Abstract: An apparatus is described. The apparatus includes a semiconductor chip package, a main cooling mass, a heat pipe and a remote cooling mass. The apparatus further includes: a) a channel in one of the main and remote cooling masses into which the heat pipe is inserted, the channel being wide enough to allow movement of the heat pipe within the channel in response to relative movement of the main and remote cooling masses, wherein, the main cooling mass comprises a chamber with liquid, the heat pipe comprises a fluidic channel that is coupled to the chamber and vapor from the liquid is to be condensed within the heat pipe; b) a flexible region integrated into the heat pipe; and/or, c) a flexible connector into which the heat pipe is inserted.

Abstract: An apparatus is described. The apparatus includes a coolant distribution unit having a first primary loop output to provide first cooled immersion liquid to an immersion chamber and a second primary loop output to provide second cooled immersion liquid to one or more cold plates within the immersion chamber.

Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Abstract: Methods, systems, apparatus, and articles of manufacture to monitor heat exchangers and associated reservoirs are disclosed. An example apparatus includes programmable circuitry to detect, based on outputs of a sensor associated with a first reservoir, a coolant level of the first reservoir, the first reservoir removably coupled to a second reservoir, the first reservoir to supply coolant to the second reservoir, predict, based on the coolant level, a characteristic associated with operation of a cooling device fluidly coupled to the second reservoir, and cause an output to be presented at a user device based on the predicted characteristic.

Abstract: An apparatus is described. The apparatus includes a chamber to contain one or more electronic components, a first liquid and a second liquid. The electronics to be immersed in the second liquid. The first liquid having less density than the second liquid so that the first liquid floats above the second liquid. The first liquid to return second liquid molecules received from the second liquid back to the second liquid. The chamber comprising a first fluidic channel to drain the first liquid from the chamber while the second liquid is within the chamber.

Abstract: A method is described. The method includes repeatedly receiving information from one or more sensor circuits that are disposed within a coolant of an immersion cooling system, the one or more sensor circuits to detect one or more contaminants within the coolant. The method includes repeatedly processing the information. The method includes repeatedly keeping the one or more contaminants within acceptable levels within the coolant in response to the information by adjusting a valve setting that affects intake of the coolant to a filtration system of the immersion cooling system, and/or, adjusting a speed of a pump of the filtration system.

Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

Abstract: Example method and apparatus, systems, and articles of manufacture for immersion cooling systems are disclosed herein. An example apparatus disclosed herein includes a tank to hold a coolant, an overflow chamber to direct the coolant toward an outlet, and a plate within the overflow chamber, the plate including a plurality of openings, the coolant to pass through at least one of the plurality of openings before reaching the outlet.

Abstract: An apparatus is described that includes a flow enhancement structure to enhance a flow of immersion bath liquid specifically through space between fins of a heat sink and/or across a base of a heat sink.

Abstract: An integrated circuit device may include an integrated circuit die coupled to a substrate, and a porous material on the die or a thermal interface material and extending beyond the edges of the die and over the substrate. An integrated circuit system may include a substrate with a power supply and an integrated circuit die, such that a porous material on the die extends over the substrate beyond a footprint of the die. A porous material may be formed on and beyond an edge of a received integrated circuit die coupled to a substrate or a thermal interface material on the die.

Abstract: Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a heatsink, a base of the heatsink to be thermally coupled to a semiconductor device, and a rigid plate to be coupled to the semiconductor device and the base of the heatsink, the rigid plate stiffer than the base, the rigid plate distinct from a bolster plate to which the heatsink is to be coupled.

Abstract: Methods, systems, apparatus, and articles of manufacture to crimp a tube are disclosed. An example crimp disclosed herein includes a first crimp section extending between a first end of the crimp and a point along the crimp between the first end and a second end, a first inner diameter of the first crimp section constant between the first end and the point, and a second crimp section adjacent the first crimp section, the second crimp section extending between the point and the second end, a second inner diameter of the second crimp section to increase from the point to the second end.

Abstract: In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.

Abstract: An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.

Abstract: An apparatus is described. The apparatus includes a bolster plate having a first fixturing element and a strap. The strap is positioned along a frame arm of the bolster plate. The strap has a second fixturing element to be fixed to a cooling mass. The strap is to diminish movement of the cooling mass along the frame arm's dimension and a dimension that is orthogonal to the frame arm's dimension. A semiconductor chip package is to be placed in a window opening formed by the bolster plate's frame arms. The cooling mass is to be thermally coupled to the semiconductor chip package.

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package assembly having a spring element to be coupled between a first mechanical element and a second mechanical element to apply a loading force that pulls the first and second mechanical elements toward each other in the assembly's nominal assembled state. The first and second elements to support a cooling mass, the assembly further comprising a dampener that is coupled to at least one of the first and second mechanical elements to reduce oscillation amplitude of the cooling mass.

Abstract: An apparatus is described. The apparatus includes a ball grid array (BGA) chip package cooling assembly includes a back plate and a bolster plate. The bolster plate has frame arms. The BGA chip package is to be placed in a window formed by the frame arms and soldered to a region of a printed circuit board. The frame arms surround the region. The printed circuit board is to be subjected to a compressive force between the back plate and the bolster plate.

Abstract: An apparatus is described. The apparatus includes a ceiling part and a floor part of a thermally conductive component to be placed upon a semiconductor chip package integrated heat spreader to remove heat from at least one semiconductor chip within the semiconductor chip package. Respective inner surfaces of the floor part and the ceiling part are to face one another with space in between such that one or more cavities exist within the thermally conductive component between the respective inner surfaces. The apparatus includes a frame component to be abutted against at least one of the ceiling part and the floor part to impede deformation of at least one of the ceiling part and the floor part when loading forces are applied to a thermal assembly that includes the thermally conductive component and the semiconductor chip package.

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package loading assembly having a heat sink and a first magnetic material, the first magnetic material to be mechanically coupled to a first side of a printed circuit board that is opposite a second side of the printed circuit board where input/outputs (I/Os) of the semiconductor chip package interface with the printed circuit board. The first magnetic material to be positioned between the printed circuit board and a second magnetic material. The first magnetic material is to be magnetically attracted to the second magnetic material to impede movement of the heat sink.

Abstract: Techniques for liquid cooling systems are disclosed. In one embodiment, a hermetically sealed container includes an integrated circuit component and a two-phase coolant. As the integrated circuit component generates heat, the coolant boils, rising to a lid of the container. A cold plate mated with the lid absorbs heat from the lid, causing condensation of the coolant on the underside of the lid. The coolant then drips back down towards the integrated circuit component. Other embodiments are disclosed.