Abstract: A plastic molded semiconductor integrated circuit device, includes: a semiconductor substrate in which circuit elements are fabricated, metal wirings for transmitting the power supply voltage or signals of internal circuits provided on the semiconductor substrate via an insulating film, a plurality of apertures produced at portions of the insulating film directly below the metal wirings, and a nail section provided integrally with the metal wiring in the aperture, wherein the nail section is provided without being electrically connected with any of the circuit elements or the other metal wirings.