Abstract: A cutting blade (56) having a cutting edge (80) defined by an intersection of a first cutting edge surface (72) and a second cutting edge surface (66) is disclosed. The angle between the first cutting edge surface (72) and the second cutting edge surface (66) defines a blade angle (?). The blade (56) may be fabricated from a wafer (130) by an anisotropic etch. An upper surface (134) of the wafer (130) is defined by a first set of 3 Miller indices, where at least one individual Miller index of this first set has an absolute value greater than 3. A top surface (60) of the blade (56) is defined by part of the upper surface (134) of the wafer (130). The anisotropic etch proceeds until reaching a particular crystallographic plane to define the first cutting edge surface (72). Having the top surface (60) of the blade (56) defined by the noted set of 3 Miller indices increases the potential that a blade angle (?) of a desired magnitude may be realized.

Abstract: A microelectromechanical system is disclosed that constrains the direction of a force acting on a first load, where the force originates from the interaction of the first load and a second load. In particular, the direction of a force acting on the first load is caused to be substantially parallel with a motion of the first load. This force direction constraint is achieved by a force isolator microstructure that contains no rubbing or contacting surfaces. Various embodiments of structures/methods to achieve this force direction constraint using a force isolator microstructure are disclosed.

Abstract: Multiple cutting blades (56) are fabricated from a wafer (130). This wafer (130) is disposed on a blade handle mounting fixture (224) such that a blade handle (24) maybe mounted on each of the individual blades (56). A cutting edge (80) of each blade (56) is maintained in spaced relation to the fixture (224) as these blade handles (24) are being mounted. Thereafter, the wafer (130) is transferred to a blade separation fixture (300). Each blade 56 is suspended above the fixture (300). An appropriate force is transmitted to the individual blades (56) to separate the same from the wafer (130). Separation preferably occurs before the blade (56) contacts the fixture (300). Thereafter, the blade (56) in effect pivots into an inclined position where its cutting edge (80) projects at least generally upwardly. Preferably, at no time does the cutting edge (80) of any blade (56) contact either the blade handle mounting fixture (224) or the blade separation fixture (300).

Abstract: The present invention is directed to off axis optical signal redirection architectures that employ positionable reflective microstructures (e.g. microelectromechanical (MEM) mirrors) fabricated on one or more substrates. In one embodiment, an optical signal redirection system (10) includes a reflective microstructure array (12) formed on a substrate (30). The reflective microstructure array (12) includes one or more reflective microstructures (14). Each of the reflective microstructures (14) includes an optically reflective surface (20) and is positionable with respect to the substrate (30) in order to orient its reflective surface (20) for redirecting optical signals (24) incoming from one or more originating locations (16) to one or more target locations (18).

Abstract: Self-shadowed microelectromechanical structures such as self-shadowed bond pads, fuses and compliant members and a method of fabricating self-shadowing microelectromechanical structures that anticipate and accommodate blanket metalization process steps are disclosed. In one embodiment, a self-shadowed bond pad (10) configured for shadowing an exposed end (44A) of a shielded interconnect line (44) connected to the bond pad (10) from undesired metalization during a metalization fabrication process step includes electrically connected overlaying first, second and third bond pad areas (42, 72, 92) patterned from respective first, second and third layers (40, 70, 90) of material deposited on a substrate (20). The exposed end (44A) of the interconnect line (44) abuts an edge of the first bond pad area (42).

Abstract: A chip having a microelectromechanical system fabricated thereon is disclosed that has both perimeter off-chip electrical contacts, as well as interior off-chip electrical contacts. The interior off-chip electrical contacts are not used for directing an off-chip signal onto the chip, or for reading out an on-chip a signal to an off-chip location. Instead, these interior off-chip electrical contacts are the result of an efficient way of designing the layout of die on a wafer from which the chip may be diced.

Abstract: A microelectromechanical system is disclosed that uses a stiff tether between an actuator assembly and a lever that is interconnected with an appropriate substrate such that a first end of the lever may move relative to the substrate, depending upon the direction of motion of the actuator assembly. Any appropriate load may be interconnected with the lever, including a mirror for any optical application.

