Abstract: An air cooling device includes at least one cooling unit which includes an oblique honeycomb having front, rear, upper, and lower openings and disposed so that air to be cooled is introduced into the front opening and cooled air is discharged from the rear opening, a cooling water supply means which supplies cooling water to the upper opening of the oblique honeycomb, and a water receiving section which receives discharge water discharged from the lower opening of the oblique honeycomb, and a blower means which introduces air to be cooled into the front opening of the oblique honeycomb and allows cooled air to be discharged from the rear opening of the oblique honeycomb, wherein the height of one oblique honeycomb in the cooling unit is 200 to 800 mm. The air cooling device has high thermal efficiency, a small liquid-gas ratio, and a small pressure drop, and is capable of saving space and energy.

Abstract: A heat exchange section (72) is provided in the middle of a circulation water path (58, 59) connecting between a temperature-controlled water tank (71) and a semiconductor manufacturing apparatus body (4) so as to perform a heat exchange with air of a clean room (3). The heat exchange section (72) is installed near an exit of an air circulation path (32) above a fan-filter unit (34) of the clean room as a temperature stabilized area off an atmosphere of the clean room (3). Additionally, as another method, a temperature of a chemical fluid from a chemical fluid tank (6) is controlled to be a temperature of the air in the clean room by a heat exchange section (61) provided in a location the same as above without using the temperature-controlled water so as to supply the chemical fluid to the semiconductor manufacturing apparatus body (4).

Abstract: A semiconductor manufacturing facility is provided, which can reduce a thermal load in a clean room and reduce an amount of energy thereof. Semiconductor manufacturing equipment, which generates heat when it is used, is installed in the clean room and is covered by a housing. The housing is configured to be capable of introducing the air inside the clean room into an interior thereof. The air inside the housing is exhausted outside the clean room through a plurality of exhaust passage members. A heat insulating material is associated with the housing to reduce the release of heat from the housing to the air inside the clean room. A space between the housing and the semiconductor manufacturing equipment may be hermetically sealed, and an air introducing member may be connected to the housing to take air outside the clean room into the hermetically sealed space.

Abstract: A material not releasing gaseous organic substances during use is used as a filter medium and a sealing material for tightly sealing between the medium and a frame. Specifically, a synthetic paraffin not containing an aliphatic hydrocarbon having not more than 19 carbon atoms or less is used as a non-silicone type water repellent contained in a treatment agent for forming fibers into a cloth-like filter medium. A carboxylic acid ester having 400 or more molecular weight is used as a plasticizer and a phenolic compound having 300 or more molecular weight is used as an antioxidant to be added to the treatment agent and the sealing material. This enables that the gaseous organic substances are not present in a clean room, a semiconductor production apparatus or the like.

Abstract: A heat exchange section (72) is provided in the middle of a circulation water path (58, 59) connecting between a temperature-controlled water tank (71) and a semiconductor manufacturing apparatus body (4) so as to perform a heat exchange with air of a clean room (3). The heat exchange section (72) is installed near an exit of an air circulation path (32) above a fan-filter unit (34) of the clean room as a temperature stabilized area off an atmosphere of the clean room (3). Additionally, as another method, a temperature of a chemical fluid from a chemical fluid tank (6) is controlled to be a temperature of the air in the clean room by a heat exchange section (61) provided in a location the same as above without using the temperature-controlled water so as to supply the chemical fluid to the semiconductor manufacturing apparatus body (4).

Abstract: A material not releasing gaseous organic substances during use is used as a filter medium and a sealing material for tightly sealing between the medium and a frame. Specifically, a synthetic paraffin not containing an aliphatic hydrocarbon having not more than 19 carbon atoms or less is used as a non-silicone type water repellent contained in a treatment agent for forming fibers into a cloth-like filter medium. A carboxylic acid ester having 400 or more molecular weight is used as a plasticizer and a phenolic compound having 300 or more molecular weight is used as an antioxidant to be added to the treatment agent and the sealing material. This enables that the gaseous organic substances are not present in a clean room, a semiconductor production apparatus or the like.

Abstract: A semiconductor manufacturing facility has a proper strength and an anti-vibration effect. The semiconductor facility contains processing apparatuses, installation tables and an installation floor. An apparatus having a vibration source is installed on an installation table having a rigid structure. The installation table is installed on the installation floor having a floor construction including a plurality of columns, which support a floor member extending in horizontal directions. An interval of the columns is 4 m to 12 m.

