Abstract: The present invention aims to provide a semiconductor device which can enhance area efficiency, and the semiconductor device includes a plurality of electroconductive member regions formed in a predetermined layer, an insulating film region which is formed in the insulating layer which is an upper layer of the predetermined layer and which covers a region other than at least the plurality of electroconductive member regions, and wiring for making a connection which is formed along the insulating film region and which connects the plurality of electroconductive member regions mutually.

Abstract: In a semiconductor memory device, a repair circuit includes mode fuses to select one of plural repair modes corresponding to plural kinds of defects, respectively. The semiconductor memory device can repair a defective memory cell having operational margin defect without using redundancy memory cells.

Abstract: A plurality of first pads for bonding is arranged in a central portion of a semiconductor device in a longitudinal direction of the device. In an edge portion of the semiconductor device, a plurality of second pads for bonding is arranged in the longitudinal direction of the device. The first pad and the second pad are connected by a wiring.

Abstract: A package for mounting a semiconductor device has a surface exposed to an atmosphere. The exposed surface is covered with a covering material such as a paint, a tape or a seal.

Abstract: It is an object of the present invention to realize a circuit diagram creating method and circuit diagram creating apparatus capable of efficiently acquiring information on a lower layer, and a circuit diagram creating method for creating a layered electric circuit diagram from data indicating an electric circuit that includes the steps of determining an outline area to be displayed from wiring information and graphics information which are data indicating the electric circuit for symbol graphics of a lower layer and displaying information on the circuit diagram so as not to go beyond the outline area.

Abstract: A package for mounting a semiconductor device has a surface exposed to an atmosphere. The exposed surface is covered with a covering material such as a paint, a tape or a seal.

Abstract: Disclosed a semiconductor memory device in which an access to a memory cell is designated according to a command, and a common data terminal is used as an input terminal to which a write signal to the memory cell is input and an output terminal from which a read signal from the memory cell is output. The semiconductor memory device includes: a first input circuit having input capacitance corresponding to the input terminal to which the command is input; and a second input circuit having input capacitance corresponding to the data terminal. A mask signal for checking the write signal input from the data terminal is input by either the first or second input circuit by a bonding option technique.

Abstract: Disclosed a semiconductor memory device in which an access to a memory cell is designated according to a command, and a common data terminal is used as an input terminal to which a write signal to the memory cell is input and an output terminal from which a read signal from the memory cell is output. The semiconductor memory device includes: a first input circuit having input capacitance corresponding to the input terminal to which the command is input; and a second input circuit having input capacitance corresponding to the data terminal. A mask signal for checking the write signal input from the data terminal is input by either the first or second input circuit by a bonding option technique.