Abstract: Techniques to provide transaction redundancy in an IC include receiving an original memory access request directed to a first memory aperture, constructing a redundant memory access directed to a second memory aperture, and selectively returning a response of the first or second memory aperture to an originator based on contents of the responses. For a write operation, if acknowledgement indicators of the responses indicate success, a response is returned to the originator. For a read operation, if acknowledgement indicators of the responses indicate success and data returned in the response match one another, a response is returned to the originator. If the acknowledgement indicators indicate success, but the data does not match, a retry of the original and redundant read requests is initiated. If any of the acknowledgement indicators do not indicate success, an error is declared. In a mixed-criticality embodiment, the redundant memory access request may be constructed selectively.

Abstract: Embodiments herein describe a NoC where its internal switches have buffers with pods that can be assigned to different virtual channels. A subset of the pods in a buffer can be grouped together to form a VC. In this manner, different pod groups in a buffer can be assigned to different VCs (or to different types of NoC data units), where VCs that transmit wider data units can be assigned more pods than VCs that transmit narrower data units.

Abstract: Embodiments herein describe a decentralized chip-to-chip (C2C) interface architecture to transport memory mapped traffic amongst heterogeneous IC devices in a packetized, scalable, and configurable manner. An IC chip may include functional circuitry that exchanges memory-mapped traffic with an off-chip device, a NoC that packetizes and de-packetizes memory-mapped traffic and routes the packetized memory-mapped traffic between the functional circuitry and the off-chip device, and NoC inter-chip bridge (NICB) circuitry that interfaces between the NoC and the off-chip device over C2C interconnections. The NICB circuitry may be configurable in a full mode to map packetized memory-mapped traffic to the C2C interconnections in a 1:1 fashion and in a compressed to map packetized memory-mapped traffic to the C2C interconnections in a less-than 1:1 fashion.

Abstract: Systems, methods, and apparatuses are described that enable IC architectures to enable a single anchor to connect to and accept a variety of chiplets at any port by way of a programming model that enables the anchor or chiplet to dynamically adapt to configurations, requirements, or aspects of any coupled component and provide an interface for the coupled components.

Abstract: Embodiments herein describe a multiple die system that includes an interposer that connects a first die to a second die. Each die has a bump interface structure that is connected to the other structure using traces in the interposer. However, the bump interface structures may have different orientations relative to each other, or one of the interface structures defines fewer signals than the other. Directly connecting the corresponding signals defined by the structures to each other may be impossible to do in the interposer, or make the interposer too costly. Instead, the embodiments here simplify routing in the interposer by connecting the signals in the bump interface structures in a way that simplifies the routing but jumbles the signals. The jumbled signals can then be corrected using reordering circuitry in the dies (e.g., in the link layer and physical layer).

Abstract: Embodiments herein describe an integrated circuit that includes a NoC with at least two levels of switching: a sparse network and a non-blocking network. In one embodiment, the non-blocking network is a localized interconnect that provides an interface between the sparse network in the NoC and a memory system that requires additional bandwidth such as HBM2/3 or DDR5. Hardware elements connected to the NoC that do not need the additional benefits provided by the non-blocking network can connect solely to the sparse network. In this manner, the NoC provides a sparse network (which has a lower density of switching elements) for providing communication between lower bandwidth hardware elements and a localized non-blocking network for facilitating communication between the sparse network and higher bandwidth hardware elements.

Abstract: Examples of the present disclosure generally relate to integrated circuits, such as a system-on-chip (SoC), that include a memory subsystem. In some examples, an integrated circuit includes a first master circuit in a first power domain on a chip; a second master circuit in a second power domain on the chip; and a first memory controller in a third power domain on the chip. The first master circuit and the second master circuit each are configured to access memory via the first memory controller. The first power domain and the second power domain each are separate and independent from the third power domain.

Abstract: An integrated circuit (IC) includes a Network-on-Chip (NoC). The NoC includes a plurality of NoC master circuits, a plurality of NoC slave circuits, and a plurality of switches. The plurality of switches are interconnected and communicatively link the plurality of NoC master circuits with the plurality of NoC slave circuits. The plurality of switches are configured to receive data of different widths during operation and implement different operating modes for forwarding the data based on the different widths.

Abstract: Embodiments herein describe a multiple die system that includes an interposer that connects a first die to a second die. Each die has a bump interface structure that is connected to the other structure using traces in the interposer. However, the bump interface structures may have different orientations relative to each other, or one of the interface structures defines fewer signals than the other. Directly connecting the corresponding signals defined by the structures to each other may be impossible to do in the interposer, or make the interposer too costly. Instead, the embodiments here simplify routing in the interposer by connecting the signals in the bump interface structures in a way that simplifies the routing but jumbles the signals. The jumbled signals can then be corrected using reordering circuitry in the dies (e.g., in the link layer and physical layer).

