Abstract: A method of manufacturing a piezoelectric thin film resonator which can reduce variations in resonant frequency and resonant resistance by uniformly planarizing a structural film. The method of manufacturing the piezoelectric thin film resonator includes the steps of forming sacrifice layer patterns on an upper surface of a mother substrate; forming a dielectric film on the sacrifice layer patterns; processing a surface of the dielectric film by a plasma treatment; forming vibration portions on the dielectric film, the vibration portions each being composed of two excitation electrodes and a piezoelectric thin film provided therebetween; etching the sacrifice layer patterns; and cutting the mother substrate into separate piezoelectric thin film resonators.

Abstract: A method for producing a piezoelectric thin-film resonator includes forming a sacrificial layer on a substrate, performing a plasma treatment on the sacrificial layer so that the surface roughness (Ra) of end surface portions of the sacrificial layer is about 5 nm or less, forming a strip-shaped dielectric film so as to be continuously disposed on the surface of the substrate and the end surface portions and the principal surface of the sacrificial layer, forming a piezoelectric thin-film area including a lower electrode, an upper electrode, and a piezoelectric thin-film disposed therebetween so that a portion of the lower electrode and a portion of the upper electrode surface each other at an area on the dielectric film, the area being disposed on the upper portion of the sacrificial layer, and removing the sacrificial layer to form an air-gap between the substrate and the dielectric film.

Abstract: A piezoelectric electronic component for use in a cellular phone or the like and capable of achieving reductions in size and profile is provided. A piezoelectric element oscillating in response to application of an input signal and outputting an output signal corresponding to the oscillations is provided on a substrate. The piezoelectric element includes a pad, the pad inputting and outputting the input and output signals. A shell member serving as a sealing member and having an insulation film covering the piezoelectric element is provided on the substrate, the shell member being remote from the piezoelectric element. The shell member includes a through hole above the pad, and the through hole is occluded with an electrode.

Abstract: A method for producing a piezoelectric thin-film resonator includes forming a sacrificial layer on a substrate, performing a plasma treatment on the sacrificial layer so that the surface roughness (Ra) of end surface portions of the sacrificial layer is about 5 nm or less, forming a strip-shaped dielectric film so as to be continuously disposed on the surface of the substrate and the end surface portions and the principal surface of the sacrificial layer, forming a piezoelectric thin-film area including a lower electrode, an upper electrode, and a piezoelectric thin-film disposed therebetween so that a portion of the lower electrode and a portion of the upper electrode surface each other at an area on the dielectric film, the area being disposed on the upper portion of the sacrificial layer, and removing the sacrificial layer to form an air-gap between the substrate and the dielectric film.

Abstract: A method for producing a piezoelectric thin-film resonator includes forming a sacrificial layer on a substrate, performing a plasma treatment on the sacrificial layer so that the surface roughness (Ra) of end surface portions of the sacrificial layer is about 5 nm or less, forming a strip-shaped dielectric film so as to be continuously disposed on the surface of the substrate and the end surface portions and the principal surface of the sacrificial layer, forming a piezoelectric thin-film area including a lower electrode, an upper electrode, and a piezoelectric thin-film disposed therebetween so that a portion of the lower electrode and a portion of the upper electrode surface each other at an area on the dielectric film, the area being disposed on the upper portion of the sacrificial layer, and removing the sacrificial layer to form an air-gap between the substrate and the dielectric film.

Abstract: A piezoelectric thin film resonator which can reduce variations in resonant frequency and resonant resistance by uniformly planarizing a structural film, and a method of manufacturing the piezoelectric thin film resonator. The piezoelectric thin film resonator has a substrate having at least one flat major surface; a dielectric film having two support portions supported by the major surface of the substrate and a floating portion which is connected to the support portions and which is disposed over the major surface of the substrate with an airspace layer provided therebetween; and a vibration portion which is formed of a pair of electrodes and a piezoelectric thin film provided therebetween and which is provided on the floating portion of the dielectric film at a side opposite to the airspace layer. A surface of the dielectric film at a side opposite to the substrate is planarized by a plasma treatment using an inert gas or a gas containing an element forming a dielectric film.