Abstract: The present invention provides a MEM system (10) having a platform (14) that is both elevatable from the substrate (12) on which it is fabricated and tiltable with one, two or more degrees of freedom with respect to the substrate (12). In one embodiment, the MEM system (10) includes the platform (14), a pair of A-frame structures (40), and two pairs of actuators (30) formed on the substrate (12). Ends (46A) of rigid members (46) extending from apexes (40A) of the A-frame structures (40) are attached to the platform (14) by compliant members (48A, 48B). The platform (14) is also attached to the substrate (12) by a compliant member (48C). The A-frame structures (40) are separately pivotable about bases (40B) thereof. Each pair of actuators (30) is coupled through a yoke (32) and displacement multiplier (34) to one of the A-frame structures (40) and is separately operable to effect pivoting of the A-frame structures (40) with respect to the substrate (12) by equal or unequal angular amounts.

Abstract: A microelectromechanical system is disclosed that provides amplified movement without requiring the use of a displacement multiplier. Generally, a lever or the like is interconnected with a substrate on which the system is fabricated at a first location, while a free end of the lever is able to move relative to the substrate, typically at least generally about the first location. One or more actuators are movably interconnected with the substrate, and in turn are interconnected with the lever at a location that is somewhere between the free end and the first location. The lever may be configured to move at least generally away from the substrate upon movement of the actuator in one direction, at least generally toward the substrate upon movement of the actuator in another direction, or in any direction and in any manner. The movement of the “free” end of the lever may be used to perform any function, including lifting/pivoting a mirror away from/relative to the substrate.

Abstract: A multi-level shielded multi-conductor interconnect bus for use in interconnecting MEM devices with control signal sources and a method of fabricating a multi-level shielded multi-conductor interconnect bus are disclosed. In one embodiment, a multi-level shielded interconnect bus (410A) formed on a substrate (20) includes first and second level electrically conductive lines (42, 92) arranged in sets of one, two or more conductive lines between first and second level electrically conductive shield walls (46, 66, 96). The first and second level electrically conductive lines (42, 92) are surrounded by various layers of dielectric material (30, 50, 80, 100). A first level electrically conductive shield (78) overlies the first level electrically conductive lines (42) and shield walls (46, 66). A second level electrically conductive shield (112) overlies the second level electrically conductive lines (92) and shield walls (96).

Abstract: A microelectromechanical system is disclosed that uses a stiff tether between an actuator assembly and a lever that is interconnected with an appropriate substrate such that a first end of the lever may move relative to the substrate, depending upon the direction of motion of the actuator assembly. Any appropriate load may be interconnected with the lever, including a mirror for any optical application.

Abstract: The present invention provides a MEM system (10) having a platform (14) that is both elevatable from the substrate (12) on which it is fabricated and tiltable with one, two or more degrees of freedom with respect to the substrate (12). In one embodiment, the MEM system (10) includes the platform (14), a pair of A-frame structures (40), and two pairs of actuators (30) formed on the substrate (12). Ends (46A) of rigid members (46) extending from apexes (40A) of the A-frame structures (40) are attached to the platform (14) by compliant members (48A, 48B). The platform (14) is also attached to the substrate (12) by a compliant member (48C). The A-frame structures (40) are separately pivotable about bases (40B) thereof. Each pair of actuators (30) is coupled through a yoke (32) and displacement multiplier (34) to one of the A-frame structures (40) and is separately operable to effect pivoting of the A-frame structures (40) with respect to the substrate (12) by equal or unequal angular amounts.

Abstract: Self-shadowed microelectromechanical structures such as self-shadowed bond pads, fuses and compliant members and a method of fabricating self-shadowing microelectromechanical structures that anticipate and accommodate blanket metalization process steps are disclosed. In one embodiment, a self-shadowed bond pad (10) configured for shadowing an exposed end (44A) of a shielded interconnect line (44) connected to the bond pad (10) from undesired metalization during a metalization fabrication process step includes electrically connected overlaying first, second and third bond pad areas (42, 72, 92) patterned from respective first, second and third layers (40, 70, 90) of material deposited on a substrate (20). The exposed end (44A) of the interconnect line (44) abuts an edge of the first bond pad area (42).

