Patents by Inventor Sagi Varghese Mathai

Sagi Varghese Mathai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10388807
    Abstract: An example device in accordance with an aspect of the present disclosure includes a photodetector disposed on a substrate, and a mirror disposed on the photodetector. The mirror is to reflect light back into the photodetector. The mirror includes a reflective layer and a second layer. The second layer is disposed between the reflective layer and the photodetector.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: August 20, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sagi Varghese Mathai, Michael Renne Ty Tan
  • Publication number: 20190173584
    Abstract: Techniques related to optical devices including a high contrast grating (HCG) lens are described herein. In an example, an optical device includes a transparent substrate. A laser emitter or detector at a first side of the transparent substrate to emit or detect a laser light transmitted via the transparent substrate. A HCG lens is at a second side of the transparent substrate to transmit and refract the laser light.
    Type: Application
    Filed: January 17, 2019
    Publication date: June 6, 2019
    Inventors: Wayne Victor Sorin, MIchael Renne Ty Tan, David A. Fattal, Sagi Varghese Mathai
  • Publication number: 20190154920
    Abstract: In the examples provided herein, a polarization diversity receiver system includes a loop waveguide, and a two-dimensional grating coupler formed on the loop waveguide to couple light impinging on the grating coupler having a first polarization into the loop waveguide in a first direction, and to couple light having a second polarization orthogonal to the first polarization into the loop waveguide in a second direction. The system also includes a first output waveguide positioned near the loop waveguide in a first coupling region, a first distributed perturbation having a first resonant wavelength in the first coupling region to cause coupling of light at the first resonant wavelength between the loop waveguide and the first output waveguide, and a first photodetector to detect light propagating out of a first end and a second end of the first output waveguide.
    Type: Application
    Filed: April 8, 2016
    Publication date: May 23, 2019
    Inventors: Joaquin Matres, Wayne Victor Sorin, Stanley Cheung, Sagi Varghese Mathai, Michael Renne Ty Tan
  • Patent number: 10290996
    Abstract: A bottom-emitting vertical-cavity surface-emitting laser (VCSEL) structure includes a first substrate permitting the passage of light therethrough, an n-doped distributed Bragg reflector (nDBR), a p-doped distributed Bragg reflector (pDBR), one or more active layers, at least one of a high contrast grating mirror and a dielectric-enhanced metal mirror, and a plurality of layers, where the VCSEL structure is configured to be flip chipped to a second substrate. The pDBR and the nDBR define a laser cavity extending vertically therebetween and containing the one or more active layers. The at least one of a high contrast grating mirror and a dielectric-enhanced metal mirror may be disposed over the pDBR. The plurality of layers may be disposed over the at least one of the high contrast grating mirror and the dielectric-enhanced metal mirror to optically and hermetically seal the laser cavity.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: May 14, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sagi Varghese Mathai, Stanley Cheung, Wayne V. Sorin, Michael Renne Ty Tan
  • Publication number: 20190115722
    Abstract: In the examples provided herein, a data center transmission system includes a VCSEL (vertical-cavity surface-emitting laser) that lases in a single spatial mode with a side mode suppression ratio of at least 25 dB, where the VCSEL is formed on a substrate and lases at a wavelength transparent to the substrate, and further where an output of the VCSEL exits through the substrate. Also, the VCSEL is directly modulated. The system further includes an optical fiber having a first end to receive the output of the VCSEL for propagation along the optical fiber. The optical fiber supports a single spatial mode without supporting higher order spatial modes over a range of wavelengths between 1260 nm and 1360 nm. The system also includes a receiver to receive the directly modulated output of the VCSEL after propagation through the optical fiber.
    Type: Application
    Filed: April 1, 2016
    Publication date: April 18, 2019
    Applicant: Hewlett Packard Enterprise Development LP
    Inventors: Wayne Victor Sorin, Michael Renne Ty Tan, Sagi Varghese Mathai
  • Patent number: 10193632
    Abstract: Techniques related to optical devices including a high contrast grating (HCG) lens are described herein. In an example, an optical device includes a transparent substrate. A laser emitter or detector at a first side of the transparent substrate to emit or detect a laser light transmitted via the transparent substrate. A HCG lens is at a second side of the transparent substrate to transmit and refract the laser light.
