Patents by Inventor Sakae Kitajo

Sakae Kitajo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070006996
    Abstract: [Object] A cooling device for a thin electronic equipment having a larger heat radiation area and preventing leakage of refrigerant. [Means for Solving Problems] A cooling device includes first and second cooling panels (1, 2) wherein a passage (11, 21) is formed by bonding together a top heat radiation panel and a bottom heat radiation panel each having a groove therein, and a circulation pump (3) for circulating refrigerant within the passage (11, 21). In the top heat radiation panel of the second cooling panel (2) are formed an outlet port through which the refrigerant flows out from the passage (21) to the circulation pump (3) and an inlet port through which the refrigerant flows in from the circulation pump (3) to the passage (21). The circulation pump (3) is fixed onto the top heat radiation plate of the cooling panel (2) so that the suction port and discharge port are aligned with the outlet port and inlet port, respectively.
    Type: Application
    Filed: June 25, 2004
    Publication date: January 11, 2007
    Inventors: Kazuyuki Mikubo, Sakae Kitajo, Atsushi Ochi, Mitsuru Yamamoto
  • Patent number: 7119438
    Abstract: A method of arranging microspheres with liquid, a microsphere arranging device, and a semiconductor device are provided. The method comprising the steps of placing the semiconductor device with a large number of pads with holes, on a loading table with a variable tilt angle, and pouring microspheres together with conductive liquid held in a holding container onto the semiconductor device. The microspheres are storably placed in the holes on the pads of the semiconductor device. The non-stored microspheres and conductive liquid are accumulated in a receiving tank, and the conductive liquid including the accumulated microspheres are transferred to the holding container by a pump.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: October 10, 2006
    Assignees: NEC Corporation, Japan E M Co., Ltd.
    Inventors: Ichiro Hazeyama, Masahiro Kubo, Sakae Kitajo, Kazuhiko Futakami, Shinichi Ishiduka, Susumu Nanko, Hitoshi Anma, Tosiji Yamada, Akeo Katahira
  • Patent number: 7106426
    Abstract: There is disclosed a method of inspecting an optical waveguide substrate for optical conduction at an increased inspecting rate and also inspecting an optical waveguide substrate for cross-talk. According to the disclosed method, a laser beam is applied from a laser beam scanning optical system to one end face of an optical waveguide of an optical waveguide substrate which is an object to be inspected, and the laser beam emitted from the other end of the optical waveguide is detected by a CCD camera, which output detected result data. A light spot position confirming device compares the detected result data with stored data.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: September 12, 2006
    Assignee: NEC Toppan Circuit Solutions, Inc.
    Inventors: Hideo Kikuchi, Mikio Oda, Hikaru Kouta, Sakae Kitajo, Yuzo Shimada, Yoshio Matsumoto, Shinichi Tamabayashi
  • Publication number: 20060139882
    Abstract: A cooling device includes a cooling panel wherein a passage is formed by bonding together a bottom heat radiation plate having a groove formed therein and a top heat radiation plate, and a circulation pump circulating refrigerant within the passage. The top heat radiation plate is provided with an outlet port through which the refrigerant flows out from the passage to the circulation pump and an inlet port through which the refrigerant flows in from the circulation pump to the passage. The circulation pump is fixed onto the top heat radiation plate of the cooling panel so that the suction port and discharge port are aligned with the outlet port and inlet port, respectively.
    Type: Application
    Filed: June 25, 2004
    Publication date: June 29, 2006
    Inventors: Kazuyuki Mikubo, Sakae Kitajo, Atsushi Ochi, Mitsuru Yamamoto
  • Publication number: 20060103028
    Abstract: An object of the present invention is to provide an electronic part device which can be repaired even in the case of an electronic part device having a malfunction in electrical connection after carrying out underfill. The present invention is an electronic part device in which a semiconductor element (flip chip) (3) is mounted on a wiring circuit substrate (1) under such a state that an electrode part for connection (joint ball) disposed on the semiconductor element (flip chip) (3) and a circuit electrode (5) disposed on the wiring circuit substrate (1) are facing with each other. In addition, the gap between the wiring circuit substrate (1) and the semiconductor element (flip chip) (3) is filled by a filling resin layer (4) comprising a liquid epoxy resin composition which comprises the following component (D) and the following components (A) to (C) (A) A liquid epoxy resin. (B) A curing agent. (C) An N,N,N?,N?-tetra-substituted fluorine-containing aromatic diamine compound.
    Type: Application
    Filed: December 24, 2003
    Publication date: May 18, 2006
    Applicants: NITTO DENKO CORPORATION, NEC CORPORATION
    Inventors: Ichiro Hazeyama, Masahiro Kubo, Sakae Kitajo, Koji Matsui, Kazumasa Igarashi, Hiroshi Noro
  • Publication number: 20060055053
    Abstract: A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.
