Abstract: A laser processing apparatus includes: an electro-optical element; a laser irradiation unit that irradiates the electro-optical element with laser; a pair of electrodes provided on both sides of the electro-optical element so as to sandwich the electro-optical element therebetween; a cushioning material having conductivity provided between the pair of electrodes and the electro-optical element; a shield material that is provided on an incident side of the electro-optical element, in an irradiation direction of the laser intersecting a direction in which a voltage applied by the pair of electrodes is applied, and prevents incidence of the laser onto the cushioning material; and a cooling unit that cools the shield material. The cooling unit includes a cooling block and a pipe connected to the cooling block.

Abstract: An object of the disclosure is to improve processing performance. Another object of the disclosure is to improve a working environment and reduce a failure of a processing apparatus. The processing apparatus includes a processing stage on which a composite material is set, a laser head that emits a laser beam in a predetermined direction to the composite material set on the processing stage, a blow off unit that blows off a shield gas to an irradiation point irradiated with the laser beam by the laser head, and an intake unit that takes in the shield gas blown from the blow off unit. The blow off unit and the intake unit are provided so as to interpose the irradiation point and face each other in a first intersecting direction and cause the shield gas to flow in one direction.

Abstract: An object is to improve the quality of a processed composite material without reducing the processing rate. A processing apparatus includes a laser head configured to irradiate a front face of a composite material with a laser beam and a gas supply unit configured to supply an assist gas to an irradiation point irradiated with the laser beam by the laser head. The gas supply unit has a first-level nozzle configured to eject the assist gas to an area at or near the irradiation point and a second nozzle configured to eject the assist gas to an area at or near the irradiation point and arranged above the first-level nozzle. The angle of the direction in which the first-level nozzle ejects the assist gas relative to the front face differs from the angle of the direction in which the second nozzle ejects the assist gas relative to the front face.

Abstract: A laser processing method includes a first step of irradiating a surface of a composite material with a laser to form a hole processing groove on the composite material by scanning first paths from an outside corresponding to an inner peripheral surface side of a through hole to be formed to an inside corresponding to a center side of the through hole to be formed, the first paths extending across a width direction of the hole processing groove; and a second step of irradiating and penetrating through the hole processing groove with the laser to form the through hole by scanning second paths from the outside to the inside after the first step, the second paths extending across the width direction of the hole processing groove. The laser used at the first step has a smaller heat input amount per unit time than the laser used at the second step.

Abstract: Provided are a machining device (10), a machining unit, and a machining method that irradiate a workpiece (8) with a laser beam to perform cutting or boring machining of the workpiece (8). The invention has a laser output device (12), a guiding optical system (14) that guides a laser beam, and an irradiating head (16) that guides a laser beam and irradiates the workpiece (8) with the laser beam. The irradiating head (16) integrally rotates a first prism (52) and a second prism (54) with a rotation mechanism, thereby rotating a light path of the laser beam around a rotational axis of the rotation mechanism and irradiating the workpiece (8) while rotating the position of irradiation to the workpiece.

Abstract: A laser processing method for cutting a base material, including stacked first and second layers having different thermal expansion coefficients, includes radiating laser light onto a first inter-layer part under prescribed first inter-layer conditions, to cut the first inter-layer part, which extends from a position in the vicinity of a layer boundary inward of the surface of the second layer, through the layer boundary between the second layer and the first layer, to a position in the vicinity of a layer boundary inward of said one surface of the first layer, and radiating the laser light onto a part of the first layer inward from the position in the vicinity of the layer boundary, under first conditions, to cut the first layer, wherein the first inter-layer condition is a condition under which the amount of heat input by the laser light is less than under the first condition.

Abstract: In this laser cutting method and laser cutting device with which a base material is cut by irradiating, with laser, a surface of a base material formed of a composite material, an irradiation step for swinging the laser in a tolerance direction crossing the length direction of a cutting line while moving the laser relative to the base material along the length direction of the cutting line for cutting the base material is repeatedly performed on the cutting line, thereby cutting the base material, and in the irradiation step, a swing width in the width direction of the laser is decreased as the depth in the depth direction from the surface of the base material toward the rear surface increases.

Abstract: A method for performing cutting machining by applying a laser beam to the surface of a base material formed from a composite material and cutting the base material to be cut out a product from the base material, a machining line, serving as a boundary between the product to be cut out and a remainder which is the base material after the product is cut out, is set to the base material before the cutting machining, and a plurality of machining paths along the machining line are set to be arranged from the machining line side to the remainder side with the machining line side as a reference. In the cutting machining, the base material is cut by repeatedly executing a laser beam application step for applying the laser beam to the surface of the base material on the basis of the plurality of machining paths having been set.

Abstract: A laser machining method performing cutting machining to cut a composite material over a thickness direction thereof by applying a laser beam to the composite material. The method includes applying the laser beam from one side in the thickness direction of the composite material so as to form a first cutout in the composite material; and applying the laser beam from the other side in the thickness direction of the composite material, forming a second cutout in the composite material at a position opposing the first cutout, connecting the second cutout to the first cutout, and cutting the composite material. The first cutout is formed by applying the laser beam through a plurality of machining paths arranged in the width direction of the first cutout. The second cutout is formed by applying the laser beam through a plurality of machining paths arranged in the width direction of the second cutout.