Abstract: Methods and apparatus relating to transmission on physical channels, such as in networks on chips (NoCs) or between chiplets, are provided. One example apparatus generally includes a higher bandwidth client; a lower bandwidth client; a first destination; a second destination; and multiple physical channels coupled between the higher bandwidth client, the lower bandwidth client, the first destination, and the second destination, wherein the higher bandwidth client is configured to send first traffic, aggregated across the multiple physical channels, to the first destination and wherein the lower bandwidth client is configured to send second traffic, concurrently with sending the first traffic, from the lower bandwidth client, dispersed over two or more of the multiple physical channels, to the second destination.

Abstract: Embodiments herein describe wrapping non-safety compliant hardware resources with error detection checking to satisfy a safety standard. Doing so permits non-safety compliant hardware to be used to perform one or more tasks in a system that, as a whole, satisfies a particular safety standard (e.g., one of the ASIL QM, A, B, C, and D grades).

Abstract: A System-on-Chip includes a data processing engine array. The data processing engine array includes a plurality of data processing engines organized in a grid. The plurality of data processing engines are partitioned into at least a first partition and a second partition. The first partition includes one or more first data processing engines of the plurality of data processing engines. The second partition includes one or more second data processing engines of the plurality of data processing engines. Each partition is configured to implement an application that executes independently of the other partition.

Abstract: Transmitter circuitry includes inversion circuitry, first transform circuitry, and selection circuitry. The inversion circuitry generates a first transformed data word by inverting one or more of a plurality of bits of a first data word. The first transform circuitry generates a second transformed data word by performing a first invertible operation on the first data word and a second data word. The selection circuitry selects one of the first data word, the first transformed data word, and the second transformed data word based on a first number of bit inversions between the first data word and the second data word, a second number of bit inversions between the first transformed data word and the second data word, and a third number of bit inversions between the second transformed data word and the second data word. The selection circuitry further outputs the selected data word.

Abstract: Embodiments herein describe using an adaptive chip-to-chip (C2C) interface to interconnect two chips, wherein the adaptive C2C interface includes circuitry for performing multiple different C2C protocols to communicate with the other chip. One or both of the chips in the C2C connection can include the adaptive C2C interface. During boot time, the adaptive C2C interface is configured to perform one of the different C2C protocols. During runtime, the chip then uses the selected C2C protocol to communicate with the other chip in the C2C connection.

Abstract: Examples of the present disclosure generally relate to integrated circuits, such as a system-on-chip (SoC), that include a memory subsystem. In some examples, an integrated circuit includes a first master circuit in a first power domain on a chip; a second master circuit in a second power domain on the chip; and a first memory controller in a third power domain on the chip. The first master circuit and the second master circuit each are configured to access memory via the first memory controller. The first power domain and the second power domain each are separate and independent from the third power domain.

Abstract: A System-on-Chip includes a first partition configured to implement a first application using of at least a first portion of one or more of a plurality of subsystems of the System-on-Chip and a second partition configured to implement a second application concurrently with the first partition. The second application uses at least a second portion of one or more of the plurality of subsystems. The first partition is isolated from the second partition.

Abstract: Embodiments herein describe offloading encryption activities to a network interface controller/card (NIC) (e.g., a SmartNIC) which frees up server compute resources to focus on executing customer applications. In one embodiment, the smart NIC includes a system on a chip (SoC) implemented on an integrated circuit (IC) that includes an embedded processor. Instead of executing a transport layer security (TLS) stack entirely in the embedded processor, the embodiments herein offload certain TLS tasks to a Public Key Infrastructure (PKI) accelerator such as generating public-private key pairs.

Abstract: Synchronizing system resources of a multi-socket data processing system can include providing, from a primary System-on-Chip (SOC), a trigger event to a global synchronization circuit. The primary SOC is one of a plurality of SOCS and the trigger event is provided over a first sideband channel. In response to the trigger event, the global synchronization circuit is capable of broadcasting a synchronization event to the plurality of SOCS over a second sideband channel. In response to the synchronization event, the system resource of each SOC of the plurality of SOCS is programmed with a common value. The programming synchronizes the system resources of the plurality of SOCS.

Abstract: Systems, methods, and apparatuses are described that enable IC architectures to enable a single anchor to connect to and accept a variety of chiplets at any port by way of a programming model that enables the anchor or chiplet to dynamically adapt to configurations, requirements, or aspects of any coupled component and provide an interface for the coupled components.

Abstract: Embodiments herein describe on-demand packetization where data that is too large to be converted directly into data words (DWs) for a chip-to-chip (C2C) interface are packetized instead. When identifying a protocol word that is larger than the DW of the C2C interface, a protocol layer can perform packetization where a plurality of protocol words are packetized and sent as a transfer. In one embodiment, the protocol layer removes some or all of the control data or signals in the protocol words so that the protocol words no longer exceed the size of the DW. These shortened protocol words can then be mapped to DWs and transmitted as separate packets on the C2C. The protocol layer can then collect the portion of the control data that was removed from the protocol words and transmit this data as a separate packet on the C2C interface.