    Type: Application
    Filed: November 7, 2005
    Publication date: March 16, 2006
    Inventors: Takao Yamazaki, Hirobumi Inoue, Ichiro Hazeyama, Sakae Kitajo, Masahiro Kubo, Yoshimichi Sogawa, Hidehiko Kuroda
  • Publication number: 20060049495
    Abstract: A semiconductor package has a semiconductor device chip and a flexible substrate having a thermoplastic insulating resin layer. An electrode provided on the flexible substrate is connected to a predetermined electrode of the semiconductor device chip and sealed by the thermoplastic insulating resin layer. The flexible substrate is bent and provided with electrodes on the electrode-bearing and other surfaces. The flexible substrate has multi-layered wirings. Grooves or thin layer portions having a different number of wiring layers are formed at bends of the flexible substrate or regions including the bends, thereby creating a cavity at a portion in which a semiconductor device is packaged. Then, the flexible substrate is bent at predetermined positions to form a semiconductor package which does not depend on the outer dimensions of the semiconductor device chip.
    Type: Application
    Filed: November 19, 2003
    Publication date: March 9, 2006
    Applicant: NEC CORPORATION
    Inventors: Ichiro Hazeyama, Yoshimichi Sogawa, Takao Yamazaki, Sakae Kitajo
  • Patent number: 6999643
    Abstract: After an optical waveguide substrate including a supporting substrate is adhered to an electric wiring board, the supporting substrate alone is dissolved using an organic solvent for removal. Alternatively, the supporting substrate alone is melted through a thermal treatment for removal. Further, a core layer of an optical waveguide is formed on the substrate using a photosensitive resin having a thermal expansion coefficient substantially identical to that of the supporting substrate.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: February 14, 2006
    Assignee: NEC Toppan Circuit Solutions, Inc.
    Inventors: Hideo Kikuchi, Mikio Oda, Hikaru Kouta, Sakae Kitajo, Yuzo Shimada
  • Patent number: 6998704
    Abstract: A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.
    Type: Grant
    Filed: August 21, 2003
    Date of Patent: February 14, 2006
    Assignee: NEC Corporation
    Inventors: Takao Yamazaki, Hirobumi Inoue, Ichiro Hazeyama, Sakae Kitajo, Masahiro Kubo, Yoshimichi Sogawa, Hidehiko Kuroda
  • Publication number: 20050231914
    Abstract: The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 and the air cooling unit 12 are formed in a unit. A heat absorption surface 19 of the liquid cooling unit 9 is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box 2. In the liquid cooling unit 9, a liquid cooling pump 14 composed of an electromagnetic pump is arranged for circulating the coolant in the flow path 10. The heat generated by the heat generation components such as CPU 6, heat generator 7, and the like is thermally diffused with heat conduction into the whole liquid cooling unit 9 by circulating the coolant with the liquid cooling pump 14.
    Type: Application
    Filed: August 18, 2003
    Publication date: October 20, 2005
    Inventors: Kazuyuki Mikubo, Sakae Kitajo, Yasuhiro Sasaki, Atsushi Ochi, Mitsuru Yamamoto
  • Patent number: 6934429
    Abstract: An optical waveguide board is provided which includes a substrate, an optical path changing unit being formed on the substrate used to change a direction of an optical path of incident light from a direction being vertical to a surface of the substrate to a direction being horizontal to the surface of the substrate and to condense a luminous flux and an optical waveguide being formed on the substrate to carry out multi-mode transmission of a luminous flux fed from the optical path changing unit wherein, based on a spread angle of the luminous flux formed by the optical path changing unit, mainly light components to be transmitted in a zero-order mode to a three-order mode only, out of various kinds of modes for the multi-mode transmission, is transmitted through the optical waveguide.
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: August 23, 2005
    Assignee: NEC Corporation
    Inventors: Hideo Kikuchi, Junichi Sasaki, Seiji Suda, Mikio Oda, Hikaru Kouta, Sakae Kitajo, Yuzo Shimada
  • Patent number: 6926188
    Abstract: Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: August 9, 2005
    Assignees: NEC Corporation, Japan E.M. Co., Ltd.
    Inventors: Ichiro Hazeyama, Sakae Kitajo, Yuzo Shimada, Akeo Katahira, Jun Ishida, Masaru Terashima, Kazuhiko Futakami
  • Patent number: 6889886
    Abstract: Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: May 10, 2005
    Assignees: NEC Corporation, Japan E.M. Co., LTD.