Abstract: A novel optical channel processing unit is disclosed that is useful for multiplexing, demultiplexing, switching and otherwise processing optical signals in a WDM network. In one embodiment, the optical channel processing unit is implemented as an optical switch (700) for interfacing any of various multichannel input ports (702) with any of various multichannel output ports (704). The illustrated switch (700) includes a two-dimensional array of input ports (702) and a two-dimensional array of output ports (704). An input signal (705) is transmitted via a spectral device (706) to an input movable mirror array (708). A signal transmitted by an output port (704) is transmitted via a spectral device (712) to mirrors (714) of an output mirror movable mirror array (716). Each mirror of each array (708 and 716) is movable to target any selected mirror of the opposing array (708 or 716). The arrays (708 and 716) thereby support full multichannel switching functionality for more than two channels.

Abstract: A novel optical channel processing unit is disclosed that is useful for multiplexing, demultiplexing and switching optical signals in a WDM network. In one embodiment, the optical channel processing unit is implemented as an optical switch (700) for interfacing any of various multichannel input ports (702) with any of various multichannel output ports (704). The illustrated switch (700) includes a two-dimensional array of input ports (702) and a two-dimensional array of output ports (704). An input signal (705) is transmitted via a spectral device (706) to an input movable mirror array (708). A signal transmitted by an output port (704) is transmitted via a spectral device (712) to mirrors (714) of an output mirror movable mirror array (716). Each mirror of each array (708 and 716) is movable to target any selected mirror of the opposing array (708 or 716). The arrays (708 and 716) thereby support full multichannel switching functionality for more than two channels.

Abstract: A blade separation fixture (300) is disclosed. A wafer (130) is positioned on the fixture (300). This wafer (130) includes a plurality of cutting blades (56) that are initially spaced above the fixture (300). Blade handles (24) will typically already have been mounted on each of the various cutting blades (56) at this time. In any case, each of the various cutting blades (56) are separated from the wafer (130) by applying an appropriate downwardly directed force. Separated blades (56) in effect pivot into an inclined position against the fixture (300) without having their corresponding cutting edges (80) contact the fixture (300).

Abstract: A blade handle mounting fixture (224) is disclosed. A wafer (130) is positioned on the fixture (224). This wafer (130) includes a plurality of cutting blades (56). Blade handles (24) may be mounted on each of the various cutting blades (56) while the wafer (130) is positioned on the fixture (224). Thereafter, the wafer (130) may be removed and transferred to a blade separation fixture (300). Here the blades (56), with handles (24) having been previously mounted thereon, are separated from the wafer (130).

Abstract: A cutting head assembly (10′) for a microkeratome (4′) is disclosed. The cutting head assembly (10′) includes a blade (56). This blade (56) has a first major surface (64) and a second major surface (60). A first cutting edge surface (72) extends between the first major surface (64) and the second major surface (60), and defines a cutting edge (80) at its intersection with the first major surface (64). The blade (56) is oriented in the cutting head assembly (10′) such that the first major surface (64) is above the second major surface (60).

Abstract: A method for providing a cutting tool (20) is disclosed. Multiple cutting blades (56) are fabricated from a wafer (130). This wafer (130) is disposed on a blade handle mounting fixture (224) such that a blade handle (24) may be mounted on each of the individual blades (56). A cutting edge (80) of each blade (56) is maintained in spaced relation to the fixture (224) as these blade handles (24) are being mounted. Thereafter, the wafer (130) is transferred to a blade separation fixture (300). Each blade 56 is suspended above the fixture (300). An appropriate force is transmitted to the individual blades (56) to separate the same from the wafer (130). Separation preferably occurs before the blade (56) contacts the fixture (300). Thereafter, the blade (56) in effect pivots into an inclined position where its cutting edge (80) project at least generally upwardly.

Abstract: A cutting tool (20′) for a microkeratome (4) is disclosed. This cutting tool (20′) includes a blade handle (24) and a separate cutting blade (56). The blade handle (24) is mounted on the cutting blade (54) on a surface (64) of the blade (54) that also contains a cutting edge (80). This cutting edge (80) is defined by an intersection of the surface (64) and a first cutting edge surface (72). Cutting edge surface (72) actually extends between the major surfaces (60), (64) of the blade (56), which are oppositely disposed.