Abstract: A method for processing a resin member includes: irradiating a first member comprising a resin with first light of a first wavelength that causes electronic excitation of the resin; and irradiating the resin electronically excited through irradiation with the first light with second light of a second wavelength longer than the first wavelength. A wavelength range of the second wavelength is within a wavelength range in which light absorption of the resin increases through electronic excitation of the resin.

Abstract: An embodiment includes: a first transport module on which a carriage moves; a second transport module that is configured to be able to move to a position for connecting to the first transport module and on which the carriage is able to move to and from the first transport module; a position detection unit that detects a position in a moving direction of the second transport module and outputs position information; a first control unit that controls motion of the carriage on the first transport module; a second control unit that controls motion of the carriage on the second transport module; a third control unit that controls motion of the second transport module; and a fourth control unit that controls the first to third control units. The fourth control unit corrects a position where the second transport module connects to the first transport module based on the position information.

Abstract: A wiring substrate that is provided enables stray capacitance between a first electrode and a second electrode to be prevented from varying when an undulation occurs in the wiring substrate. Insulating layers are stacked. A first electrode and a second electrode are formed between the same layers at an interval. The thickness of the first electrode is more than the thickness of the second electrode. The lower main surface of the first electrode is located at a position lower than the lower main surface of the second electrode, and the upper main surface of the first electrode is located at a position higher than the upper main surface of the second electrode when seen through in a direction perpendicular to a stacking direction of the insulating layers.

Abstract: In a road parameter estimation apparatus, a marker-based estimator extracts, based on markers extracted by a marker extractor, at least one lane line that demarcates a road into plural regions in a width direction of the road, and estimates, based on the extracted at least one lane line, a value of at least one feature parameter of the road as a maker-based estimation result. The at least one feature parameter of the road represents at least one feature of the road. A model-based estimator estimates, based on the at least one model-based demarcation line, a value of the at least one feature parameter of the road parameter as a model-based estimation result. A determiner compares the at least one lane line with the model-based demarcation line to accordingly determine whether to use the marker-based estimation result or the model-based estimation result.

Abstract: A wing lock structure includes: a block provided to a side gate, and provided with a plurality of convex portions that are convex in a width direction of a vehicle and concave portions that are concave in the width direction of the vehicle in a longitudinal direction of the vehicle; a wing plate provided at a predetermined portion of a wing side panel facing the block in a closed state and having irregularities corresponding to the concave portions and the convex portions on a surface that comes into contact with the block; and a pressure contact portion that presses the wing plate to bring the wing plate and the block into contact by pressure.

Abstract: In a road parameter estimation apparatus, a marker-based estimator extracts, based on markers extracted by a marker extractor, at least one lane line that demarcates a road into plural regions in a width direction of the road, and estimates, based on the extracted at least one lane line, a value of at least one feature parameter of the road as a maker-based estimation result. The at least one feature parameter of the road represents at least one feature of the road. A model-based estimator estimates, based on the at least one model-based demarcation line, a value of the at least one feature parameter of the road parameter as a model-based estimation result. A determiner compares the at least one lane line with the model-based demarcation line to accordingly determine whether to use the marker-based estimation result or the model-based estimation result.

Abstract: Provided is a novel double-sided adhesive sheet for image display device which can be bonded to the adhesion surface in close contact without space therebetween although there is a step due to printing or the like on the adhesion surface to be bonded to the adhesive sheet. The double-sided adhesive sheet for image display device 1 of the invention is a sheet to bond any two adherends selected from a surface protective panel 2, a touch panel 3, and an image display panel, and the sheet is characterized in that at least one of the adherends (surface protective panel 2) has a stepped portion 2b on an adhesion surface 2a to adhere to the double-sided adhesive sheet 1 and the surface shape of the bonding surface 1a of the double-sided adhesive sheet 1 to be bonded to the adhesion surface 2a is shaped in accordance with the surface shape of the adhesion surface 2a.