Abstract: A piezoelectric filter that includes a first substrate having at least one first piezoelectric resonator disposed on a main surface thereof; a second substrate having at least one second piezoelectric resonator disposed on a main surface thereof. A connection pattern extends around the first piezoelectric resonator and the second piezoelectric resonator and is disposed between the first substrate and the second substrate such that the main surface of the first substrate faces the main surface of the second substrate, and the first piezoelectric resonator is remote from the second piezoelectric resonator. A connecting layer bonds a pad disposed on the main surface of the first substrate to a pad disposed on the main surface of the second substrate, and is electrically connected to the first piezoelectric resonator and the second piezoelectric resonator.

Abstract: A piezoelectric electronic component for use in a cellular phone or the like and capable of achieving reductions in size and profile is provided. A piezoelectric element oscillating in response to application of an input signal and outputting an output signal corresponding to the oscillations is provided on a substrate. The piezoelectric element includes a pad, the pad inputting and outputting the input and output signals. A shell member serving as a sealing member and having an insulation film covering the piezoelectric element is provided on the substrate, the shell member being remote from the piezoelectric element. The shell member includes a through hole above the pad, and the through hole is occluded with an electrode.

Abstract: A piezoelectric electronic component for use in a cellular phone or the like and capable of achieving reductions in size and profile is provided. A piezoelectric element oscillating in response to application of an input signal and outputting an output signal corresponding to the oscillations is provided on a substrate. The piezoelectric element includes a pad, the pad inputting and outputting the input and output signals. A shell member serving as a sealing member and having an insulation film covering the piezoelectric element is provided on the substrate, the shell member being remote from the piezoelectric element. The shell member includes a through hole above the pad, and the through hole is occluded with an electrode.

Abstract: A piezoelectric thin film resonator that ensures the strength of a membrane without degrading the resonant properties and which can be easily handled in mounting. The piezoelectric thin film resonator has a substrate, a thin film member, and reinforcing films. The thin film member has at least two support portions supported by the substrate and a floating portion disposed over the substrate with a space provided therebetween and supported by the support portions. The floating portion includes a pair of excitation electrodes facing each other and a piezoelectric thin film provided therebetween. The reinforcing films are formed in the vicinities of the boundaries between the floating portion and the support portions of the thin film member.

Abstract: A method for manufacturing an electronic device includes the steps of forming a first resist pattern on a primary surface of a SAW element, the first resist pattern having openings at positions corresponding to those at which bumps and a sealing frame are to be formed, sequentially forming metals over the first resist pattern, the metals being formed into adhesion layers, barrier metal layers, and solder layers, removing the first resist pattern on the SAW element such that the bumps and the sealing frame are simultaneously formed. When the bumps and the sealing frame of the SAW element are bonded to bond electrodes of the bond substrate, the solder layers are melted and alloyed by heating.

Abstract: A piezoelectric thin film resonator which can reduce variations in resonant frequency and resonant resistance by uniformly planarizing a structural film, and a method of manufacturing the piezoelectric thin film resonator. The piezoelectric thin film resonator has a substrate having at least one flat major surface; a dielectric film having two support portions supported by the major surface of the substrate and a floating portion which is connected to the support portions and which is disposed over the major surface of the substrate with an airspace layer provided therebetween; and a vibration portion which is formed of a pair of electrodes and a piezoelectric thin film provided therebetween and which is provided on the floating portion of the dielectric film at a side opposite to the airspace layer. A surface of the dielectric film at a side opposite to the substrate is planarized by a plasma treatment using an inert gas or a gas containing an element forming a dielectric film.

Abstract: A piezoelectric thin film resonator that ensures the strength of a membrane without degrading the resonant properties and which can be easily handled in mounting. The piezoelectric thin film resonator has a substrate, a thin film member, and reinforcing films. The thin film member has at least two support portions supported by the substrate and a floating portion disposed over the substrate with a space provided therebetween and supported by the support portions. The floating portion includes a pair of excitation electrodes facing each other and a piezoelectric thin film provided therebetween. The reinforcing films are formed in the vicinities of the boundaries between the floating portion and the support portions of the thin film member.

