Abstract: A system includes a quantum processor includes a plurality of qubits. For each qubit, there is a circulator operative to receive a control signal and an output signal from the qubit. An isolator is coupled to an output of the circulator. A quantum-limited amplifier is coupled to an output of the isolator and configured to provide an output of the qubit. A multiplexor (MUX) is configured to frequency multiplex the outputs of at least two of the plurality of qubits as a single output of the quantum processor.

Abstract: Systems, computer-implemented methods, and computer program products that can facilitate superconducting resonator definition based on one or more superconducting circuit attributes, are described. According to an embodiment, a system can comprise a memory that stores computer executable components and a processor that executes the computer executable components stored in the memory. The computer executable components can comprise a resonant circuit component that derives a resonant circuit indicative of a superconducting resonator of a superconducting circuit based on one or more attributes of the superconducting circuit. The computer executable components can further comprise a resonator definition component that defines a frequency value of the superconducting resonator based on the resonant circuit.

Abstract: A quantum computing system includes a dilution refrigerator having a plurality of chambers. A trapped ion computing device includes a first set of qubits in a given chamber of the plurality of chambers of the dilution refrigerator. A superconducting computing device having a second set of superconducting qubits is inside the given chamber of the plurality of chambers of the dilution refrigerator.

Abstract: Techniques and a system for quantum computing device modeling and design are provided. In one example, a system includes a modeling component and a simulation component. The modeling component models a quantum device element of a quantum computing device as an electromagnetic circuit element to generate electromagnetic circuit data for the quantum computing device. The simulation component simulates the quantum computing device using the electromagnetic circuit data to generate response function data indicative of a response function for the quantum computing device. Additionally or alternatively, a Hamiltonian is constructed based on the response function.

Abstract: Techniques for designing and fabricating quantum circuitry, including a coplanar waveguide (CPW), for quantum applications are presented. With regard to a CPW, a central conductor and two return conductor lines can be formed on a dielectric substrate, with one return conductor line on each side of the central conductor and separated from it by a space. The central conductor can have bridge portions that can be raised a desired distance above the substrate and base conductor portions situated between the bridge portions and in contact with the surface of the substrate; and/or portions of the substrate underneath the bridge portions of the central conductor can be removed such that the bridge portions, whether raised or unraised, can be the desired distance above the surface of the remaining substrate, and the base conductor portions can be in contact with other portions of the surface of the substrate that were not removed.

Abstract: A system includes a memory that stores computer executable components, and a processor executes the computer executable components stored in the memory. The computer executable components comprise: an assessment component that determines locations for mode suppression structures on a coplanar waveguide of a quantum chip having qubits; a simulation component that simulates performance of the quantum chip based on a subset of the locations for the mode suppression structures and parameters of the quantum chip, and generates a mode suppression structures placement model. A template component generates a template of specific coordinates for placement of a subset of the mode suppression structures on the quantum chip based on the mode suppression structures placement model; and a driver component employs the template to drive an auto-bonder to install the subset of the mode suppression structures on the quantum chip at the specific coordinates.

Abstract: An architecture for, and techniques for fabricating, a cryogenic microwave filter having reduced Kapitza resistance are provided. In some embodiments, the cryogenic microwave filter can comprise a substrate and a conductive line. The substrate can be formed of a material having a thermal conductivity property that sufficiently reduces Kapitza resistance in the cryogenic environment. The conductive line can be formed in a recess of the substrate and facilitate a filter operation on a microwave signal propagated in a cryogenic environment. In some embodiments, the conductive line can be formed according to a sintering technique that can reduce Kapitza resistance.

Abstract: A transition between a printed circuit board and a dielectric layer with controlled impedance and reduced and/or mitigate crosstalk for quantum applications are provided. A quantum device can comprise a microwave quantum circuit on a dielectric substrate and a printed circuit board comprising a via that comprises a transmission line. A wirebond between the transmission line of the printed circuit board and a transmission line of the microwave quantum circuit operatively couples the microwave quantum circuit to the printed circuit board. The via comprises a defined characteristic impedance. The wirebond provides a microwave signal connection between the printed circuit board and the microwave quantum circuit.

Abstract: Techniques and a system for quantum computing device modeling and design are provided. In one example, a system includes a modeling component and a simulation component. The modeling component models a quantum device element of a quantum computing device as an electromagnetic circuit element to generate electromagnetic circuit data for the quantum computing device. The simulation component simulates the quantum computing device using the electromagnetic circuit data to generate response function data indicative of a response function for the quantum computing device. Additionally or alternatively, a Hamiltonian is constructed based on the response function.

Abstract: Systems, computer-implemented methods, and computer program products that can facilitate determining a state of a qubit are described. According to an embodiment, a system can comprise a memory that stores computer executable components and a processor that executes the computer executable components stored in the memory. The computer executable components can comprise a relation determining component that can determine relation of a status signal of a quantum computing device to a noise value of the quantum computing device. The system can further include an operation time estimator that can estimate an operation time for the quantum computing device based on the relation of the status signal to the noise value.

