Abstract: An apparatus includes a package and a chip. The package may comprise (i) a plurality of bonding pads, (ii) a plurality of combiner/splitter circuits, and (iii) a plurality of bumps. The bonding pads may be configured to electrically connect the package with a printed circuit board substrate. The combiner/splitter circuits generally connect each of the bonding pads to two respective bumps of the plurality of bumps. The chip is generally disposed in the package. The chip may comprise a plurality of contact pads and a plurality of transceiver channels. Each of the transceiver channels may comprise a radio-frequency input and a radio-frequency output. The radio-frequency input and the radio-frequency output of each transceiver channel are generally connected to respective contact pads of the chip. The respective contact pads of each transceiver channel are generally coupled to a respective bonding pad of the package via the two respective bumps.

Abstract: An apparatus includes a plurality of impedance matching networks, a common port, a first switch circuit and a second switch circuit. The impedance matching networks may be (i) connected in series between an input port and an output port and (ii) configured to generate a power detection signal in response to a radio-frequency signal. The radio-frequency signal may be a transmit signal or a receive signal. The common port may be (i) connected to the impedance matching networks and (ii) connectable to an antenna. The first switch circuit may be configured to switch the input port and a circuit ground potential. The second switch circuit may be configured to switch the output port and the circuit ground potential.

Abstract: An apparatus includes a package and a chip. The package may comprise (i) a plurality of bonding pads, (ii) a plurality of combiner/splitter circuits, and (iii) a plurality of bumps. The bonding pads may be configured to electrically connect the package with a printed circuit board substrate. The combiner/splitter circuits generally connect each of the bonding pads to two respective bumps of the plurality of bumps. The chip is generally disposed in the package. The chip may comprise a plurality of contact pads and a plurality of transceiver channels. Each of the transceiver channels may comprise a radio-frequency input and a radio-frequency output. The radio-frequency input and the radio-frequency output of each transceiver channel are generally connected to respective contact pads of the chip. The respective contact pads of each transceiver channel are generally coupled to a respective bonding pad of the package via the two respective bumps.

Abstract: An apparatus includes a switching circuit and a plurality of registers. The switching circuit may be configured to generate a sequence of pulses in a plurality of control signals in response to a plurality of cycles of an enable signal. The registers may be hardwired as a plurality of subsets. Each of the subsets of the registers may be configured to (a) buffer a plurality of setting values received from a memory and (b) present the setting values from the registers to a plurality of transceiver circuits while a corresponding one of the control signals is in an active state. The transceiver circuits may be updated with the setting values from the registers within a predetermined time.

Abstract: An apparatus includes a plurality of transceiver circuits and a plurality of feedback networks. Each of the plurality of transceiver circuits may be coupled to a respective antenna element in a respective group of antenna elements of a phased array antenna. Each of the transceiver circuits generally comprises a power amplifier circuit configured, when operating in a transmit mode, to drive the respective antenna element in the respective group of antenna elements. Each of the plurality of feedback networks may be coupled between an output and an input of a respective power amplifier circuit of a respective transceiver circuit. Each of the feedback networks generally comprises a resistor and a capacitor connected in series. The respective power amplifier circuit with the feedback network generally maintains a power matching condition with load variation associated with the antenna elements of the phased array antenna.

Abstract: An apparatus include a package, a chip and a plurality of bumps. The package may include (i) a plurality of bonding pads configured to exchange a plurality of radio-frequency signals with an antenna panel and (ii) a plurality of transmission lines configured to exchange the radio-frequency signals with the bonding pads. Two of the transmission lines may be connected to each of the bonding pads. The chip may be disposed in the package and may include (i) a plurality of transceiver channels configured to exchange the radio-frequency signals with the transmission lines and (ii) a plurality of switches configured to switch the radio-frequency signals to a signal ground. The bumps may be configured to exchange the radio-frequency signals between the transmission lines of the package and the transceiver channels of the chip. The transmission lines, the bumps and the switches may form a plurality of transmit/receive switches.