Abstract: One embodiment of the present invention provides a new transparent double-sided adhesive sheet that, in bonding of image display device-constituting members provided with a step portion on the bonding surface thereof with a transparent double-sided adhesive sheet interposed therebetween, can conform to the step portion to fill every corner therewith, can also allow strain generated in the adhesive sheet to be relaxed, and furthermore can maintain foaming resistance under a high-temperature and/or high-humidity environment without impairment of handleability. One embodiment of the present invention proposes a transparent double-sided adhesive sheet in a B-stage state, in which, first, the transparent double-sided adhesive sheet contains at least one (meth)acrylate (co)polymer, an ultraviolet polymerization initiator (A) having a molar absorptivity at a wavelength of 365 nm of 10 or more and a molar absorptivity at a wavelength of 405 nm of 0.

Abstract: Provided is a novel double-sided adhesive sheet for image display device which can be bonded to the adhesion surface in close contact without space therebetween although there is a step due to printing or the like on the adhesion surface to be bonded to the adhesive sheet. The double-sided adhesive sheet for image display device 1 of the invention is a sheet to bond any two adherends selected from a surface protective panel 2, a touch panel 3, and an image display panel, and the sheet is characterized in that at least one of the adherends (surface protective panel 2) has a stepped portion 2b on an adhesion surface 2a to adhere to the double-sided adhesive sheet 1 and the surface shape of the bonding surface 1a of the double-sided adhesive sheet 1 to be bonded to the adhesion surface 2a is shaped in accordance with the surface shape of the adhesion surface 2a.

Abstract: Provided is a novel double-sided pressure-sensitive adhesive sheet that can achieve both the repeelability and the reliability in the pressure sensitive adhesive surface such as the occurrence of foaming. Proposed is a repeelable double-sided pressure-sensitive adhesive sheet comprising a pressure sensitive adhesive layer containing a (meth)acrylate ester copolymer as a base polymer, in which the (meth)acrylate ester copolymer has a content of a carboxyl group-containing monomer as a copolymerization component of 2% by mass or less and the pressure sensitive adhesive layer is curable by heat or ultraviolet light and satisfies the following physical properties (1) and (2): (1) a 180° peel force is 5.0 N/cm or more when one surface of the double-sided pressure-sensitive adhesive sheet is superimposed on soda lime glass, a roller of 1 kg is reciprocated one time to crimp the two, the crimped resultant is allowed to stand for 24 hours in an environment of a temperature of 23° C.

Abstract: There is provided an encapsulant material for solar cells which facilitates production of a solar cell module and is excellent in flexibility, heat resistance, transparency, etc., and a solar cell module produced using the encapsulant material. The present invention relates to an encapsulant material for solar cells which includes a resin composition (C) containing an ethylene-?-olefin random copolymer (A) capable of satisfying the following condition (a) and an ethylene-?-olefin block copolymer (B) capable of satisfying the following condition (b): (a) a heat of crystal fusion is from 0 to 70 J/g as measured in differential scanning calorimetry at a heating rate of 10° C./min; and (b) a crystal fusion peak temperature is 100° C. or higher and a heat of crystal fusion is from 5 to 70 J/g as measured in differential scanning calorimetry at a heating rate of 10° C./min.

Abstract: Provided is a cover film for solar cells, with which solar cell modules are easy to produce, which comprises an encapsulant resin layer excellent in softness, transparency and heat resistance, and a weather-resistant layer excellent in weather resistance, moisture proofness, transparency and heat resistance and having high adhesiveness to the encapsulant resin layer, and is therefore excellent in handleability, and which is effective for reducing the weight of solar cell modules and for enhancing the impact resistance and the durability thereof; and also provided is a solar cell module produced by the use of the cover film for solar cells. Disclosed is production of a cover film for solar cells by laminating weather-resistant layer or a surface protective layer, and an encapsulant resin layer comprising a resin composition that contains an ethylene-a-olefin random copolymer and an ethylene-?-olefin block copolymer both having specific thermal properties.

Abstract: A semiconductor device has a semiconductor substrate, a multi-layered wiring construction formed over the semiconductor device, and a metal-insulator-metal (MIM) capacitor arrangement established in the multi-layered wiring construction. The MIM capacitor arrangement includes first, second, third, fourth, fifth, and sixth electrode structures, which are arranged in order in parallel with each other at regular intervals. The first, second, fifth and sixth electrode structures are electrically connected to each other so as to define a first capacitor, and the third and fourth electrode structures are electrically connected to each other so as to define a second capacitor.

