Abstract: The cleaning of silicon carbide materials on a large-scale is described. Certain silicon carbide materials in the form of wafer-lift pins, wafer-rings and/or wafer-showerheads are cleaned by using a combination of two of more of the following steps, comprising: high temperature oxidation, scrubbing, ultrasonic assisted etching in an aqueous acid solution, ultrasonication in deionized water, immersion in an aqueous acid solution, and high temperature baking. The silicon carbide materials may either be sintered or formed by chemical vapor deposition.

Abstract: A method is provided for recovering a metal from electronic device deposition equipment including: providing deposition equipment wherein the deposition equipment is at least partially coated with a deposited metal; blasting the deposition equipment with a grit to remove at least some of the deposited metal to form a blasted grit and a removed metal; and separating at least some of the removed metal from the blasted grit to form a recovered metal.

Abstract: In one aspect, a method of cleaning an electronic device manufacturing process chamber part is provided, including a) spraying the part with an acid; b) spraying the part with DI water; and c) treating the part with potassium hydroxide. Other aspects are provided.

Abstract: A method for treating a surface of a quartz substrate includes preparing a substrate to provide a working surface having an initial roughness; and then ultrasonically acid-etching the working surface to increase the roughness of the working surface by at least about 10%. In one embodiment, the initial surface roughness is greater than about 10 Ra, and in another embodiment the initial surface roughness is greater than about 200 Ra. In a still further embodiment, the initial surface area, if less than about 200 Ra, is increased to greater than about 200 Ra. In other embodiments of the present invention, the working surface roughness is increased by at least about 25% or at least about 50%. Simultaneous with the increase in surface area (as measured by the roughness), the surface defects are reduced to reduce particulate contamination from the substrate.

Abstract: In a first aspect, a method for cleaning a semiconductor fabrication chamber component having an orifice is provided. The method includes (A) placing the component into a bath having a cleaning solution; (B) flowing a fluid into the orifice thereby maintaining at least a first portion of the orifice free from cleaning solution while the cleaning solution cleans the component; and (C) withdrawing the fluid from the orifice such that cleaning solution enters into the first portion of the orifice and cleans the first portion of the orifice. Numerous other aspects are also provided.

Abstract: A method for treating a surface of a quartz substrate includes preparing a substrate to provide a working surface having an initial roughness; and then ultrasonically acid-etching the working surface to increase the roughness of the working surface by at least about 10%. In one embodiment, the initial surface roughness is greater than about 10 Ra, and in another embodiment the initial surface roughness is greater than about 200 Ra. In a still further embodiment, the initial surface area, if less than about 200 Ra, is increased to greater than about 200 Ra. In other embodiments of the present invention, the working surface roughness is increased by at least about 25% or at least about 50%. Simultaneous with the increase in surface area (as measured by the roughness), the surface defects are reduced to reduce particulate contamination from the substrate.

Abstract: A low contamination bottle for sampling, storing, and transporting of chemical samples includes a bottle portion defining an internal volume and having a threaded neck, and a cap portion provided with threads that engage the threaded neck of the bottle to provide a fluid-tight seal between the internal volume of the bottle and the ambient environment. The bottle has a flexible sidewall portion that permits the reduction of the internal volume to allow a liquid sample to be drawn into the bottle portion by a suction or vacuum process. Both the bottle portion and the cap portion are made from a material selected from the chemical resistant group consisting essentially of hydrocarbon polymers and fluorocarbon polymers, where the material generates less then 1 ppb of metal contaminants and 1 ppm of leachable anionic and organic contaminants. The flexible sidewall portion of the bottle portion has a minimum thickness of 0.

Abstract: A low contamination bottle for sampling, storing, and transporting of chemical samples includes a bottle portion defining an internal volume and having a threaded neck, and a cap portion provided with threads that engage the threaded neck of the bottle to provide a fluid-tight seal between the internal volume of the bottle and the ambient environment. The bottle has a flexible sidewall portion that permits the reduction of the internal volume to allow a liquid sample to be drawn into the bottle portion by a suction or vacuum process. Both the bottle portion and the cap portion are made from a material selected from the chemical resistant group consisting essentially of hydrocarbon polymers and fluorocarbon polymers, where the material generates less then 1 ppb of metal contaminants and 1 ppm of leachable anionic and organic contaminants. The flexible sidewall portion of the bottle portion has a minimum thickness of 0.

Abstract: An apparatus is set forth for removing a sample of a liquid for chemical analysis from a vessel containing the liquid and for delivering the sample into a sample bottle. The apparatus comprises a hollow member defining an enclosed plenum. A sample bottle attachment structure defines a passage communicating with the plenum and being adapted for attachment to a top portion of the sample bottle. A first partition structure blocks off the passage other than where it communicates with the plenum. A longitudinally extending sample transport tube extends through the passage and into the bottle. The transport tube passes through the first partition in substantially air-tight relation to it. The other end of the transport tube is positionable in the liquid being sampled.

Abstract: An apparatus and method are set forth for removing a sample of a liquid for chemical analysis from a vessel containing the liquid and for delivering the sample into a sample bottle. The apparatus comprises a hollow member defining an enclosed plenum. A sample bottle attachment structure defines a passage communicating with the plenum and being adapted for attachment to a top portion of the sample bottle. A longitudinally extending sample transport tube extends through the passage and into the bottle. The transport tube passes through the hollow member in substantially air-tight relation to it. The other end of the transport tube is positionable in the liquid being sampled. The method comprises positioning one end of a tube in a sample bottle and the other end in the liquid. A hand operated pump manually creates a partial vacuum in the bottle to draw the sample.