Patents by Inventor Salvatore Bernardo Olivadese

Salvatore Bernardo Olivadese has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11126776
    Abstract: A system includes a memory that stores computer executable components, and a processor executes the computer executable components stored in the memory. The computer executable components comprise: an assessment component that determines locations for mode suppression structures on a coplanar waveguide of a quantum chip having qubits; a simulation component that simulates performance of the quantum chip based on a subset of the locations for the mode suppression structures and parameters of the quantum chip, and generates a mode suppression structures placement model. A template component generates a template of specific coordinates for placement of a subset of the mode suppression structures on the quantum chip based on the mode suppression structures placement model; and a driver component employs the template to drive an auto-bonder to install the subset of the mode suppression structures on the quantum chip at the specific coordinates.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: September 21, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Salvatore Bernardo Olivadese, Vivekananda P. Adiga, Jared Barney Hertzberg
  • Patent number: 11108120
    Abstract: An architecture for, and techniques for fabricating, a cryogenic microwave filter having reduced Kapitza resistance are provided. In some embodiments, the cryogenic microwave filter can comprise a substrate and a conductive line. The substrate can be formed of a material having a thermal conductivity property that sufficiently reduces Kapitza resistance in the cryogenic environment. The conductive line can be formed in a recess of the substrate and facilitate a filter operation on a microwave signal propagated in a cryogenic environment. In some embodiments, the conductive line can be formed according to a sintering technique that can reduce Kapitza resistance.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: August 31, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Patryk Gumann, Salvatore Bernardo Olivadese
  • Patent number: 11102879
    Abstract: A transition between a printed circuit board and a dielectric layer with controlled impedance and reduced and/or mitigate crosstalk for quantum applications are provided. A quantum device can comprise a microwave quantum circuit on a dielectric substrate and a printed circuit board comprising a via that comprises a transmission line. A wirebond between the transmission line of the printed circuit board and a transmission line of the microwave quantum circuit operatively couples the microwave quantum circuit to the printed circuit board. The via comprises a defined characteristic impedance. The wirebond provides a microwave signal connection between the printed circuit board and the microwave quantum circuit.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: August 24, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Salvatore Bernardo Olivadese, Patryk Gumann, Nicholas Torleiv Bronn
  • Patent number: 11074382
    Abstract: Techniques and a system for quantum computing device modeling and design are provided. In one example, a system includes a modeling component and a simulation component. The modeling component models a quantum device element of a quantum computing device as an electromagnetic circuit element to generate electromagnetic circuit data for the quantum computing device. The simulation component simulates the quantum computing device using the electromagnetic circuit data to generate response function data indicative of a response function for the quantum computing device. Additionally or alternatively, a Hamiltonian is constructed based on the response function.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: July 27, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hanhee Paik, Firat Solgun, Salvatore Bernardo Olivadese, Martin O. Sandberg, Jay M. Gambetta
  • Publication number: 20210201187
    Abstract: Systems, computer-implemented methods, and computer program products that can facilitate determining a state of a qubit are described. According to an embodiment, a system can comprise a memory that stores computer executable components and a processor that executes the computer executable components stored in the memory. The computer executable components can comprise a relation determining component that can determine relation of a status signal of a quantum computing device to a noise value of the quantum computing device. The system can further include an operation time estimator that can estimate an operation time for the quantum computing device based on the relation of the status signal to the noise value.
    Type: Application
    Filed: December 26, 2019
    Publication date: July 1, 2021
    Inventors: Salvatore Bernardo Olivadese, Daniela Florentina Bogorin, Nicholas Torleiv Bronn, Sean Hart, Patryk Gumann
  • Publication number: 20210151657
    Abstract: Techniques for a quantum device with modular quantum building blocks are provided. In one embodiment, a device is provided that comprises a substrate that is coupled with a plurality of qubit pockets, where at least one qubit pocket of the plurality of qubit pockets is coupled with a qubit. In one implementation, the device can further comprise a plurality of connectors coupled to the substrate and positioned around at least a portion of the substrate, where the plurality of connectors comprising a connecting element. In one or more implementations, the device can further comprise a plurality of transmission lines formed on the substrate and connect at least one connector of the plurality of connectors to at least one qubit pocket of the plurality of qubit pockets.