Abstract: A heat generating part (1) of semiconductor manufacturing equipment is cooled by cooling water. An inner fluid passage (21) having an inlet port (31) of the cooling water on a vertically lower portion thereof is formed so as to surround a periphery of the heat generating part (1). An outer fluid passage (22) having an outlet port (32) of the cooling water on a vertically upper portion thereof is formed so as to surround a periphery of the inner fluid passage (21) and be capable of exchanging heat with the cooling water in the inner fluid passage. A communication passage (24) is provided to connect a vertically upper portion of said inner fluid passage and a vertically lower portion of said outer fluid passage. The cooling water flowing out of the outlet port (32) of the outer fluid passage (22) is supplied to the inlet port (31) of the inner fluid passage (21).

Abstract: A cooling jacket unit (5) is provided to a periphery of a heating furnace of a heat treatment apparatus. A cooling unit has a double water jacket comprising an inner fluid passage (51) and an outer fluid passage (52), and cooling water supplied to the outer fluid passage exits from the inner fluid passage. The temperatures of the inlet port and the outlet port of the cooling jacket unit (5) are set to, for example, 40° C. and 85° C., respectively, and the cooling water (warmed exhaust water) from the outlet port is supplied to a heat recovery part (2). Heat is recovered from the cooling water by the heat recovery part (29, and the recovered heat is reused for heating a boiler water and the like. The warmed exhaust water from which the heat is recovered is supplied again to the cooling jacket unit (5) as the cooling water.

Abstract: An electronic/electric part used in a clean room in which the atmosphere is controlled to process a substrate in a semiconductor device industry, which contains a resin base material and additives added to the resin base material. The additives contain one or more materials selected from the group consisting of an anti-electrostatic agent made of a nonionic compound of a molecular weight of 350 or higher, an anti-oxidizing agent made of a phenolic compound of a molecular weight of 300 or higher, a lubricant, a plasticizer, a fire retardant, and a water repellent. The additives hardly releases gaseous organic substances from the resin base material under a condition where the part is used.

Abstract: A material not releasing gaseous organic substances during use is used as a filter medium and a sealing material for tightly sealing between the medium and a frame. Specifically, a synthetic paraffin not containing an aliphatic hydrocarbon having not more than 19 carbon atoms or less is used as a non-silicone type water repellent contained in a treatment agent for forming fibers into a cloth-like filter medium. A carboxylic acid ester having 400 or more molecular weight is used as a plasticizer and a phenolic compound having 300 or more molecular weight is used as an antioxidant to be added to the treatment agent and the sealing material. This enables that the gaseous organic substances are not present in a clean room, in a semiconductor production apparatus or in the like.

Abstract: A material not releasing gaseous organic substances during use is used as a filter medium and a sealing material for tightly sealing between the medium and a frame. Specifically, a synthetic paraffin not containing an aliphatic hydrocarbon having not more than 19 carbon atoms or less is used as a non-silicone type water repellent contained in a treatment agent for forming fibers into a cloth-like filter medium. A carboxylic acid ester having 400 or more molecular weight is used as a plasticizer and a phenolic compound having 300 or more molecular weight is used as an antioxidant to be added to the treatment agent and the sealing material. This enables that the gaseous organic substances are not present in a clean room, a semiconductor production apparatus or the like.

Abstract: Materials not releasing gaseous organic materials during use are used as a dry-type sealing material such as a gasket disposed upon mounting an air filter to an opening of a ceiling or the like, a wet-type sealing material filled and used in a gap for connecting wall materials or partitionings, a vinyl chloride sheet or a vinyl chloride cloth as a facing material for walls and floors. Specifically, a carboxylic acid ester having a molecular weight of not less than 400 is used as a plasticizer, a phenolic compound having a molecular weight of not less 300 is used as an antioxidant, an aliphatic hydrocarbon having not less than 19 carbon atoms (for example, microcrystalline wax) is used as a lubricant, and an alkylamine ethylene oxide adduct having a molecular weight of not less than 350 is used as an antistatic agent.

