Patents by Inventor Sandeep Kumar

Sandeep Kumar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9708618
    Abstract: Provided are constructs and methods for expressing a transgene in plant cells and/or plant tissues using the regulatory elements, including the promoters and/or 3?-UTRs, isolated from Brachypodium distachyon ubiquitin genes.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: July 18, 2017
    Assignee: Dow AgroSciences LLC
    Inventors: Sandeep Kumar, Jeffrey Beringer
  • Patent number: 9700530
    Abstract: This disclosure provides an extended-release capsule dosage form of metoprolol succinate in the form of coated discrete units, wherein said capsule dosage form is bioequivalent to the marketed Toprol-XL® tablet. The extended-release capsule dosage form comprising coated discrete units can be sprinkled onto food to ease administration to patients who have difficulty swallowing tablets or capsules.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: July 11, 2017
    Assignee: SUN PHARMACEUTICAL INDUSTRIES LIMITED
    Inventors: Sandeep Kumar Vats, Balaram Mondal, Kalaiselvan Ramaraju, Romi Barat Singh
  • Patent number: 9704766
    Abstract: An interposer of a package system includes a first probe pad disposed adjacent to a first surface of the interposer. A second probe pad is disposed adjacent to the first surface of the interposer. A first bump of a first dimension is disposed adjacent to the first surface of the interposer. The first bump is electrically coupled with the first probe pad. A second bump of the first dimension is disposed adjacent to the first surface of the interposer. The second bump is electrically coupled with the second probe pad. The second bump is electrically coupled with the first bump through a redistribution layer (RDL) of the interposer.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: July 11, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Sandeep Kumar Goel, Mill-Jer Wang, Chung-Sheng Yuan, Tom Chen, Chao-Yang Yeh, Chin-Chou Liu, Yun-Han Lee
  • Publication number: 20170189351
    Abstract: This disclosure provides an extended-release capsule dosage form of metoprolol succinate in the form of coated discrete units, wherein said capsule dosage form is bioequivalent to the marketed Toprol-XL® tablet. The extended-release capsule dosage form comprising coated discrete units can be sprinkled onto food to ease administration to patients who have difficulty swallowing tablets or capsules.
    Type: Application
    Filed: March 22, 2017
    Publication date: July 6, 2017
    Inventors: Sandeep Kumar VATS, Balaram MONDAL, Kalaiselvan RAMARAJU, Romi Barat SINGH
  • Publication number: 20170195437
    Abstract: An apparatus and method for tracking content are provided. The apparatus is an electronic device that includes a communication circuit and a processor electrically connected to the communication circuit. The processor may be configured to receive information about a tracking target item from an external electronic device, to receive content from a content provider, determine a degree of semantic similarity between the tracking target item and the content, generate at least one update related to the tracking target item, based on the degree of semantic similarity, and send the at least one update to the external electronic device.
    Type: Application
    Filed: June 15, 2016
    Publication date: July 6, 2017
    Inventors: Balaji Nerella VENKATARAMANA, Chandan PRAMANIK, Sandeep Kumar SONI, Sailesh Kumar SATHISH
  • Patent number: 9688996
    Abstract: Provided are methods, vectors and gene constructs for enhancing expression of a recombinant nucleic acid sequence in transgenic plants and plant tissues. According to the present invention, nucleic acid sequences are obtained and/or derived from the 3? untranslated regions of genes encoding ubiquitin proteins and engineered to flank respective portions of a selected coding region of a vector. The vector construct may be introduced into plants and/or plant tissues through conventional or gene targeting procedures, resulting in enhanced expression of the selected coding region. In some embodiments, the selected coding region is a chimeric gene or gene fragment expressing one or more proteins known to impart a level of insecticidal activity to a transgenic plant and/or plant tissue.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: June 27, 2017
    Assignee: Dow AgroSciences LLC
    Inventors: Sandeep Kumar, Manju Gupta, Diaa Alabed
  • Patent number: 9686852
    Abstract: An embodiment is method comprising attaching a first die and a second die to a first surface of a first interposer using respective ones of first conductive connectors coupled to respective first surfaces of the first die and the second die; attaching a third die and a fourth die to a second surface of the first interposer using respective ones of second conductive connectors, the second surface of the first interposer being opposite the first surface of the interposer; and attaching the first die and the second die to a substrate using respective ones of third conductive connectors coupled to respective second surfaces of the first die and the second die.