Abstract: An apparatus includes an impedance matching network, a first switch circuit, and a second switch circuit. The impedance matching network generally comprises a first port, a second port, and a third port. The first switch circuit may be coupled between the first port and a circuit ground potential. The second switch circuit may be coupled between the second port and the circuit ground potential. The impedance matching network generally provides a first impedance value for the first port and for the third port when the second port is connected to the circuit ground potential. The impedance matching network generally provides a second impedance value for the second port and for the third port when the first port is connected to the circuit ground potential. The first impedance value and the second impedance value are asymmetrical.

Abstract: An apparatus includes a phased array antenna panel and one or more beam former circuits mounted on the phased antenna array panel. The phased array antenna panel generally comprises a plurality of antenna elements arranged in one or more groups. Each of the one or more beam former circuits may be coupled to a respective group of the antenna elements. Each of the one or more beam former circuits may comprise a plurality of transceiver channels. Each transceiver channel generally comprises a power amplifier circuit configured, when operating in a transmit mode, to drive a respective one of the antenna elements. The power amplifier generally comprises a feedback network coupled between an output and an input of the power amplifier circuit.

Abstract: An apparatus includes a phased array antenna panel and one or more dual-polarization beam former circuits mounted on the phased array antenna panel. The phased array antenna panel generally comprises a plurality of dual-polarization antenna elements. The plurality of dual-polarization antenna elements are generally arranged in one or more groups. Each dual-polarization beam former circuit may be coupled to a respective group of the dual-polarization antenna elements. Each dual-polarization beam former circuit generally comprises a plurality of transceiver channels. Each transceiver channel generally comprises a horizontal channel and a vertical channel. Each dual-polarization beam former circuit provides polarization rotation through bias current control in each of the vertical and horizontal channels.

Abstract: An apparatus includes a plurality of conductive layers and a plurality of traces configured to carry a plurality of signals through a change of direction. The traces may be routed parallel to each other in a first trace segment in a first of the conductive layers toward the change of direction. The traces may be routed parallel to each other in a second trace segment in a second of the conductive layers in the change of direction. One of the traces in a third trace segment in the first conductive layer may cross over another of the traces in the second trace segment in the second conductive layer in the change of direction. The traces may be routed parallel to each other in the third trace segment in the first conductive layer away from the change of direction.

Abstract: An apparatus includes a package and a beam former circuit. The package may be configured to be mounted on an antenna array at a center of four antenna elements. Each antenna element may include a dual-pole antenna having a vertical feed and a horizontal feed. The beam former circuit may be (i) disposed in the package, (ii) have a plurality of pairs of ports, (iii) configured to generate a plurality of radio-frequency signals in the ports while in a transmit mode and (iv) configured to receive the radio-frequency signals at the ports while in a receive mode. Each pair of the ports is configured to be directly connected to a respective one of the antenna elements. All of the ports may be spatially routed into alignment with the vertical feeds and the horizontal feeds in a single conductive plane of the antenna array.

Abstract: An apparatus includes a phased array antenna panel and one or more beam former circuits. The phased array antenna panel generally comprises a plurality of antenna elements. The plurality of antenna elements are generally arranged in one or more groups. The one or more beam former circuits may be mounted on the phased array antenna panel. Each beam former circuit is generally coupled to a respective group of the antenna elements. Each beam former circuit generally comprises a plurality of transceiver channels comprising a transmit channel and a receive channel. The phased array antenna panel is generally configured to distribute a control signal to each of the beam former circuits. Each of the transceiver channels is generally configured to switch between a transmit mode and a receive mode in response to the control signal.

Abstract: An apparatus includes a phased array antenna panel and a plurality of beam former circuits. The phased array antenna panel generally comprises a plurality of antenna elements. The plurality of beam former circuits are each mounted on the phased array antenna panel adjacent to a number of the antenna elements. Each beam former circuit has one or more ports directly coupled to each of the adjacent antenna elements. Each beam former circuit may be configured to generate a plurality of radio-frequency output signals at the ports while in a transmit mode and receive a plurality of radio-frequency input signals at the ports while in a receive mode. Each beam former circuit generally implements a hard-wired address.