Abstract: A piezoelectric filter that includes a first substrate having at least one first piezoelectric resonator disposed on a main surface thereof; a second substrate having at least one second piezoelectric resonator disposed on a main surface thereof. A connection pattern extends around the first piezoelectric resonator and the second piezoelectric resonator and is disposed between the first substrate and the second substrate such that the main surface of the first substrate faces the main surface of the second substrate, and the first piezoelectric resonator is remote from the second piezoelectric resonator. A connecting layer bonds a pad disposed on the main surface of the first substrate to a pad disposed on the main surface of the second substrate, and is electrically connected to the first piezoelectric resonator and the second piezoelectric resonator.

Abstract: A piezoelectric electronic component for use in a cellular phone or the like and capable of achieving reductions in size and profile is provided. A piezoelectric element oscillating in response to application of an input signal and outputting an output signal corresponding to the oscillations is provided on a substrate. The piezoelectric element includes a pad, the pad inputting and outputting the input and output signals. A shell member serving as a sealing member and having an insulation film covering the piezoelectric element is provided on the substrate, the shell member being remote from the piezoelectric element. The shell member includes a through hole above the pad, and the through hole is occluded with an electrode.

Abstract: A piezoelectric resonator includes a supporting substrate having an opening or a concavity, a vibrating section in which at least one pair of an upper electrode and a lower electrode oppose each other so as to sandwich an upper surface and a lower surface of at least one layer of piezoelectric thin film, the vibrating portion being formed over the opening or the concavity, and a heat dissipating film disposed over at least one of the upper electrode and the piezoelectric thin film so as not to cover the vibrating section.

Abstract: A method for producing a piezoelectric thin-film resonator includes forming a sacrificial layer on a substrate, performing a plasma treatment on the sacrificial layer so that the surface roughness (Ra) of end surface portions of the sacrificial layer is about 5 nm or less, forming a strip-shaped dielectric film so as to be continuously disposed on the surface of the substrate and the end surface portions and the principal surface of the sacrificial layer, forming a piezoelectric thin-film area including a lower electrode, an upper electrode, and a piezoelectric thin-film disposed therebetween so that a portion of the lower electrode and a portion of the upper electrode surface each other at an area on the dielectric film, the area being disposed on the upper portion of the sacrificial layer, and removing the sacrificial layer to form an air-gap between the substrate and the dielectric film.

Abstract: A method for manufacturing an electronic device includes the steps of forming a first resist pattern on a primary surface of a SAW element, the first resist pattern having openings at positions corresponding to those at which bumps and a sealing frame are to be formed, sequentially forming metals over the first resist pattern, the metals being formed into adhesion layers, barrier metal layers, and solder layers, removing the first resist pattern on the SAW element such that the bumps and the sealing frame are simultaneously formed. When the bumps and the sealing frame of the SAW element are bonded to bond electrodes of the bond substrate, the solder layers are melted and alloyed by heating.

Abstract: An infrared sensor is provided, which includes a substrate 12, a diaphragm 14 supported by the substrate, at least one thermocouple 17 provided with a cold junction 20 formed on the substrate and a hot junction 18 formed on the diaphragm, and an infrared-absorptive film 24 formed on the diaphragm so as to cover the hot junction of the thermocouple. The area of the infrared-absorptive film is 64% to 100% of the area of the diaphragm.

Abstract: A piezoelectric resonator includes a supporting substrate having an opening or a concavity, a vibrating section in which at least one pair of an upper electrode and a lower electrode oppose each other so as to sandwich an upper surface and a lower surface of at least one layer of piezoelectric thin film, the vibrating portion being formed over the opening or the concavity, and a heat dissipating film disposed over at least one of the upper electrode and the piezoelectric thin film so as not to cover the vibrating section.