Patents by Inventor Salvatore Frank Pavone
Salvatore Frank Pavone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11948871Abstract: Disclosed embodiments include an integrated circuit (IC) comprising a silicon wafer, first and second conductive lines on the silicon wafer. There are first, second and third insulation blocks with portions on the first and second conductive lines and the silicon wafer, a metal pillar on the surface of the first conductive line opposite the silicon wafer, and a conductive adhesive block on the surface of the second conductive line opposite the silicon wafer. The IC also has a lead frame having first and second leads, and a capacitor having first and second capacitor terminals in which the first capacitor terminal is connected to the second lead using conductive adhesive, the second capacitor terminal is connected to the second conductive line through the conductive adhesive block, and the first lead is coupled to the first conductive line.Type: GrantFiled: May 19, 2021Date of Patent: April 2, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Benjamin Stassen Cook, Yogesh Kumar Ramadass, Salvatore Frank Pavone, Mahmud Halim Chowdhury
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Patent number: 11876065Abstract: In a described example, an apparatus includes: a semiconductor die having a device side surface; bond pads on the semiconductor die on the device side surface; post connects having a proximate end on the bond pads and extending from the bond pads to a distal end, the diameter of the post connects at the proximate end being the same as the diameter of the post connects at the distal end; polyimide material covering sides of the post connects and covering at least a portion of the bond pads; and solder bumps on the distal end of the post connects.Type: GrantFiled: September 30, 2021Date of Patent: January 16, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Katleen Fajardo Timbol, Salvatore Frank Pavone, Rafael Jose Lizares Guevara
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Patent number: 11876056Abstract: In some examples, a semiconductor package includes a semiconductor die; a passivation layer abutting a device side of the semiconductor die; a first conductive layer abutting the device side of the semiconductor die; a second conductive layer abutting the first conductive layer and the passivation layer; a silicon nitride layer abutting the second conductive layer, the silicon nitride layer having a thickness ranging from 300 Angstroms to 3000 Angstroms; and a third conductive layer coupled to the second conductive layer at a gap in the silicon nitride layer, the third conductive layer configured to receive a solder ball.Type: GrantFiled: April 30, 2021Date of Patent: January 16, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Jonathan Andrew Montoya, Salvatore Franks Pavone
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Patent number: 11855024Abstract: In some examples a wafer chip scale package (WCSP) includes a semiconductor die having a device side in which a circuit is formed, and a redistribution layer (RDL) coupled to the device side that is positioned within an insulating member. In addition, the WCSP includes a scribe seal circumscribing the circuit along the device side, wherein the RDL abuts the scribe seal. Further, the WCSP includes a conductive member coupled to the RDL. The conductive member is configured to receive a solder member, and the insulating member does not extend along the device side of the semiconductor die between the conductive member and a portion of an outer perimeter of the WCSP closest to the conductive member.Type: GrantFiled: August 31, 2021Date of Patent: December 26, 2023Assignee: Texas Instruments IncorporatedInventors: Qiao Chen, Vivek Swaminathan Sridharan, Christopher Daniel Manack, Patrick Francis Thompson, Jonathan Andrew Montoya, Salvatore Frank Pavone
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Publication number: 20230104156Abstract: In a described example, an apparatus includes: a semiconductor die having a device side surface; bond pads on the semiconductor die on the device side surface; post connects having a proximate end on the bond pads and extending from the bond pads to a distal end, the diameter of the post connects at the proximate end being the same as the diameter of the post connects at the distal end; polyimide material covering sides of the post connects and covering at least a portion of the bond pads; and solder bumps on the distal end of the post connects.Type: ApplicationFiled: September 30, 2021Publication date: April 6, 2023Inventors: Katleen Fajardo Timbol, Salvatore Frank Pavone, Rafael Jose Lizares Guevara
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Publication number: 20230065075Abstract: In some examples a wafer chip scale package (WCSP) includes a semiconductor die having a device side in which a circuit is formed, and a redistribution layer (RDL) coupled to the device side that is positioned within an insulating member. In addition, the WCSP includes a scribe seal circumscribing the circuit along the device side, wherein the RDL abuts the scribe seal. Further, the WCSP includes a conductive member coupled to the RDL. The conductive member is configured to receive a solder member, and the insulating member does not extend along the device side of the semiconductor die between the conductive member and a portion of an outer perimeter of the WCSP closest to the conductive member.Type: ApplicationFiled: August 31, 2021Publication date: March 2, 2023Inventors: Qiao CHEN, Vivek Swaminathan SRIDHARAN, Christopher Daniel MANACK, Patrick Francis THOMPSON, Jonathan Andrew MONTOYA, Salvatore Frank PAVONE