Abstract: An apparatus includes a switching circuit and a plurality of registers. The switching circuit may be configured to generate a sequence of pulses in a plurality of control signals in response to a plurality of cycles of an enable signal. The registers may be hardwired as a plurality of subsets. Each of the subsets of the registers may be configured to (a) buffer a plurality of setting values received from a memory and (b) present the setting values from the registers to a plurality of transceiver circuits while a corresponding one of the control signals is in an active state. The transceiver circuits may be updated with the setting values from the registers within a predetermined time.

Abstract: An apparatus include a package and a beam former circuit. The package may be configured to be mounted on an antenna array at a center of four antenna elements. The beam former circuit may (i) be disposed in the package, (ii) have a plurality of ports, (iii) be configured to generate a plurality of radio-frequency signals in the ports while in a transmit mode and (iv) be configured to receive the radio-frequency signals at the ports while in a receive mode. A plurality of ground bumps may be disposed between the beam former circuit and the package. The ground bumps may be positioned to bracket each port. Each ground bump may be electrically connected to a signal ground to create a radio-frequency shielding between neighboring ports.

Abstract: An apparatus includes a phased array antenna panel and one or more beam former circuits mounted on the phased antenna array panel. The phased array antenna panel generally comprises a plurality of antenna elements arranged in one or more groups. Each of the one or more beam former circuits may be coupled to a respective group of the antenna elements. Each of the one or more beam former circuits may comprise a plurality of transceiver channels. Each transceiver channel generally comprises a power amplifier circuit configured, when operating in a transmit mode, to drive a respective one of the antenna elements. The power amplifier generally comprises a feedback network coupled between an output and an input of the power amplifier circuit.

Abstract: An apparatus includes a phased array antenna panel and one or more beam former circuits mounted on the phased array antenna panel. The phased array antenna panel generally comprises a plurality of antenna elements. The plurality of antenna elements are generally arranged in one or more groups. Each beam former circuit may be coupled to a respective group of the antenna elements. Each beam former circuit generally comprises a plurality of transceiver channels. Each transceiver channel generally comprises a power amplifier circuit configured, when operating in a transmit mode, to drive a respective one of the antenna elements. The power amplifier circuit generally comprises separate bias and voltage supply inputs providing additional power control.

Abstract: An apparatus includes an impedance matching network, a first switch circuit, and a second switch circuit. The impedance matching network generally comprises a first port, a second port, and a third port. The first switch circuit may be coupled between the first port and a circuit ground potential. The second switch circuit may be coupled between the second port and the circuit ground potential. The impedance matching network generally provides a first impedance value for the first port and for the third port when the second port is connected to the circuit ground potential. The impedance matching network generally provides a second impedance value for the second port and for the third port when the first port is connected to the circuit ground potential. The first impedance value and the second impedance value are asymmetrical.

Abstract: An apparatus include a package, a chip and a plurality of bumps. The package may include (i) a plurality of bonding pads configured to exchange a plurality of radio-frequency signals with an antenna panel and (ii) a plurality of transmission lines configured to exchange the radio-frequency signals with the bonding pads. Two of the transmission lines may be connected to each of the bonding pads. The chip may be disposed in the package and may include (i) a plurality of transceiver channels configured to exchange the radio-frequency signals with the transmission lines and (ii) a plurality of switches configured to switch the radio-frequency signals to a signal ground. The bumps may be configured to exchange the radio-frequency signals between the transmission lines of the package and the transceiver channels of the chip. The transmission lines, the bumps and the switches may form a plurality of transmit/receive switches.

Abstract: An apparatus includes a first circuit and a plurality of second circuits. The first circuit may be configured to generate a pair of quadrature signals from a radio-frequency signal. The second circuits may each comprise a plurality of cascode amplifiers. The cascode amplifiers may be connected in parallel. The cascode amplifiers may be configured to generate a plurality of intermediate signals by modulating the quadrature signals in response to a first control signal and a second control signal. The first control signal generally switches a contribution of the cascode amplifiers in the generation of the intermediate signal. The second control signal may adjusts a total current passing through all of the cascode amplifiers.