Abstract: The strength of an electronic component package against an external pressure is improved. According to the invention, in order to realize this, in an electronic component package in which an electronic component mounted on a mounting substrate via external electrodes placed on the mounting substrate is covered by a mold resin, the electronic component has a component cover which covers elements placed on the lower face of a component substrate, and which forms cavities, and a protective member which is lower in elastic modulus than the mold resin is disposed in a portion which excludes portions joined with the external electrodes in a lower face of the component cover, and which is opposed to the cavities.

Abstract: An electronic part, object of which is to improve temperature characteristics and electrical properties, includes a substrate (1), a comb-type electrode (2) that is disposed on the upper surface of the substrate (1), and a protective film (4) that covers the comb-type electrode (2) and has an uneven shape at its top surface. If the pitch width of one pitch in the uneven shape of the protective film (4) is L, the width of one pitch of a convex portion (4a) of the unevenness in the uneven shape of the protective film (4) is L1, the width of one pitch of a concave portion (4b) thereof is L2, the pitch width of one pitch of the comb-type electrode (2) is p, the width of one of electrode fingers which form the comb-type electrode (2) is p1 and the width between the electrode fingers is p2, then each parameter is set so that the following expressions are satisfied, L1?p1and L2?p2(herein, the correlations of L?p, p1+p2=p and L1+L2=L are satisfied).

Abstract: A surface acoustic wave device includes a piezoelectric substrate and a lid spaced apart from each other oppositely by a specific interval. A comb electrode and a pad electrode are provided to the piezoelectric substrate on a main surface on the lid side, and an external terminal is provided to the lid on a surface on the opposite side to the piezoelectric substrate. Further, the surface acoustic wave device includes a connection electrode that electrically connects the pad electrode and the external terminal, and an insulator interposed between at least one of the main surface of the piezoelectric substrate and the pad electrode and the lid.

Abstract: An electronic part includes: a substrate; a comb-shaped electrode having a plurality of electrode fingers arranged parallel to one another on the upper surface of the substrate; and a protective film formed on the upper surface of the substrate so as to cover the comb-shaped electrode. The protective film has convex portions and concave portions. The convex portions are upwardly convex at the positions corresponding to the electrode fingers, and the concave portions are downwardly concave between the convex portions. The cross section of the protective film in the direction orthogonal to the extending direction of the electrode fingers has a downward convex curve between apex portions of the convex portions.

Abstract: A surface acoustic wave device includes a piezoelectric substrate, a comb-shaped electrode formed on a first principal face of the piezoelectric substrate, and a supporting substrate bonded to a second principal face of the piezoelectric substrate. The second principal face of the piezoelectric substrate is bonded to the supporting substrate via a metal layer. A method of manufacturing the surface acoustic wave device includes the steps of: forming a first metal layer on the second principal face of the piezoelectric substrate, forming a second metal layer on a principal face of the supporting substrate, activating the surfaces of the first and second metal layers in plasma atmosphere, bonding the first and second metal layers together at room temperature, and forming the comb-shaped electrode on the first principal face of the piezoelectric substrate.

Abstract: An actuator includes a base, an arm having an elastic property and supported by the base, electrostatic-driving electrodes provided on the base and the arm, respectively, and a piezoelectric-driving layer. The piezoelectric-driving layer includes a first electrode layer on the arm, a piezoelectric layer on the first electrode layer, and a second electrode layer on the piezoelectric layer. This actuator can be driven quickly with a low voltage.

Abstract: The present invention relates to an electronic part, and its object is to improve temperature characteristics and electrical properties. In order to attain the object, the electronic part according to the present invention includes a substrate (1), a comb-type electrode (2) that is disposed on the upper surface of the substrate (1), and a protective film (4) that covers the comb-type electrode (2) and has an uneven shape at its top surface.

Abstract: The invention relates to a SAW filter, an antenna duplexer using the same, and a mobile communication terminal using the same, and assures a high withstanding power characteristic and a sufficient isolation between transmitting terminal and receiving terminal. The invention relates to a ladder-type SAW filter composed by alternately connecting a serial branch having at least one SAW resonator connected in series to a signal path, and a parallel branch having at least one SAW resonator connected between the signal path and the ground, in which the sizes of wiring patterns of the parallel branch are smaller than wiring patterns of the serial branch. Therefore, in the case of the serial-branch input type, inductive components of the parallel-branch wiring patterns can be decreased, so that a large reflection coefficient may be obtained in the rejection band.

Abstract: The present invention relates to a surface acoustic wave filter used in frequency filter of portable telephone and other mobile communication device, and is intended to realize a surface acoustic wave filter capable of obtaining a stable filter characteristic even in the event of input of a large signal. The invention includes resonators (5) to (8) formed on a piezoelectric substrate (3), through-holes (12) provided near the resonators (5) to (8), and a conductive material (13) filling up the through-holes (12), in which the through-holes (12) filled up with the conductive material (13) are electrically grounded. In this constitution, by the through-holes (12) provided near the resonators (5) to (8) and filled up with the conductive material (13), the heat generated in the resonators (5) to (8) when a large signal is applied to the input terminal (1) can be released, so that a stable filter characteristic may be maintained if a large signal is applied.

Abstract: As the electrode material of a surface acoustic wave device, a laminated body laminating a second metal layer 5 on a first metal layer 4 is stacked up in two or more stages, and the first metal layer 4 is a metal of which coefficient of diffusion to Al is smaller than the coefficient of self diffusion of Al, and the second metal layer 5 is composed of an Al alloy of three elements or more containing at least one or more metals which forms solid solution with Al at ordinary temperature, and at least one or more metals forming segregation at the grain boundary of Al or an intermetallic compound with Al at ordinary temperature, and therefore the surface acoustic wave device excellent in electric power tolerance, compatible with the conventional pattern forming technology, stable thermally, and capable of preventing increase of insertion loss can be obtained.