    Inventors: Ichiro Hazeyama, Sakae Kitajo, Yuzo Shimada, Akeo Katahira, Jun Ishida, Masaru Terashima, Kazuhiko Futakami
  • Publication number: 20050040528
    Abstract: A method of arranging micro spheres with liquid, a micro sphere arranging device and a semiconductor device, the method comprising the steps of placing the semiconductor device (2) with holes placed, through a large number of pads, on a loading table (3) with variable tilt angle, flowing macro spheres together with conductive liquid held in a holding container (6) down to the semiconductor device (2) to storably place the micro spheres on the pad storably in the holes of the semiconductor device (2), receiving and accumulating the non-stored micro spheres and conductive liquid by a receiving tank (1), and carrying the conductive liquid including the accumulated micro spheres to the holding container (6) by a pump (11)
    Type: Application
    Filed: January 10, 2003
    Publication date: February 24, 2005
    Inventors: Ichiro Hazeyama, Masahiro Kubo, Sakae Kitajo, Kazuhiko Futakami, Shinichi Ishiduka, Susumu Nanko, Hitoshi Anma, Tosiji Yamada, Akeo Katahira
  • Patent number: 6829079
    Abstract: An optical path control apparatus includes a first substrate. A second substrate is movably provided for the first substrate. A mirror section is provided on the second substrate. A driving section moves the second substrate such that a first optical path of input light to the mirror section is optically connected to one of a plurality of second optical paths.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: December 7, 2004
    Assignee: NEC Corporation
    Inventors: Mikio Oda, Mitsuru Yamamoto, Hikaru Kouta, Yasuhiro Sasaki, Sakae Kitajo, Yuzo Shimada
  • Publication number: 20040115920
    Abstract: A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.
    Type: Application
    Filed: August 21, 2003
    Publication date: June 17, 2004
    Applicant: NEC CORPORATION
    Inventors: Takao Yamazaki, Hirobumi Inoue, Ichiro Hazeyama, Sakae Kitajo, Masahiro Kubo, Yoshimichi Sogawa, Hidehiko Kuroda
  • Publication number: 20040108593
    Abstract: In a method for fabricating an optical circuit, a mirror element with a protection film formed within a die of a semiconductor is connected to a substrate at a predetermined position. The mirror element with the protection film connected to the substrate is peeled from the die of the semiconductor. The protection film is removed to expose a reflection surface of a reflection film of the mirror element.
    Type: Application
    Filed: October 8, 2003
    Publication date: June 10, 2004
    Applicant: NEC CORPORATION
    Inventors: Mikio Oda, Koji Soejima, Sakae Kitajo
  • Publication number: 20040094601
    Abstract: Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.
    Type: Application
    Filed: November 4, 2003
    Publication date: May 20, 2004
    Inventors: Ichiro Hazeyama, Sakae Kitajo, Yuzo Shimada, Akeo Katahira, Jun Ishida, Masaru Terashima, Kazuhiko Futakami
  • Patent number: 6674016
    Abstract: An electronic component is described, which contains a printed circuit board having electrodes for connection and a semiconductor chip having electrodes for connection which is mounted on said circuit board with their electrodes facing those of the circuit board, the gap between the circuit board and the semiconductor chip being filled with a sealing resin layer, wherein the sealing resin layer is formed of a liquid epoxy resin composition containing (A) a liquid epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) an N,N,N′,N′-tetrasubstituted fluorine-containing aromatic diamine derivative.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: January 6, 2004
    Assignees: Nitto Denko Corporation, NEC Corporation
    Inventors: Masahiro Kubo, Ichiro Hazeyama, Sakae Kitajo, Koji Matsui, Kazumasa Igarashi
  • Patent number: 6670699
    Abstract: A semiconductor package comprising an LSI chip, a chip bump, an interposer, and a BGA bump is mounted at a predetermined position of a printed wiring board having a core layer. A heat sink for dissipating heat generated from the LSI chip is installed within the core layer. Further, heat radiating vias for conveying heat generated from the LSI chip to the heat sink are provided within the printed wiring board so that the BGA bump in the LSI chip is thermally liked with the heat sink. The heat generated from the LSI chip is mainly dissipated through a route of chip bump→interposer→BGA bump→heat radiating via→heat sink. By virtue of the above construction, the semiconductor device packaging structure can reduce the packaging volume of the heat sink while providing satisfactory cooling capacity and, at the same time, can minimize the length of signal wiring between LSI chips.
    Type: Grant
    Filed: March 4, 2002
    Date of Patent: December 30, 2003
    Assignee: NEC Corporation
    Inventors: Kazuyuki Mikubo, Sakae Kitajo, Yuzo Shimada