Abstract: To provide a radar device capable of detecting a position of a target in a direction orthogonal to a viewing angle. In a radar device which detects a target by using a radio wave, the radar device includes: a receiving array antenna (receiving array antenna 17) where a plurality of receiving antenna elements (first receiving antenna 17-1 to eighth receiving antenna 17-8) each having a predetermined length in a first direction are arranged to be disposed in a second direction almost orthogonal to the first direction; a dispersion part (dispersion part 31) which is disposed in a vicinity of the receiving array antenna, and dispersion properties of the radio wave change with respect to the first direction; and a detection part (control and process part 15) which detects the position of the target in the first direction based on the radio wave reflected by the dispersion part.

Abstract: A heating device includes a heat resisting vacuum insulator (4) wound around the outer periphery of an electric heater (3) disposed along the outer wall of an exhaust pipe (1), wherein the electric heater (3) has a resistance heating element and a heat resisting electric insulator covering this resistance heating element, and the heat resisting vacuum insulator (4) includes a hollow platy covering material air-tightly sealed thereinside by a metal seat (5) having a heat resisting temperature of at least 100° C., and a fibrous or granular filling material (6) filled in the hollow portion of this covering material and having a heat resisting temperature of at least 100° C., the inside of the covering material being kept in a vacuum state.

Abstract: A heating device which can prevent unused active chemical species from attaching to the bodies of various vacuum devices or depositing on the inner wall of their exhaust pipes to thereby be able to make the size of exhaust pipes smaller than before and make the exhaust pipe maintenance easier. The heating device comprises a heat resisting vacuum insulator (4) wound around the outer periphery of an electric heater (3) disposed along the outer wall of an exhaust pipe (1), wherein the electric heater (3) has a resistance heating element and a heat resisting electric insulator covering this resistance heating element, and the heat resisting vacuum insulator (4) comprises a hollow platy covering material air-tightly sealed thereinside by a metal seat (5) having a heat resisting temperature of at least 100° C., and a fibrous or granular filling material (6) filled in the hollow portion of this covering material and having a heat resisting temperature of at least 100° C.

Abstract: An electric wire with coating of polyvinyl chloride family resin composition is disclosed which has a coating layer containing a polyvinyl chloride family resin composition comprising polyvinyl chloride family resin and one or more compounds selected from calcium soap, zinc soap and hydrotalcite. The polyvinyl chloride composition does not comprise either or both of a lead compound and a ?-diketone compound having a melting point less than 100° C. A plasticizer can be further added to the composition so as to obtain a heat-stable vinyl chloride composition. A cable covered with the polyvinyl chloride family resin composition is also disclosed, including a cable having electric wires coated with the polyvinyl chloride family resin composition.

Abstract: A method of cleaning air, including a humidifying operation for humidifying the air containing chemical contaminants by a humidifier and taking a part of the gaseous contaminants in the air into excessive moisture to remove the contaminants from the air, and a dehumidifying operation for dehumidifying the humidified air by a condenser and taking the gaseous chemical contaminants remaining, without being removed, in the humidifying operation into condensed water for removal. By using an oblique honeycomb having both front and rear faces and both upper and lower faces disposed in open state, air is led from the front opening part of the oblique honeycomb and water is fed from the upper opening part thereof to one or both of the humidifier and condenser.

Abstract: A computer system is composed of a CPU, a memory module including a memory adapted to redundancy repair, a storage device separately provided from the memory device. When redundancy repair of the memory device is requested, a redundancy repair program is loaded into the storage device, and the CPU executes the redundancy repair program loaded into the storage device to implement redundancy repair of the memory device.

Abstract: An electric wire and a cable having a coating/covering layer comprising a polyvinyl chloride family resin composition containing polyvinyl chloride family resin, and one or a plurality of types of compounds selected from calcium soap, zinc soap and hydrotalcite, and containing neither lead compound nor ?-diketone with a melting point less than 100° C. avoiding generation of AMCs (Airborne Molecular Contaminants) are provided especially as an electric wire and cable with coating/covering of polyvinyl chloride family resin composition suitable for a use within a clean room for the purpose of manufacturing semiconductors or liquid crystal devices.

