFiled: March 24, 2015Date of Patent: November 7, 2017Assignee: TERUMO KABUSHIKI KAISHAInventors: Ryosuke Yamazaki, Satoru Suehara
-
Patent number: 9345863Abstract: A bending operating member for performing a bending operation on an elongated member having flexibility in a direction intersecting an axial direction of the elongated member, the bending operating member includes a pulling member, at least a portion of the pulling member being configured to be connected to a distal portion of the elongated member such that, when the pulling member is pulled in the axial direction of the elongated member, the pulling member causes the elongated member to bend; a moving member that is connected to the pulling member, the moving member being configured to move so as to pull the pulling member in the axial direction of the elongated member; a rotating member that is operatively connected to the moving member and is rotatable around a longitudinal axis of the elongated member; and a converting part that converts rotation of the rotating member into movement of the moving member.Type: GrantFiled: March 19, 2014Date of Patent: May 24, 2016Assignee: TERUMO KABUSHIKI KAISHAInventors: Ryosuke Yamazaki, Satoru Suehara
-
Publication number: 20150196738Abstract: A medical instrument includes a first elongated member including: a fluid lumen through which a fluid is flowable, an aperture opening located in a distal end surface of the first elongated member; a second elongated member including: an insertion lumen in which the first elongated member is insertable, and a discharge section through which the fluid can be discharged; and a movement section configured to form a seal between the first elongated member and the second elongated member in a state where the first elongated member is disposed in the insertion lumen of the second elongated member, the movement section being configured to allow the first elongated member and the second elongated member to move relative to each other such that the discharge section of the second elongated member is positionable on a distal side of the aperture of the first elongated member.Type: ApplicationFiled: March 24, 2015Publication date: July 16, 2015Applicant: Terumo Kabushiki KaishaInventors: Ryosuke YAMAZAKI, Satoru Suehara
-
Publication number: 20150183960Abstract: The present invention relates to a reactive silicone composition comprising: (A) an alkenyl group-containing organopolysiloxane represented by the average unit formula; (B) an alkenyl group-containing organopolysiloxane represented by the general formula; (C) a silicon atom-bonded hydrogen atom-containing organopolysiloxane represented by the general formula; (D) a hydrosilylation reaction catalyst; (E) a white pigment; and (F) non-spherical silica, spherical silica or glass fibers, a reactive thermoplastic article obtained by the composition to reaction under specified conditions, a cured product obtained by heating the article, and an optical semiconductor device having the cured product. The reactive silicone composition is a solid at an ordinary temperature and gives a reactive thermoplastic article that is fluidized at elevated temperatures. The reactive thermoplastic article is once fluidized upon heating and then gives a cured product.Type: ApplicationFiled: June 18, 2013Publication date: July 2, 2015Applicant: Dow Corning Toray Co., Ltd.Inventors: Ryosuke Yamazaki, Haruna Yamazaki, Makoto Yoshitake
-
Patent number: 9045641Abstract: A curable silicone composition comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having 10 or less silicon atoms, wherein 30 to 60 mole % of all silicon atom-bonded organic groups are alkenyl groups having from 2 to 6 carbons; (C) an organopolysiloxane represented by a general formula; (D) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is 20 to 70 mole %; (E) an organopolysiloxane represented by an average unit formula; (F) a hydrosilylation reaction catalyst; (G) a white pigment; and (H) an inorganic filler other than a white pigment, has excellent formability for forming a cured product that has little discoloration and lowering of mechanical strength by heat and light, has high light reflectance, has excellent dimensional stability, and is capable of good attachment by a sealing agent used for an optical semiconductoType: GrantFiled: February 1, 2013Date of Patent: June 2, 2015Assignee: DOW CORNING TORAY CO., LTD.Inventors: Makoto Yoshitake, Ryosuke Yamazaki
-