    Type: Grant
    Filed: April 7, 2015
    Date of Patent: June 20, 2017
    Assignee: Taiwan Semicondcutor Manufacturing Company, Ltd.
    Inventors: Mark Semmelmeyer, Sandeep Kumar Goel
  • Publication number: 20170161420
    Abstract: A partition method includes sorting the plurality of components into a plurality of partitions according to a set of partition criteria and sorting the plurality of components of each partition into a first stack and a second stack according to a set of stack criteria, and the first stack includes a plurality of higher pitch metal layers and the second stack includes a plurality of lower pitch metal layers. The partition criteria include size, power and speed of the component, and the stack criteria include a pitch of a metal layer.
    Type: Application
    Filed: December 8, 2015
    Publication date: June 8, 2017
    Inventors: Yung-Chin HOU, Sandeep Kumar GOEL, Yun-Han LEE
  • Patent number: 9670414
    Abstract: The presently disclosed subject matter is directed to a method of processing plant oil to produce high grade fuel such as biodiesel and jet fuel. Particularly, a method is provided that includes treating an oil under hydrothermal conditions in the presence of i) an acid that acts as an in situ source of hydrogen and ii) an activated carbon essentially free of a metal catalyst, wherein the treating results in production of liquid hydrocarbons for use as a fuel.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: June 6, 2017
    Assignee: Tyton Biosciences, LLC
    Inventors: Iulian Bobe, Sandeep Kumar, Florin Barla
  • Patent number: 9664271
    Abstract: A differential includes a differential case; a side gear; a pinion configured for meshing engagement with the side gear; and a pinion housing configured to support the pinion. The pinion housing includes a first face; a second face opposing the first face; a first projection located on the first face; and a second projection located on the second face. The pinion housing also includes an aperture or hole extending radially inwardly from an outer radial surface of the generally annular ring; and a channel extending from the first face to the second face, wherein the channel is substantially radially aligned with the aperture or hole. In embodiments, the pinion housing includes one or more transfer formations configured to transfer torque from the differential case, and the pinion housing is configured to permit movement in an axial direction between a pair of side gears.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: May 30, 2017
    Assignee: Eaton Corporation
    Inventors: Paul N. Herrmann, Steven J. Cochren, Sandeep Kumar, Steven A. Rudko, Stephen P. Radzevich, Matthew G. Fox, Daniel Philip Fisher
  • Publication number: 20170137834
    Abstract: Provided are constructs and methods for expressing a transgene in plant cells and/or plant tissues using Zea mays GRMZM2G015295 gene regulatory elements.
    Type: Application
    Filed: October 21, 2016
    Publication date: May 18, 2017
    Applicant: Dow AgroSciences LLC
    Inventors: Manju Gupta, Sandeep Kumar, Navin Elango, Jeffrey Beringer, Shavell Gorman, Andrew F. Worden, Sara Bennett, Daren Hemingway, Wei Chen, Huixia Wu, Ning Zhou, Michelle Sprint Smith
  • Patent number: 9650640
    Abstract: Provided are constructs and methods for expressing a transgene in plant cells and/or plant tissues using the regulatory elements, including the promoters and/or 3?-UTRs, isolated from Panicum virgatum ubiquitin genes.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: May 16, 2017
    Assignee: Dow AgroSciences LLC
    Inventors: Sandeep Kumar, Andrew F. Worden
  • Patent number: 9651621
    Abstract: A method of detecting one or more faults in a semiconductor device that includes generating one or more secondary node lists from a primary node list. The primary node list includes one or more nodes. Each node of the one or more nodes of the primary node list is associated with a corresponding secondary node list of the one or more secondary node lists. The method also includes generating a test pattern set from the secondary node list and a fault list. The fault list identifies one or more faults.