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Patent number: 11594504Abstract: A packaged semiconductor die includes a semiconductor die coupled to a die pad. The semiconductor die has a front side containing copper leads, a copper seed layer coupled to the copper leads, and a nickel alloy coating coupled to the copper seed layer. The nickel alloy includes tungsten and cerium (NiWCe). The packaged semiconductor die may also include wire bonds coupled between leads of a lead frame and the copper leads of the semiconductor die. In addition, the packaged semiconductor die may be encapsulated in molding compound. A method for fabricating a packaged semiconductor die. The method includes forming a copper seed layer over the copper leads of the semiconductor die. In addition, the method includes coating the copper seed layer with a nickel alloy. The method also includes singulating the semiconductor wafer to create individual semiconductor die and placing the semiconductor die onto a die pad of a lead frame.Type: GrantFiled: April 19, 2021Date of Patent: February 28, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Nazila Dadvand, Christopher Daniel Manack, Salvatore Frank Pavone
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Patent number: 11587858Abstract: A microelectronic device has bump bond structures on input/output (I/O) pads. The bump bond structures include copper-containing pillars, a barrier layer including cobalt and zinc on the copper-containing pillars, and tin-containing solder on the barrier layer. The barrier layer includes 0.1 weight percent to 50 weight percent cobalt and an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick. A lead frame has a copper-containing member with a similar barrier layer in an area for a solder joint. Methods of forming the microelectronic device are disclosed.Type: GrantFiled: May 18, 2021Date of Patent: February 21, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Nazila Dadvand, Christopher Daniel Manack, Salvatore Frank Pavone
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Publication number: 20230005807Abstract: A device includes a semiconductor die including a via, a layer of titanium tungsten (TiW) in contact with the via, and a copper pillar including a top portion and a bottom portion. The bottom portion is in contact with the layer of TiW. The copper pillar includes interdiffused zinc within the bottom portion.Type: ApplicationFiled: September 13, 2022Publication date: January 5, 2023Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Nazila Dadvand, Keith Edward Johnson, Christopher Daniel Manack, Salvatore Frank Pavone
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Publication number: 20220415762Abstract: A semiconductor package includes a semiconductor die including terminals, a plurality of leads, at least some of the leads being electrically coupled to the terminals within the semiconductor package, a sensor on a surface of the semiconductor die, laser shielding forming a perimeter around the sensor on the surface of the semiconductor die, and a mold compound surrounding the semiconductor die except for an area inside the perimeter on the surface of the semiconductor die such that the sensor is exposed to an external environment.Type: ApplicationFiled: June 27, 2021Publication date: December 29, 2022Inventors: Christopher Daniel Manack, Jonathan Andrew Montoya, Steven Alfred Kummerl, Salvatore Frank Pavone
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Publication number: 20220384375Abstract: In some examples, a package comprises a die and a redistribution layer coupled to the die. The redistribution layer comprises a metal layer, a brass layer abutting the metal layer, and a polymer layer abutting the brass layer.Type: ApplicationFiled: August 9, 2022Publication date: December 1, 2022Inventors: Vivek Swaminathan Sridharan, Christopher Daniel Manack, Nazila Dadvand, Salvatore Frank Pavone, Patrick Francis Thompson
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Publication number: 20220375836Abstract: Disclosed embodiments include an integrated circuit (IC) comprising a silicon wafer, first and second conductive lines on the silicon wafer. There are first, second and third insulation blocks with portions on the first and second conductive lines and the silicon wafer, a metal pillar on the surface of the first conductive line opposite the silicon wafer, and a conductive adhesive block on the surface of the second conductive line opposite the silicon wafer. The IC also has a lead frame having first and second leads, and a capacitor having first and second capacitor terminals in which the first capacitor terminal is connected to the second lead using conductive adhesive, the second capacitor terminal is connected to the second conductive line through the conductive adhesive block, and the first lead is coupled to the first conductive line.Type: ApplicationFiled: May 19, 2021Publication date: November 24, 2022Inventors: Benjamin Stassen Cook, Yogesh Kumar Ramadass, Salvatore Frank Pavone, Mahmud Halim Chowdhury
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Publication number: 20220352098Abstract: In some examples, a semiconductor package includes a semiconductor die; a passivation layer abutting a device side of the semiconductor die; a first conductive layer abutting the device side of the semiconductor die; a second conductive layer abutting the first conductive layer and the passivation layer; a silicon nitride layer abutting the second conductive layer, the silicon nitride layer having a thickness ranging from 300 Angstroms to 3000 Angstroms; and a third conductive layer coupled to the second conductive layer at a gap in the silicon nitride layer, the third conductive layer configured to receive a solder ball.Type: ApplicationFiled: April 30, 2021Publication date: November 3, 2022Inventors: Jonathan Andrew MONTOYA, Salvatore Franks PAVONE