    Type: Application
    Filed: January 26, 2021
    Publication date: May 20, 2021
    Inventors: Salvatore Bernardo Olivadese, Mark Ritter
  • Publication number: 20210119313
    Abstract: The technology described herein is directed towards a cryogenic-stripline microwave attenuator. A first high thermal conductivity substrate such as sapphire and a second high thermal conductivity substrate such as sapphire, along with a signal conductor comprising one or more attenuator lines between the substrates form a stripline. A compression component such as one or more screws, vias (plus clamps) and/or clamps presses the first high thermal conductivity substrate against one side of the signal conductor and presses the second high thermal conductivity substrate against another side of the signal conductor. The high thermal conductivity of the substrates facilitates improved thermalization, while the pressing of the substrates against the conductor reduces the thermal boundary (Kapitza) resistance and thereby, for example, improves thermalization and reduces thermal noise.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 22, 2021
    Inventors: Salvatore Bernardo Olivadese, Patryk Gumann, Jay M. Gambetta, Jerry M. Chow
  • Publication number: 20210111469
    Abstract: An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.
    Type: Application
    Filed: October 14, 2020
    Publication date: April 15, 2021
    Inventors: Patryk Gumann, Salvatore Bernardo Olivadese
  • Patent number: 10971672
    Abstract: Techniques for a quantum device with modular quantum building blocks are provided. In one embodiment, a device is provided that comprises a substrate that is coupled with a plurality of qubit pockets, where at least one qubit pocket of the plurality of qubit pockets is coupled with a qubit. In one implementation, the device can further comprise a plurality of connectors coupled to the substrate and positioned around at least a portion of the substrate, where the plurality of connectors comprising a connecting element. In one or more implementations, the device can further comprise a plurality of transmission lines formed on the substrate and connect at least one connector of the plurality of connectors to at least one qubit pocket of the plurality of qubit pockets.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: April 6, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Salvatore Bernardo Olivadese, Mark Ritter
  • Patent number: 10964993
    Abstract: The technology described herein is directed towards a cryogenic-stripline microwave attenuator. A first high thermal conductivity substrate such as sapphire and a second high thermal conductivity substrate such as sapphire, along with a signal conductor comprising one or more attenuator lines between the substrates form a stripline. A compression component such as one or more screws, vias (plus clamps) and/or clamps presses the first high thermal conductivity substrate against one side of the signal conductor and presses the second high thermal conductivity substrate against another side of the signal conductor. The high thermal conductivity of the substrates facilitates improved thermalization, while the pressing of the substrates against the conductor reduces the thermal boundary (Kapitza) resistance and thereby, for example, improves thermalization and reduces thermal noise.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: March 30, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Salvatore Bernardo Olivadese, Patryk Gumann, Jay M. Gambetta, Jerry M. Chow
  • Publication number: 20210076530
    Abstract: Devices, systems, methods, and computer-implemented methods to facilitate employing thermalizing materials in an enclosure for quantum computing devices are provided. According to an embodiment, a system can comprise a quantum computing device and an enclosure having the quantum computing device disposed within the enclosure. The system can further comprise a thermalizing material disposed within the enclosure, with the thermalizing material being adapted to thermally link a cryogenic device to the quantum computing device.
    Type: Application
    Filed: September 5, 2019
    Publication date: March 11, 2021
    Inventors: Sean Hart, Daniela Florentina Bogorin, Nicholas Torleiv Bronn, Patryk Gumann, Salvatore Bernardo Olivadese
  • Publication number: 20210068320
    Abstract: Techniques regarding shielding one or more superconducting devices are provided. For example, one or more embodiments described herein can comprise an apparatus, which can comprise a multi-layer enclosure that shields a superconducting device from a magnetic field and radiation. Further, the multi-layer enclosure can comprise a superconducting material layer that can have a thickness that inhibits a penetration of the multi-layer enclosure by the magnetic field. The multi-layer enclosure can also comprise a metal layer adjacent to the superconducting material layer. The metal layer can have a high thermal conductivity that achieves thermalization with the superconducting material layer. Moreover, the multi-layer enclosure can comprise a radiation shield layer adjacent to the superconducting material layer.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 4, 2021
    Inventors: Daniela Florentina Bogorin, Sean Hart, Patryk Gumann, Nicholas Torleiv Bronn, Salvatore Bernardo Olivadese, Oblesh Jinka
  • Patent number: 10897069
    Abstract: An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: January 19, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Patryk Gumann, Salvatore Bernardo Olivadese
  • Publication number: 20210013570
    Abstract: An architecture for, and techniques for fabricating, a cryogenic microwave filter having reduced Kapitza resistance are provided. In some embodiments, the cryogenic microwave filter can comprise a substrate and a conductive line. The substrate can be formed of a material having a thermal conductivity property that sufficiently reduces Kapitza resistance in the cryogenic environment. The conductive line can be formed in a recess of the substrate and facilitate a filter operation on a microwave signal propagated in a cryogenic environment. In some embodiments, the conductive line can be formed according to a sintering technique that can reduce Kapitza resistance.