Abstract: Techniques for a quantum device with modular quantum building blocks are provided. In one embodiment, a device is provided that comprises a substrate that is coupled with a plurality of qubit pockets, where at least one qubit pocket of the plurality of qubit pockets is coupled with a qubit. In one implementation, the device can further comprise a plurality of connectors coupled to the substrate and positioned around at least a portion of the substrate, where the plurality of connectors comprising a connecting element. In one or more implementations, the device can further comprise a plurality of transmission lines formed on the substrate and connect at least one connector of the plurality of connectors to at least one qubit pocket of the plurality of qubit pockets.

Abstract: The technology described herein is directed towards a cryogenic-stripline microwave attenuator. A first high thermal conductivity substrate such as sapphire and a second high thermal conductivity substrate such as sapphire, along with a signal conductor comprising one or more attenuator lines between the substrates form a stripline. A compression component such as one or more screws, vias (plus clamps) and/or clamps presses the first high thermal conductivity substrate against one side of the signal conductor and presses the second high thermal conductivity substrate against another side of the signal conductor. The high thermal conductivity of the substrates facilitates improved thermalization, while the pressing of the substrates against the conductor reduces the thermal boundary (Kapitza) resistance and thereby, for example, improves thermalization and reduces thermal noise.

Abstract: An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

Abstract: Techniques for a quantum device with modular quantum building blocks are provided. In one embodiment, a device is provided that comprises a substrate that is coupled with a plurality of qubit pockets, where at least one qubit pocket of the plurality of qubit pockets is coupled with a qubit. In one implementation, the device can further comprise a plurality of connectors coupled to the substrate and positioned around at least a portion of the substrate, where the plurality of connectors comprising a connecting element. In one or more implementations, the device can further comprise a plurality of transmission lines formed on the substrate and connect at least one connector of the plurality of connectors to at least one qubit pocket of the plurality of qubit pockets.

Abstract: The technology described herein is directed towards a cryogenic-stripline microwave attenuator. A first high thermal conductivity substrate such as sapphire and a second high thermal conductivity substrate such as sapphire, along with a signal conductor comprising one or more attenuator lines between the substrates form a stripline. A compression component such as one or more screws, vias (plus clamps) and/or clamps presses the first high thermal conductivity substrate against one side of the signal conductor and presses the second high thermal conductivity substrate against another side of the signal conductor. The high thermal conductivity of the substrates facilitates improved thermalization, while the pressing of the substrates against the conductor reduces the thermal boundary (Kapitza) resistance and thereby, for example, improves thermalization and reduces thermal noise.

Abstract: Devices, systems, methods, and computer-implemented methods to facilitate employing thermalizing materials in an enclosure for quantum computing devices are provided. According to an embodiment, a system can comprise a quantum computing device and an enclosure having the quantum computing device disposed within the enclosure. The system can further comprise a thermalizing material disposed within the enclosure, with the thermalizing material being adapted to thermally link a cryogenic device to the quantum computing device.

Abstract: Techniques regarding shielding one or more superconducting devices are provided. For example, one or more embodiments described herein can comprise an apparatus, which can comprise a multi-layer enclosure that shields a superconducting device from a magnetic field and radiation. Further, the multi-layer enclosure can comprise a superconducting material layer that can have a thickness that inhibits a penetration of the multi-layer enclosure by the magnetic field. The multi-layer enclosure can also comprise a metal layer adjacent to the superconducting material layer. The metal layer can have a high thermal conductivity that achieves thermalization with the superconducting material layer. Moreover, the multi-layer enclosure can comprise a radiation shield layer adjacent to the superconducting material layer.

Abstract: An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

Abstract: An architecture for, and techniques for fabricating, a cryogenic microwave filter having reduced Kapitza resistance are provided. In some embodiments, the cryogenic microwave filter can comprise a substrate and a conductive line. The substrate can be formed of a material having a thermal conductivity property that sufficiently reduces Kapitza resistance in the cryogenic environment. The conductive line can be formed in a recess of the substrate and facilitate a filter operation on a microwave signal propagated in a cryogenic environment. In some embodiments, the conductive line can be formed according to a sintering technique that can reduce Kapitza resistance.

Abstract: In an embodiment, a device includes a first high density interface in a first dilution fridge stage configured to receive a first set of transmission lines. In an embodiment, a device includes a second high density interface in a second dilution fridge stage configured to receive a second set of transmission lines. In an embodiment, a device includes a printed circuit board configured to transfer microwave signals between a first dilution fridge stage and the second dilution fridge stage, the first high density interface and the second high density interface coupled to the printed circuit board.