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Patent number: 11443996Abstract: A method for fabricating a copper pillar. The method includes forming a layer of titanium tungsten (TiW) over a semiconductor wafer, forming a layer of zinc (Zn) over the layer of TiW, and forming a copper pillar over the via. In addition, the method includes performing an anneal to diffuse the layer of Zn into the copper pillar. A semiconductor device that includes a layer of TiW coupled to a via of a semiconductor wafer and a copper pillar coupled to the layer of TiW. The copper pillar has interdiffused Zn within its bottom portion. Another method for fabricating a copper pillar includes forming a layer of TiW over a semiconductor wafer, forming a first patterned photoresist, forming a layer of Zn, and then removing the first patterned photoresist. The method further includes forming a second patterned photoresist and forming a copper pillar.Type: GrantFiled: March 1, 2018Date of Patent: September 13, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Nazila Dadvand, Keith Edward Johnson, Christopher Daniel Manack, Salvatore Frank Pavone
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Patent number: 11410947Abstract: A package comprises a die and a redistribution layer coupled to the die. The redistribution layer comprises a metal layer, a brass layer abutting the metal layer, and a polymer layer abutting the brass layer. The package is a wafer chip scale package (WCSP). The package further includes a solder ball attached to the redistribution layer.Type: GrantFiled: December 19, 2019Date of Patent: August 9, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Vivek Swaminathan Sridharan, Christopher Daniel Manack, Nazila Dadvand, Salvatore Frank Pavone, Patrick Francis Thompson
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Patent number: 11362020Abstract: A semiconductor package includes an IC having circuitry configured for at least one function with some nodes connected to bond pads, with first metal posts on the bond pads, and dome support metal posts configured in a ring having a top rim defining an inner cavity with solder on the top rim and extending over an area of the inner cavity for providing a solder dome that covers the inner cavity to provide a covered air cavity over a portion of the circuitry. A leadframe includes a plurality of leads or lead terminals. The IC is flipchip attached with a solder connection to the leadframe so that the first metal posts are attached to the leads or the lead terminals. A mold compound provides encapsulation for the semiconductor package except on at least a bottom side of the leads or lead terminals.Type: GrantFiled: November 16, 2020Date of Patent: June 14, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Christopher Daniel Manack, Jonathan Andrew Montoya, Jovenic Romero Esquejo, Salvatore Frank Pavone
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Publication number: 20220173062Abstract: A structure for a semiconductor device includes a copper (Cu) layer and a first nickel (Ni) alloy layer with a Ni grain size a1. The structure also includes a second Ni alloy layer with a Ni grain size a2, wherein a1<a2. The first Ni alloy layer is between the Cu layer and the second Ni alloy layer. The structure further includes a tin (Sn) layer. The second Ni alloy layer is between the first Ni alloy layer and the Sn layer.Type: ApplicationFiled: February 15, 2022Publication date: June 2, 2022Inventors: Nazila DADVAND, Christopher Daniel MANACK, Salvatore Frank PAVONE
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Publication number: 20220157698Abstract: A semiconductor package includes an IC having circuitry configured for at least one function with some nodes connected to bond pads, with first metal posts on the bond pads, and dome support metal posts configured in a ring having a top rim defining an inner cavity with solder on the top rim and extending over an area of the inner cavity for providing a solder dome that covers the inner cavity to provide a covered air cavity over a portion of the circuitry. A leadframe includes a plurality of leads or lead terminals. The IC is flipchip attached with a solder connection to the leadframe so that the first metal posts are attached to the leads or the lead terminals. A mold compound provides encapsulation for the semiconductor package except on at least a bottom side of the leads or lead terminals.Type: ApplicationFiled: November 16, 2020Publication date: May 19, 2022Inventors: Christopher Daniel Manack, Jonathan Andrew Montoya, Jovenic Romero Esquejo, Salvatore Frank Pavone
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Patent number: 11127515Abstract: A nanostructure barrier for copper wire bonding includes metal grains and inter-grain metal between the metal grains. The nanostructure barrier includes a first metal selected from nickel or cobalt, and a second metal selected from tungsten or molybdenum. A concentration of the second metal is higher in the inter-grain metal than in the metal grains. The nanostructure barrier may be on a copper core wire to provide a coated bond wire. The nanostructure barrier may be on a bond pad to form a coated bond pad. A method of plating the nanostructure barrier using reverse pulse plating is disclosed. A wire bonding method using the coated bond wire is disclosed.Type: GrantFiled: April 21, 2020Date of Patent: September 21, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Nazila Dadvand, Christopher Daniel Manack, Salvatore Frank Pavone
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Publication number: 20210280547Abstract: A microelectronic device has bump bond structures on input/output (I/O) pads. The bump bond structures include copper-containing pillars, a barrier layer including cobalt and zinc on the copper-containing pillars, and tin-containing solder on the barrier layer. The barrier layer includes 0.1 weight percent to 50 weight percent cobalt and an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick. A lead frame has a copper-containing member with a similar barrier layer in an area for a solder joint. Methods of forming the microelectronic device are disclosed.Type: ApplicationFiled: May 18, 2021Publication date: September 9, 2021Inventors: Nazila Dadvand, Christopher Daniel Manack, Salvatore Frank Pavone