    Type: Application
    Filed: September 30, 2020
    Publication date: January 14, 2021
    Inventors: Patryk Gumann, Salvatore Bernardo Olivadese
  • Patent number: 10891251
    Abstract: In an embodiment, a device includes a first high density interface in a first dilution fridge stage configured to receive a first set of transmission lines. In an embodiment, a device includes a second high density interface in a second dilution fridge stage configured to receive a second set of transmission lines. In an embodiment, a device includes a printed circuit board configured to transfer microwave signals between a first dilution fridge stage and the second dilution fridge stage, the first high density interface and the second high density interface coupled to the printed circuit board.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: January 12, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Salvatore Bernardo Olivadese, Patryk Gumann, Nicholas T. Bronn
  • Publication number: 20210003456
    Abstract: Techniques regarding determining and/or analyzing temperature distributions experienced by quantum computer devices during operation are provided. For example, one or more embodiments described herein can comprise a system, which can comprise a memory that can store computer executable components. The system can also comprise a processor, operably coupled to the memory, and that can execute the computer executable components stored in the memory. The computer executable components can comprise a region component that can define a plurality of temperature regions from a quantum computing device layout. The computer executable component can also comprise a map component that can generate a map that characterizes a temperature distribution by determining at least one temperature achieved within the plurality of temperature regions during an operation of the quantum computing device layout.
    Type: Application
    Filed: July 2, 2019
    Publication date: January 7, 2021
    Inventors: Salvatore Bernardo Olivadese, Daniela Florentina Bogorin, Nicholas Torleiv Bronn, Sean Hart, Patryk Gumann
  • Publication number: 20210003457
    Abstract: Techniques regarding determining the temperature of one or more quantum computing devices are provided. For example, one or more embodiments described herein can comprise a system, which can comprise a temperature component that can determine a temperature of a superconducting resonator based on a frequency shift exhibited by the superconducting resonator due to a change in kinetic inductance with a change in temperature.
    Type: Application
    Filed: July 2, 2019
    Publication date: January 7, 2021
    Inventors: Salvatore Bernardo Olivadese, Daniela Florentina Bogorin, Nicholas Torleiv Bronn, Sean Hart, Patryk Gumann
  • Publication number: 20210006234
    Abstract: Systems, computer-implemented methods, and computer program products that can facilitate superconducting resonator definition based on one or more superconducting circuit attributes, are described. According to an embodiment, a system can comprise a memory that stores computer executable components and a processor that executes the computer executable components stored in the memory. The computer executable components can comprise a resonant circuit component that derives a resonant circuit indicative of a superconducting resonator of a superconducting circuit based on one or more attributes of the superconducting circuit. The computer executable components can further comprise a resonator definition component that defines a frequency value of the superconducting resonator based on the resonant circuit.
    Type: Application
    Filed: September 14, 2020
    Publication date: January 7, 2021
    Inventor: Salvatore Bernardo Olivadese
  • Patent number: 10886585
    Abstract: An architecture for, and techniques for fabricating, a cryogenic microwave filter having reduced Kapitza resistance are provided. In some embodiments, the cryogenic microwave filter can comprise a substrate and a conductive line. The substrate can be formed of a material having a thermal conductivity property that sufficiently reduces Kapitza resistance in the cryogenic environment. The conductive line can be formed in a recess of the substrate and facilitate a filter operation on a microwave signal propagated in a cryogenic environment. In some embodiments, the conductive line can be formed according to a sintering technique that can reduce Kapitza resistance.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: January 5, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Patryk Gumann, Salvatore Bernardo Olivadese
  • Publication number: 20200404806
    Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.
    Type: Application
    Filed: June 19, 2019
    Publication date: December 24, 2020
    Applicant: International Business Machines Corporation
    Inventors: Oblesh Jinka, Salvatore Bernardo Olivadese, Sean Hart, Nicholas Torleiv Bronn, Jerry M. Chow, Markus Brink, Patryk Gumann, Daniela Florentina Bogorin