Abstract: A material not releasing gaseous organic substances during use is used as a filter medium and a sealing material for tightly sealing between the medium and a frame. Specifically, a synthetic paraffin not containing an aliphatic hydrocarbon having not more than 19 carbon atoms or less is used as a non-silicone type water repellent contained in a treatment agent for forming fibers into a cloth-like filter medium. A carboxylic acid ester having 400 or more molecular weight is used as a plasticizer and a phenolic compound having 300 or more molecular weight is used as an antioxidant to be added to the treatment agent and the sealing material. This enables that the gaseous organic substances are not present in a clean room, a semiconductor production apparatus or the like.

Abstract: There are instruments used for handling a substrate in a clean room at room temperature and atmospheric pressure, which contain a resin base and at least one additive selected from the group consisting of a lubricant, a plasticizer, an anti-oxidizing agent and an antistatic agent, and the additives do not generate gaseous organic material compound under conditions of room temperature and atmospheric pressure.

Abstract: A material not releasing gaseous organic substances during use is used as a filter medium and a sealing material for tightly sealing between the medium and a frame. Specifically, a synthetic paraffin not containing an aliphatic hydrocarbon having not more than 19 carbon atoms or less is used as a non-silicone type water repellent contained in a treatment agent for forming fibers into a cloth-like filter medium. A carboxylic acid ester having 400 or more molecular weight is used as a plasticizer and a phenolic compound having 300 or more molecular weight is used as an antioxidant to be added to the treatment agent and the sealing material. This enables that the gaseous organic substances are not present in a clean room, a semiconductor production apparatus or the like.

Abstract: Materials not releasing gaseous organic materials during use are used as a dry-type sealing material such as a gasket disposed upon mounting an air filter to an opening of a ceiling or the like, a wet-type sealing material filled and used in a gap for connecting wall materials or partitionings, a vinyl chloride sheet or a vinyl chloride cloth as a facing material for walls and floors. Specifically, a carboxylic acid ester having a molecular weight of not less than 400 is used as a plasticizer, a phenolic compound having a molecular weight of not less 300 is used as an antioxidant, an aliphatic hydrocarbon having not less than 19 carbon atoms (for example, microcrystalline wax) is used as a lubricant, and an alkylamine ethylene oxide adduct having a molecular weight of not less than 350 is used as an antistatic agent.

Abstract: This invention provides a combined metering apparatus in which the convey efficiency of a target metering object from an upper-stage hopper to a lower-stage hopper is improved. For this purpose, the direction in which a bottom plate 33 of a pool hopper 25 is moved to open the lower open surface of a cylindrical body 26 and the direction in which a bottom plate 43 of a lower-stage metering hopper 35 is moved to close the lower open surface of a cylindrical body 36 are set the same. Also, the direction in which the bottom plate 43 of the metering hopper 35 is moved to open the lower open surface of the cylindrical body 36 and the direction in which a bottom plate 59 of a lower-stage timing hopper 50 is moved to open the lower open surface of a cylindrical body 51 are set the same.

Abstract: This invention relates to an anti-theft device for an engine-driven vehicle having a control unit for controlling either of the supply of fuel to an engine and the ignition timing of this fuel, and a back-up mechanism acting for the control unit when the control unit is damaged. It is determined whether or not the control unit has functioned appropriately when the engine is started up, and if it is determined that it has not, the function of the back-up mechanism is prohibited. Hence, the engine will not start and theft of the vehicle is prevented even if, for example, the control unit is deliberately damaged and an attempt is made to start the engine. However, the back-up mechanism does function if the control unit develops a fault while the vehicle is running, and the vehicle therefore continues to run.

Abstract: Herein disclosed are organic thin film EL element having layer structures each of which comprises at least one organic thin film sandwiched between two electrodes, at least one of which is a metal thin film or one of which is a metal thin film and the other of which is a transparent conductive inorganic thin film, and an optional thin film of an inorganic semiconductor positioned between the transparent conductive thin film and the organic thin film, wherein an interfacial layer is fromed between the organic thin film and the metal thin film adjacent to the organic thin film by treating the organic thin film and/or the metal thin film with an organic phosphorus atom-containing compound; and/or wherein an interfacial layer is formed between the organic thin film and the inorganic thin film adjacent to the inorganic thin film by treating the organic thin film and/or the inorganic thin film with a silane-coupling agent.