Abstract: The present invention has as its object to provide an air filter not only for trapping suspended particulate substances but also for not generating hazardous contaminates in the air, which cause trouble in the manufacture of semiconductor devices. As a binder to bind fibers of the air filter together, a polymer dispersion is used in which a copolymer of a hydrophilic monomer and a hydrophobic monomer is dispersed in water. As an initiator for polymerization of the copolymer, an organic peroxide is used. When an air filter (8) is installed downstream of a chemical filter (7), the space (4) placed downstream of the air filter (8) is made substantially free of organic substances and/or inorganic substances that cause trouble in the manufacture of semiconductor devices.

Abstract: A material not releasing gaseous organic substances during use is used as a filter medium and a sealing material for tightly sealing between the medium and a frame. Specifically, a synthetic paraffin not containing an aliphatic hydrocarbon having not more than 19 carbon atoms or less is used as a non-silicone type water repellent contained in a treatment agent for forming fibers into a cloth-like filter medium. A carboxylic acid ester having 400 or more molecular weight is used as a plasticizer and a phenolic compound having 300 or more molecular weight is used as an antioxidant to be added to the treatment agent and the sealing material. This enables that the gaseous organic substances are not present in a clean room, a semiconductor production apparatus or the like.

Abstract: An electric wire with coating of polyvinyl chloride family resin composition is characterized by having a coating layer including polyvinyl chloride family composition obtained from adding more than one of any calcium soap, zinc soap and hydrotalcite to resin including polyvinyl chloride resin as a main constituent, and further adding thereto plasticizer so as to obtain a heat-stable vinyl chloride composition, and further adding thereto as stabilization auxiliaries high-melting-point ?-diketone compound having a melting point more than 100° C. out of ?-diketone compounds expressed by a general formula of R.CO.CH2.CO.R?.

Abstract: A semiconductor manufacturing facility has a proper strength and an anti-vibration effect. The semiconductor facility contains processing apparatuses, installation tables and an installation floor. An apparatus having a vibration source is installed on an installation table having a rigid structure. The installation table is installed on the installation floor having a floor construction including a plurality of columns, which support a floor member extending in horizontal directions. An interval of the columns is 4 m to 12 m.

Abstract: An air-supply machine cleans outside air. The cleaned outside air is dehumidified by cooling by performing heat exchange between the cleaned outside air and an exhaust air from a lithography apparatus by a first heat-pipe. The dehumidified outside air is heated by performing heat treatment between the dehumidified outside air and an exhaust air from a vertical heat treatment apparatus by a second heat-pipe. The heated outside air is supplied to inside the housing of the vertical heat treatment apparatus. Thereby, the consumption of air in the clean room is reduced and the running cost of the clean room is reduced.

Abstract: A method of cleaning air, comprising a humidifying step for humidifying the air containing chemical contaminants by a humidifying means and taking a part of the gaseous contaminants in the air into excessive moisture to remove the contaminants from the air and a dehumidifying step for dehumidifying the humidified air by a condensing means and taking the gaseous chemical contaminants remaining, without being removed, in the humidifying step into condensed water for removal, wherein, by using a oblique honeycomb having both front and rear faces and both upper and lower faces disposedin open state, air is led from the front opening part of the oblique honeycomb and water is fed from the upper opening part thereof to one or both of the humidifying and condensing means.

Abstract: An amount of energy consumption in a semiconductor fabrication facility can be reduced by using cooling water drained from a semiconductor fabrication apparatus as a heat source of another semiconductor fabrication apparatus. Cooling water of 80° C. drained from a heating furnace of a heat processing apparatus (10) is supplied to a deionized water heating apparatus (32) of a cleaning apparatus (30). The deionized water heating apparatus (32) raises a temperature of deionized water of a room temperature to 60° C. through heat exchange with the cooling water of 80° C. The cooling water, whose temperature falls to 30° C. after the heat exchange, is reutilized for cooling of the heating furnace (12).