    Type: Grant
    Filed: May 22, 2013
    Date of Patent: January 29, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Wayne Victor Sorin, Michael Renne Ty Tan, David A. Fattal, Sagi Varghese Mathai
  • Patent number: 10148063
    Abstract: A device can include an active optical device (AOD) to at least one of transmit and receive optical signals. The device can also include an interposer having the AOD mounted thereon. The interposer can be in thermal contact with a heat sink and the interposer is mounted on a substrate. The interposer can be formed of a thermally conductive and electrically insulating material. The interposer can include a via to electrically couple the AOD to another electrical device.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: December 4, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Paul Kessler Rosenberg, Michael Renne Ty Tan, Sagi Varghese Mathai
  • Publication number: 20180329159
    Abstract: Optical modules are disclosed. An example optical module includes a substrate comprising a grating coupler, an optical connector removably coupled to the substrate adjacent the grating coupler to optically couple the optical connector and the grating coupler and an integrated circuit coupled to the substrate.
    Type: Application
    Filed: January 30, 2015
    Publication date: November 15, 2018
    Inventors: Sagi Varghese MATHAI, Wayne Victor SORIN, Michael Renne Ty TAN
  • Patent number: 10082684
    Abstract: A high contrast grating optical modulation includes an optical modulator at a front surface of a substrate to modulate received light. The high contrast grating optical modulation further includes a high contrast grating (HCG) lens adjacent to a back surface of the substrate opposite to the front surface to focus incident light onto the optical modulator. The substrate is transparent to operational wavelengths of the focused incident light and the modulated light.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: September 25, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sagi Varghese Mathai, David A. Fattal, Michael Renne Ty Tan, Wayne Victor Sorin
  • Patent number: 10050414
    Abstract: An array of monolithic wavelength division multiplexed (WDM) vertical cavity surface emitting lasers (VCSELs) is provided with quantum well intermixing. Each VCSEL includes a bottom distributed Bragg reflector (DBR), an upper distributed Bragg reflector, and a laser cavity therebetween. The laser cavity includes a multiple quantum well (MQW) layer sandwiched between a lower separate confinement heterostructure (SCH) and an upper SCH layer. Each MQW region experiences a different amount of quantum well intermixing and concomitantly a different lasing wavelength shift.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: August 14, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sagi Varghese Mathai, Michael Renne Ty Tan
  • Patent number: 10018788
    Abstract: A silicon photonic (SiPh) packaging assembly includes a SiPh interposer and a wafer. The SiPh interposer has one or more optical gratings disposed thereon to couple an optical signal traversing the wafer. The wafer is bonded to the interposer, with the wafer including one or more microlenses, each microlens aligned with a respective optical grating and designed to direct the optical signal traversing the wafer at a desired angle.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: July 10, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sagi Varghese Mathai, Michael Renne Ty Tan, Wayne Victor Sorin
  • Patent number: 10007065
    Abstract: An example device includes a first semiconductor component comprising at least two lasers to emit light at a first wavelength; a second semiconductor component comprising at least two lasers to emit light at a second wavelength, the first wavelength being different from the second wavelength; and an optical multiplexer to receive light from two lasers at the first wavelength and light from two lasers at the second wavelength. The optical multiplexer component includes a first output interface to couple light from one laser at the first wavelength and light from one laser at the second wavelength to a first optical fiber, and a second output interface to couple light from one laser at the first wavelength and light from one laser at the second wavelength beams to a second optical fiber.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: June 26, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Michael Renne Ty Tan, Sagi Varghese Mathai, Georgios Panotopoulos, Paul Kessler Rosenberg, Wayne Victor Sorin
  • Patent number: 9971088
    Abstract: An optical subassembly includes a thru optical via (104) formed through a semiconductor substrate (102), an optoelectronic component (108) secured to the substrate (102) such that an active region (106) of the optoelectronic component is aligned with the thru optical via (104), and circuitry (110) formed into the substrate (102), the circuitry to connect to and operate in accordance with the optoelectronic component (108).