Abstract: There is provided an encapsulant material for solar cells which facilitates production of a solar cell module and is excellent in flexibility, heat resistance, transparency, etc., and a solar cell module produced using the encapsulant material. The present invention relates to an encapsulant material for solar cells which includes a resin composition (C) containing an ethylene-?-olefin random copolymer (A) capable of satisfying the following condition (a) and an ethylene-?-olefin block copolymer (B) capable of satisfying the following condition (b): (a) a heat of crystal fusion is from 0 to 70 J/g as measured in differential scanning calorimetry at a heating rate of 10° C./min; and (b) a crystal fusion peak temperature is 100° C. or higher and a heat of crystal fusion is from 5 to 70 J/g as measured in differential scanning calorimetry at a heating rate of 10° C./min.

Abstract: A semiconductor device has a semiconductor substrate, a multi-layered wiring construction formed over the semiconductor device, and a metal-insulator-metal (MIM) capacitor arrangement established in the multi-layered wiring construction. The MIM capacitor arrangement includes first, second, third, fourth, fifth, and sixth electrode structures, which are arranged in order in parallel with each other at regular intervals. The first, second, fifth and sixth electrode structures are electrically connected to each other so as to define a first capacitor, and the third and fourth electrode structures are electrically connected to each other so as to define a second capacitor.

Abstract: A semiconductor device has a semiconductor substrate, a multi-layered wiring construction formed over the semiconductor device, and a metal-insulator-metal (MIM) capacitor arrangement established in the multi-layered wiring construction. The MIM capacitor arrangement includes first, second, third, fourth, fifth, and sixth electrode structures, which are arranged in order in parallel with each other at regular intervals. The first, second, fifth and sixth electrode structures are electrically connected to each other so as to define a first capacitor, and the third and fourth electrode structures are electrically connected to each other so as to define a second capacitor.

Abstract: A semiconductor device has a semiconductor substrate, a multi-layered wiring construction formed over the semiconductor device, and a metal-insulator-metal (MIM) capacitor arrangement established in the multi-layered wiring construction. The MIM capacitor arrangement includes first, second, third, fourth, fifth, and sixth electrode structures, which are arranged in order in parallel with each other at regular intervals. The first, second, fifth and sixth electrode structures are electrically connected to each other so as to define a first capacitor, and the third and fourth electrode structures are electrically connected to each other so as to define a second capacitor.

Abstract: According to one aspect of the present invention, there is provided a voltage controlled oscillator controlling frequency of an output signal according to input voltage, the voltage controlled oscillator including a current controlled oscillator setting the frequency of the output signal based on control current, and a voltage-current converter including a transistor controlling a current amount of the control current according to the input voltage, in which the voltage-current converter is supplied with control voltage, and threshold value voltage of the transistor is controlled according to the control voltage.

Abstract: A semiconductor device has a semiconductor substrate, a multi-layered wiring construction formed over the semiconductor device, and a metal-insulator-metal (MIM) capacitor arrangement established in the multi-layered wiring construction. The MIM capacitor arrangement includes first, second, third, fourth, fifth, and sixth electrode structures, which are arranged in order in parallel with each other at regular intervals. The first, second, fifth and sixth electrode structures are electrically connected to each other so as to define a first capacitor, and the third and fourth electrode structures are electrically connected to each other so as to define a second capacitor.

Abstract: A semiconductor device includes a capacitor with an MIM structure, by which the dimensional accuracy of the device is improved, and a stable capacitance value is given. The semiconductor device 100 includes: a semiconductor substrate 102; a capacitor forming region 130 in which an MIM capacitor is formed, which has an insulating interlayer 104 formed on the semiconductor substrate 102, a first electrode 110, and a second electrode 112, and the first electrode 110 and the second electrode 112 are arranged facing each other through the insulating interlayer 104; and a shielding region 132 which includes a plurality of shielding electrodes 114 formed in the outer edge of the capacitor forming region 130 and, at the same time, set at a predetermined potential in the same layer as that of the MIM capacitor on the semiconductor substrate 102, and shields the capacitor forming region 130 from other regions.