Abstract: An electric wire and a cable having a coating/covering layer comprising a polyvinyl chloride family resin composition containing polyvinyl chloride family resin, and one or a plurality of types of compounds selected from calcium soap, zinc soap and hydrotalcite, and containing neither lead compound nor &bgr;-diketone with a melting point less than 100° C. avoiding generation of AMCs (Airborne Molecular Contaminants) are provided especially as an electric wire and cable with coating/covering of polyvinyl chloride family resin composition suitable for a use within a clean room for the purpose of manufacturing semiconductors or liquid crystal devices.

Abstract: An air cooling device includes at least one cooling unit which includes an oblique honeycomb having front, rear, upper, and lower openings and disposed so that air to be cooled is introduced into the front opening and cooled air is discharged from the rear opening, a cooling water supply means which supplies cooling water to the upper opening of the oblique honeycomb, and a water receiving section which receives discharge water discharged from the lower opening of the oblique honeycomb, and a blower means which introduces air to be cooled into the front opening of the oblique honeycomb and allows cooled air to be discharged from the rear opening of the oblique honeycomb, wherein the height of one oblique honeycomb in the cooling unit is 200 to 800 mm. The air cooling device has high thermal efficiency, a small liquid-gas ratio, and a small pressure drop, and is capable of saving space and energy.

Abstract: An amount of energy consumption in a semiconductor fabrication facility can be reduced by using cooling water drained from a semiconductor fabrication apparatus as a heat source of another semiconductor fabrication apparatus. Cooling water of 80° C. drained from a heating furnace of a heat processing apparatus (10) is supplied to a deionized water heating apparatus (32) of a cleaning apparatus (30). The deionized water heating apparatus (32) raises a temperature of deionized water of a room temperature to 60° C. through heat exchange with the cooling water of 80° C. The cooling water, whose temperature falls to 30° C. after the heat exchange, is reutilized for cooling of the heating furnace (12).

Abstract: An exhaust-heat utilization system is constructed which can achieve energy saving of semiconductor manufacturing facilities by reusing a warmed cooling-water, as a heating source, exhausted from semiconductor manufacturing apparatuses. Supply a low-temperature cooling-water having a temperature substantially equal to a room temperature to the semiconductor manufacturing apparatuses (2, 4, 6, 8, 10) through a low-temperature cooling-water line (12). Supply a medium-temperature cooling-water to the semiconductor manufacturing apparatus (8) through a medium-temperature cooling-water supply line (30), the medium-temperature cooling-water being exhausted from the semiconductor manufacturing apparatuses and having a temperature higher than the room temperature.

Abstract: An air-supply machine cleans outside air. The cleaned outside air is dehumidified by cooling by performing heat exchange between the cleaned outside air and an exhaust air from a lithography apparatus by a first heat-pipe. The dehumidified outside air is heated by performing heat treatment between the dehumidified outside air and an exhaust air from a vertical heat treatment apparatus by a second heat-pipe. The heated outside air is supplied to inside the housing of the vertical heat treatment apparatus. Thereby, the consumption of air in the clean room is reduced and the running cost of the clean room is reduced.

Abstract: Materials not releasing gaseous organic materials during use are used as a dry-type sealing material such as a gasket disposed upon mounting an air filter to an opening of a ceiling or the like, a wet-type sealing material filled and used in a gap for connecting wall materials or partitionings, a vinyl chloride sheet or a vinyl chloride cloth as a facing material for walls and floors. Specifically, a carboxylic acid ester having a molecular weight of not less than 400 is used as a plasticizer, a phenolic compound having a molecular weight of not less 300 is used as an antioxidant, an aliphatic hydrocarbon having not less than 19 carbon atoms (for example, microcrystalline wax) is used as a lubricant, and an alkylamine ethylene oxide adduct having a molecular weight of not less than 350 is used as an antistatic agent.