Patent number: 9048406Abstract: A curable silicone composition comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having 10 or less silicon atoms, wherein 30 to 60 mole % of all silicon atom-bonded organic groups are alkenyl groups having from 2 to 6 carbons; (C) an organopolysiloxane represented by a general formula; (D) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is at least 20 mole %; (E) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is less than 20 mole %; (F) a hydrosilylation reaction catalyst; (G) a white pigment; and (H) an inorganic filler other than a white pigment, has excellent formability for forming a cured product that has little discoloration and lowering of mechanical strength by heat and lightType: GrantFiled: February 1, 2013Date of Patent: June 2, 2015Assignee: DOW CORNING TORAY CO., LTD.Inventors: Ryosuke Yamazaki, Makoto Yoshitake
-
Publication number: 20150001569Abstract: A curable silicone composition comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having 10 or less silicon atoms, wherein 30 to 60 mole % of all silicon atom-bonded organic groups are alkenyl groups having from 2 to 6 carbons; (C) an organopolysiloxane represented by a general formula; (D) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is 20 to 70 mole %; (E) an organopolysiloxane represented by an average unit formula; (F) a hydrosilylation reaction catalyst; (G) a white pigment; and (H) an inorganic filler other than a white pigment, has excellent formability for forming a cured product that has little discoloration and lowering of mechanical strength by heat and light, has high light reflectance, has excellent dimensional stability, and is capable of good attachment by a sealing agent used for an optical semiconductoType: ApplicationFiled: February 1, 2013Publication date: January 1, 2015Inventors: Makoto Yoshitake, Ryosuke Yamazaki
-
Publication number: 20140367723Abstract: A curable silicone composition comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having 10 or less silicon atoms, wherein 30 to 60 mole % of all silicon atom-bonded organic groups are alkenyl groups having from 2 to 6 carbons; (C) an organopolysiloxane represented by a general formula; (D) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is at least 20 mole %; (E) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is less than 20 mole %; (F) a hydrosilylation reaction catalyst; (G) a white pigment; and (H) an inorganic filler other than a white pigment, has excellent formability for forming a cured product that has little discoloration and lowering of mechanical strength by heat and lightType: ApplicationFiled: February 1, 2013Publication date: December 18, 2014Inventors: Ryosuke Yamazaki, Makoto Yoshitake
-
Publication number: 20140207059Abstract: A bending operating member for performing a bending operation on an elongated member having flexibility in a direction intersecting an axial direction of the elongated member includes a pulling member, at least a portion of the pulling member being configured to be connected to a distal portion of the elongated member such that, when said pulling member is pulled in the axial direction of the elongated member, the pulling member causes the elongated member to bend; a moving member that is connected to the pulling member, the moving member being configured to move so as to pull the pulling member in the axial direction of the elongated member; a rotating member that is operatively connected to the moving member and is rotatable around an axis of the elongated member; and a converting part that converts rotation of the rotating member into movement of the moving member.Type: ApplicationFiled: March 19, 2014Publication date: July 24, 2014Applicant: Terumo Kabushiki KaishaInventors: Ryosuke YAMAZAKI, Satoru SUEHARA
-
Publication number: 20140175505Abstract: The present invention provides an encapsulant for optical semiconductor devices, which is capable of suppressing surface tackiness of a cured product and is also capable of enhancing the heat resistance and thermal cycle characteristics of the cured product. An encapsulant for optical semiconductor devices according to the present invention which includes: a first organopolysiloxane which is represented by formula (1A) or formula (1B) and has an alkenyl group and a methyl group bonded to a silicon atom; a second organopolysiloxane which is represented by formula (51A) or formula (51B) and has a hydrogen atom bonded to a silicon atom and a methyl group bonded to a silicon atom; and a catalyst for hydrosilylation reaction, and the content ratios of methyl groups bonded to silicon atoms in the first and second organopolysiloxanes each are 80 mol % or more.Type: ApplicationFiled: July 11, 2012Publication date: June 26, 2014Inventors: Ryosuke Yamazaki, Mitsuru Tanikawa, Takashi Watanabe, Osamu Inui, Yoshitaka Kunihiro, Chizuru Kimu, Yusuke Kobayashi, Hidefumi Yasui, Minoru Suezaki, Yasunari Kusaka, Tasuku Yamada