    Type: Grant
    Filed: July 10, 2014
    Date of Patent: May 16, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventor: Sandeep Kumar Goel
  • Patent number: 9647028
    Abstract: A method of forming a wafer on wafer (WOW) stack includes forming a predetermined array of connecting elements on a surface of a first wafer, the first wafer including dies of a first type. The dies of the first type have a first functionality. The method further includes bonding a second wafer to the first wafer using the predetermined array of connecting elements, the second wafer including dies of a second type. The dies of the second type have a separate functionality different from the first functionality. Bonding the second wafer to the first wafer comprises bonding an integer number of dies of the second type to a corresponding die of the first type. A total area of the dies of the second type bonded to the corresponding die of the first type is less than or equal to an area of the corresponding die of the first type.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: May 9, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Sandeep Kumar Goel, Yun-Han Lee
  • Patent number: 9646128
    Abstract: A system comprises a processor-implemented tool configured to generate a layout of an integrated circuit (IC) die. At least one non-transitory machine readable storage medium includes a first portion encoded with a first gate-level description of first and second circuit patterns to be formed on first and second integrated circuit (IC) dies, respectively, and a second portion encoded with a second gate level description of the first and second circuit patterns received from the processor implemented tool. The second gate level description includes power and ground ports, and the first gate level description does not include power and ground ports. A processor-implemented first verification module is provided for comparing the first and second gate level descriptions and outputting a verified second gate-level description of the first and second circuit patterns.
    Type: Grant
    Filed: May 6, 2015
    Date of Patent: May 9, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ashok Mehta, Stanley John, Kai-Yuan Ting, Sandeep Kumar Goel, Chao-Yang Yeh
  • Patent number: 9633147
    Abstract: In some embodiments, in a method performed by at least one processor for estimating an overall power state coverage of an electronic system level (ESL) model comprising a plurality of blocks for a module, a first value and a second value are set for each block of said plurality of blocks. At least one verification case is selected for each block in the ESL model. For each verification case of said at least one verification case: (a) a target coverage value is set, (b) a register transfer level (RTL) simulation is performed, (c) an actual coverage value is received, and (d) the first value or the second value is updated based on whether the actual coverage value is less than the target coverage value or not. A power state coverage is calculated for said each block. The overall power state coverage is calculated for the ESL model comprising said plurality of blocks for said module.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: April 25, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Stanley John, Sandeep Kumar Goel, Tze-Chiang Huang, Yun-Han Lee
  • Patent number: 9625971
    Abstract: Provided is a system that includes a monitoring unit, processing units, and peripheral units. Each of the processing units is linked to the monitoring unit and each of the peripheral units is also linked to the monitoring unit. Each of the processing units is configured to transmit requests to and subsequently receive responses from at least one of the peripheral units through the monitoring unit. The monitoring unit is configured to measure and store delays between the responses and the respective requests.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: April 18, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Yuan Ting, Sandeep Kumar Goel, Ashok Mehta
  • Patent number: 9625523
    Abstract: A test circuitry for testing an interconnection between interconnected dies includes a cell embedded within one of the dies. The cell includes a selection logic module that includes a first multiplexer configured to receive a first control signal and provide a first output test signal, and a second multiplexer configured to receive a second control signal and provide a second output test signal. The cell includes a scannable data storage module coupled to the first multiplexer; and a transition generation module configured to receive a third control signal; wherein the first and second output test signals are generated based on respective states of the first, second, and third control signals, and wherein the test circuitry is configured to use the first and second output test signals to perform at least two of: a DC test on the interconnection, an AC test on the interconnection, and a burn-in-test on the interconnection.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: April 18, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sandeep Kumar Goel, Saman M. I. Adham
  • Publication number: 20170098023
    Abstract: In some embodiments, in a method performed by at least one processor for estimating an overall power state coverage of an electronic system level (ESL) model comprising a plurality of blocks for a module, a first value and a second value are set for each block of said plurality of blocks. At least one verification case is selected for each block in the ESL model. For each verification case of said at least one verification case: (a) a target coverage value is set, (b) a register transfer level (RTL) simulation is performed, (c) an actual coverage value is received, and (d) the first value or the second value is updated based on whether the actual coverage value is less than the target coverage value or not. A power state coverage is calculated for said each block. The overall power state coverage is calculated for the ESL model comprising said plurality of blocks for said module.
    Type: Application
    Filed: October 5, 2015
    Publication date: April 6, 2017
    Inventors: STANLEY JOHN, SANDEEP KUMAR GOEL, TZE-CHIANG HUANG, YUN-HAN LEE
  • Patent number: 9612277
    Abstract: A system and method is disclosed for functional verification of multi-die 3D ICs. The system and method include a reusable verification environment for testing each die in a stack of dies individually without having to simultaneously operate all of the dies in the stack. The system and method includes converting an input/output (“IO”) trace from a die verification test from a first format to a second format to improve performance.
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: April 4, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Stanley John, Ashok Mehta, Sandeep Kumar Goel, Kai-Yuan Ting