Abstract: This laser processing device is provided with a laser radiating unit which forms a processed groove extending in a scanning direction on a workpiece, by subjecting the workpiece to laser processing while scanning the surface of the workpiece, and a nozzle portion which has a plurality of ejection holes arranged side by side in the scanning direction, and which ejects a gas toward the processed groove from each of the ejection holes. With this laser processing device, since a plume is eliminated by ejecting gas into the processed groove by means of the nozzle portion, the formation of a heat affected layer by the plume can be suppressed to an even greater extent.

Abstract: A laser processing system and a laser processing method that reduce irregularities on a cutting surface caused by a variation in a heat affected zone or a difference in the heat affected zone due to processing by a laser beam. The laser processing system is provided with: a laser processing device that scans a composite material containing reinforced fibers and a resin with a laser beam to process the composite material; and a control device that controls the laser processing device. The control device calculates a scanning angle formed by a fiber direction that is a direction of the reinforced fibers and a scanning direction that is a direction in which the laser beam is caused to scan, calculates a scanning condition of the laser beam on the basis of the calculated scanning angle, and controls scanning of the laser beam on the basis of the calculated scanning condition.

Abstract: A laser machining device includes: a laser irradiation unit that forms a machining groove that has one end opening to an end section of a workpiece and the other end thereof closed, as a result of scanning a workpiece surface from an end section of the workpiece and laser machining the workpiece; and a nozzle unit that sprays a gas across an irradiation zone of the workpiece surface created by the laser irradiation unit. The nozzle unit is configured so as to increase the flowrate of the gas supplied to the irradiation zone, from one end to the other end of the machining groove.

Abstract: A laser machining device includes a laser machining head and a control unit. The laser machining head applies laser for machining an object to be machined, and includes a first laser light source for first laser, a second laser light source for second laser having a different pulse width different from the first laser, a condensing optical system provided between the object and the laser light sources to condense at least the lasers on the object, a switch mechanism provided between the condensing optical system and the laser light sources so that the switch mechanism is movable to a position that at least one of the lasers enters the condensing optical system, and an irradiation angle change mechanism provided between the condensing optical system and the switch mechanism to change an irradiation angle of the first laser. The control unit controls the laser machining head.

Abstract: A laser processing device includes a laser irradiation unit that performs processing on a workpiece by using a laser while scanning a workpiece surface to form a kerf, jet nozzles that respectively form jet flows flowing toward a bottom surface of the kerf on front and rear sides in a scanning direction of the laser, and an intake part that sucks, above injection ports of the jet nozzles, a gas in a region surrounded by the jet flows from the front and rear sides. In a state in which a certain region of the kerf is isolated by the jet flows, the gas is sucked from this region by the intake part. As a result, a suction force by the intake part can reach the bottom surface of the kerf.

Abstract: A laser processing device of the present invention includes a laser radiation unit which is configured to perform laser processing on a workpiece while scanning a work surface from an end portion of the workpiece to form a processing groove of which one end is open at the end portion of the workpiece and the other end is closed; and a nozzle unit which is configured to inject a gas along the surface of the workpiece such that a flow velocity thereof increases from the one end of the processing groove toward the other end.

Abstract: A laser processing method includes a step of irradiating a workpiece, in which a metal layer made of a heat-resistant alloy and a protective layer made of a thermal barrier coating are laminated, with a first laser beam that is a short-pulse laser beam, and forming a through-hole penetrating the metal layer, and a step of irradiating the workpiece with a laser beam to expand the through-hole.

Abstract: This machine tool control method has: a step for accepting processing content about a workpiece; a step for referring to a storage unit, which stores, for each piece of processing content, a range of set conditions regarding the movements of a machine tool for performing the processing, and specifying the range of the set conditions corresponding to the accepted processing content; and a step for determining the settings of the movements of the machine tool on the premise of the range of the specified set conditions upon accepting a processing order according to the processing content about the workpiece.

Abstract: Provided is a laser processing method in which a laser processing head for irradiating, with at least a short-pulse laser, a processed article having a protection layer laminated to a metal layer is used to process the processed article, whereby high-quality, highly accurate processing is possible by means of a short-pulse laser processing step for irradiating the protection layer with the short-pulse laser and ablating the protection layer, and a metal layer processing step for ablating the metal layer in the area that was ablated during the short-pulse laser processing step.

Abstract: A laser processing method includes a first step of irradiating a surface of a composite material with laser to form a hole processing groove on the composite material in a manner of scanning paths from an outside corresponding to an inner peripheral surface side of the through hole to be formed to an inside corresponding to a center side of the through hole, the paths being across a width direction of the hole processing groove; and a second step of irradiating and penetrating through the hole processing groove with the laser to form the through hole in a manner of scanning paths from the outside to the inside after the first step, the paths being across the width direction of the hole processing groove. The laser used at the first step has a smaller heat input amount per unit time than the laser used at the second step.

Abstract: A method of optimizing a machining simulation condition includes a step of receiving a setting condition of a machine tool at the time of performing a prescribed machining detail, a step of calculating a first machining result that is a machining result assumed when the machine tool performs machining under the received setting condition, a step of acquiring a second machining result that is a machining result when the machine tool performs machining under the received setting condition, and a step of evaluating a degree of coincidence between the first machining result and the second machining result, and repeatedly performs the calculation of the first machining result while changing the precondition of the calculation until the degree of coincidence is equal to or more than a prescribed threshold value.