-
Publication number: 20140088411Abstract: There is provided a catheter insertion supporting system including an extraction section configured to extract a contour shape of at least one of organs of a subject represented on a two-dimensional image picked up by an image pickup element of a catheter inserted in the body of the subject; a detection section configured to detect, in a three-dimensional CT image of the subject, a cross section which includes a contour shape which at least partly coincides with the contour shape extracted by the extraction section; and a display section configured to display a portion of the three-dimensional CT image which includes an organ having the cross section detected by the detection section together with the two-dimensional image.Type: ApplicationFiled: September 25, 2013Publication date: March 27, 2014Applicant: TERUMO KABUSHIKI KAISHAInventors: Satoru SUEHARA, Ryosuke Yamazaki, Makoto Narita
-
Publication number: 20130221400Abstract: Provided is an encapsulant for optical semiconductor devices, which is capable of enhancing the adhesion between a housing and the encapsulant when an optical semiconductor device is encapsulated in the housing, and which is also capable of enhancing the bonding reliability with respect to humidity. The encapsulant for optical semiconductor devices includes: a first organopolysiloxane having an alkenyl group bonded to a silicon atom and an aryl group bonded to a silicon atom, but not having a hydrogen atom bonded to a silicon atom; a second organopolysiloxane having a hydrogen atom bonded to a silicon atom and an aryl group bonded to a silicon atom; a catalyst for hydrosilylation reaction; and an organic compound having a titanium atom.Type: ApplicationFiled: September 15, 2011Publication date: August 29, 2013Inventors: Mitsuru Tanikawa, Takashi Watanabe, Osamu Inui, Yoshitaka Kunihiro, Ryosuke Yamazaki, Yusuke Kobayashi
-
Patent number: 8519429Abstract: The present invention provides a sealant for an optical semiconductor device which is less likely to reduce its luminance and is also less likely to change its color even used in an energized state in harsh environments of high temperature and high humidity. The sealant for an optical semiconductor device includes: a first organopolysiloxane not containing a hydrogen atom bound to a silicon atom, but containing an alkenyl group bound to a silicon atom and an aryl group bound to a silicon atom, a second organopolysiloxane containing a hydrogen atom bound to a silicon atom and an aryl group bound to a silicon atom, and a platinum-alkenyl complex. The platinum-alkenyl complex is a reaction product obtained by reacting chloroplatinic acid hexahydrate with not less than 6 equivalent of a bi- or more-functional alkenyl compound.Type: GrantFiled: June 22, 2011Date of Patent: August 27, 2013Assignee: Sekisui Chemical Co., Ltd.Inventors: Mitsuru Tanikawa, Takashi Watanabe, Shintaro Moriguchi, Osamu Inui, Yoshitaka Kunihiro, Ryosuke Yamazaki, Ayuko Oki
-
Publication number: 20120146088Abstract: The present invention provides a sealant for an optical semiconductor device which is less likely to reduce its luminance and is also less likely to change its color even used in an energized state in harsh environments of high temperature and high humidity. The sealant for an optical semiconductor device includes: a first organopolysiloxane not containing a hydrogen atom bound to a silicon atom, but containing an alkenyl group bound to a silicon atom and an aryl group bound to a silicon atom, a second organopolysiloxane containing a hydrogen atom bound to a silicon atom and an aryl group bound to a silicon atom, and a platinum-alkenyl complex. The platinum-alkenyl complex is a reaction product obtained by reacting chloroplatinic acid hexahydrate with not less than 6 equivalent of a bi- or more-functional alkenyl compound.Type: ApplicationFiled: June 22, 2011Publication date: June 14, 2012Inventors: Mitsuru Tanikawa, Takashi Watanabe, Shintaro Moriguchi, Osamu Inui, Yoshitaka Kunihiro, Ryosuke Yamazaki, Ayuko Oki