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: May 15, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Paul Kessler Rosenberg, Michael Renne Ty Tan, Sagi Varghese Mathai, Joseph Straznicky
  • Patent number: 9917647
    Abstract: A combination underfill-dam and electrical-interconnect structure for an opto-electronic engine. The structure includes a first plurality of electrical-interconnect solder bodies. The first plurality of electrical-interconnect solder bodies includes a plurality of electrical interconnects. The first plurality of electrical-interconnect solder bodies, is disposed to inhibit intrusion of underfill material into an optical pathway of an opto-electronic component for the opto-electronic engine. A system and an opto-electronic engine that include the combination underfill-dam and electrical interconnect structure are also provided.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: March 13, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sagi Varghese Mathai, Michael Renne Ty Tan, Paul Kessler Rosenberg, Wayne Victor Sorin, Georgios Panotopoulos, Susant K. Patra, Joseph Straznicky
  • Publication number: 20180052266
    Abstract: In the examples provided herein, an apparatus has an optically transparent block having a filter surface. The apparatus also has two or more filters, where each of the filters has thin films fabricated on an optically transparent substrate, and further wherein the thin films of the filters are coupled to the filter surface. Additionally, the apparatus has an optically transparent overmold material encasing the two or more filters, where the overmold material fills a volume between and above neighboring ones of the two or more filters.
    Type: Application
    Filed: April 10, 2015
    Publication date: February 22, 2018
    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Sagi Varghese Mathai, Paul Kessler Rosenberg, Michael Renne Ty Tan
  • Publication number: 20180034242
    Abstract: An array of monolithic wavelength division multiplexed (WDM) vertical cavity surface emitting lasers (VCSELs) is provided with quantum well intermixing. Each VCSEL includes a bottom distributed Bragg reflector (DBR), an upper distributed Bragg reflector, and a laser cavity therebetween. The laser cavity includes a multiple quantum well (MQW) layer sandwiched between a lower separate confinement heterostructure (SCH) and an upper SCH layer. Each MQW region experiences a different amount of quantum well intermixing and concomitantly a different lasing wavelength shift.
    Type: Application
    Filed: January 22, 2015
    Publication date: February 1, 2018
    Inventors: Sagi Varghese MATHAI, Michael Renne Ty TAN
  • Publication number: 20170351041
    Abstract: In the examples provided herein, an apparatus has a first substrate upon which one or more first filters have been fabricated on a first surface of the first substrate. The apparatus also has a second substrate upon which one or more second filters have been fabricated on a second surface of the second substrate, wherein the one or more first filters and the one or more second filters each transmit a different band of wavelengths. Additionally, the apparatus has a bonding material that bonds the first substrate to the second substrate.
    Type: Application
    Filed: December 19, 2014
    Publication date: December 7, 2017
    Inventors: Sagi Varghese MATHAI, Georgio PANOTOPOULOS, Michael Renne Ty TAN, Paul K ROSENBERG, Wayne V SORIN
  • Publication number: 20170315299
    Abstract: A silicon photonic (SiPh) packaging assembly includes a SiPh interposer and a wafer. The SiPh interposer has one or more optical gratings disposed thereon to couple an optical signal traversing the wafer. The wafer is bonded to the interposer, with the wafer including one or more microlenses, each microlens aligned with a respective optical grating and designed to direct the optical signal traversing the wafer at a desired angle.
    Type: Application
    Filed: October 28, 2014
    Publication date: November 2, 2017
    Inventors: Sagi Varghese MATHAI, Michael Renne Ty TAN, Wayne Victor SORIN
  • Patent number: 9551844
    Abstract: A system for passive optical alignment includes an through optical via formed through a substrate, an optical transmission medium secured to a first side of the substrate such that the optical transmission medium is aligned with the through optical via, and an optoelectronic component secured to a second side of the substrate such that the active region of said optoelectronic component is aligned with the through optical via.
    Type: Grant
    Filed: January 11, 2011
    Date of Patent: January 24, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Michael Renne Ty Tan, Sagi Varghese Mathai, Paul Kessler Rosenberg, Georgios Panotopoulos, David A. Fattal, Wayne V. Sorin
  • Publication number: 20170018664
    Abstract: An example device in accordance with an aspect of the present disclosure includes a photodetector disposed on a substrate, and a mirror disposed on the photodetector. The mirror is to reflect light back into the photodetector. The mirror includes a reflective layer and a second layer. The second layer is disposed between the reflective layer and the photodetector.
    Type: Application
    Filed: April 30, 2014
    Publication date: January 19, 2017
    Inventors: Sagi Varghese MATHAI, Michael Renne Ty TAN