Abstract: Provided is a computer with a case and a plurality of parts, including heat generating components that generate heat when operated, installed in the case, wherein the case includes a plurality of plates, and heat generated by at least one of the heat generating components when operated is transmitted to at least one of the plates via a heat conduction unit, which connects the at least one of the heat generating parts and the plate, and externally dissipated from the case. The heat generating components mounted in the case can be noiselessly and efficiently cooled without a noise-generating cooling fan.

Abstract: A dynamic Quality of Service (QoS) management apparatus includes: a management server having a database, the management server storing system performance information data collected from a network element (NE) system and dynamic user core management information generated by a user's selection in a table of the database; and a client manager to generate system performance information by referring to the dynamic core management information stored in the database and displaying a status information corresponding to the dynamic user core management information. The management for generating/modifying/deleting the new Key Performance Indicator (KPI) by performing the four rules of arithmetic on the different data (multi DB table attributes) can be performed without stopping the system operation such that the requirements for managing the QoS with compound characteristics due to various functions and policies of different standards can be satisfied.

Abstract: A chipset cooling device of a video graphics adapter (VGA) card that includes two heatsinks mounted on respective opposite surfaces of a VGA card to collectively cool a chipset of the VGA card is provided. In the chipset cooling device of a VGA card, two heatsinks are mounted on opposite surfaces of a printed circuit board (PCB) of the VGA card, respectively, and connected together by a heatpipe. Due to the use of two heatsinks to collectively cool a chipset, cooling efficiency is higher as opposed to using a single heatsink. In particular, a binding portion between a heatsink contacting the chipset of the VGA card and the heatpipe is always positioned at a lower level than a binding portion between the other, opposite heatsink and the heatpipe, thereby further enhancing the heat conduction performance of the heatpipe.

Abstract: A device for fixing coil assemblies of solenoid valves for an electronically controlled brake system in which a bobbin of each coil assembly is firmly coupled to a housing of an electric control unit (ECU) by fixing bosses provided at the bottom of the bobbin and fixing grooves formed at the bottom of the ECU housing to receive the fixing bosses, and cases enclosing the bobbin are elastically supported by the elastic support member. Accordingly, the bobbin and cases can be firmly fixed to the ECU housing. Vertical movement of the cases is also restrained. Accordingly, magnetic flux passing through the cases is constant. A certain gap is also maintained between the bobbin and an upper one of the cases. Therefore, it is possible to prevent the resistance of the coil wound around the bobbin from being varied due to the weight of the upper case.

Abstract: A method of controlling a track seek servo in a hard disk drive and an apparatus therefor. A method of controlling a track seek servo includes moving a transducer to a track with an acceleration trajectory generated by a convolution operation, a rate of change of acceleration of the transducer being zero at a beginning and an end of a track seek operation in a track seek mode.

Abstract: A heatsink for dissipating heat from a heat-generating source such as an electronic component includes heatsink plates, wherein the individual heatsink plates are bound together at a binding portion to form a heat-absorbing portion for contacting a heat-dissipating surface of the electronic component, and portions of the heatsink plates opposite the heat-absorbing surface are separated from each other to collectively act as a heat-dissipating portion binding the heatsink plates together. To provide the separation between heat-dissipating portions of the heatsink plates, the heatsink includes spacers interposed between the binding portions of neighboring heatsink plates or the heatsink plates are spread out apart from each other by being bent at angles. The heatsink plates include fins spaced apart from each other at an interval. The binding element is preferably a rivet.

Abstract: Provided is a computer with a case and a plurality of parts, including heat generating components that generate heat when operated, installed in the case, wherein the case includes a plurality of plates, and heat generated by at least one of the heat generating components when operated is transmitted to at least one of the plates via a heat conduction unit, which connects the at least one of the heat generating pars and the plate, and externally dissipated from the case. The heat generating components mounted in the case can be noiselessly and efficiently cooled without a noise-generating cooling fan.

Abstract: A heatsink and a heatsink device using the heatsink are provided. The heatsink is formed of a plurality of thin heatsink plates, and the individual heatsink plates are bound to one another to be radially spread out, thereby enlarging the surface area of the heatsink and increasing its heat-dissipating efficiency. In the heatsink device, the heatsink is installed in an air duct, and cool air is supplied into the air duct by a fan, to thereby further increase the heat-dissipating efficiency. The binding force of the heatsink to a heat-generating source can be elastically maintained, which allows the heatsink to remain bound to the heat-generating source even after an external impact. In addition, by cutting out an upper portion of the heatsink plate, folding lines of the heatsink plate are shortened so that the heat-absorbing portions of the heatsink plates stacked upon one another can be tightly joined to form a heatsink by a reduced force.

Abstract: Disclosed is a bobbin case of a rotary shuttle device for a sewing machine, in which an under thread pulled out of a bobbin is continuously and stably supplied to a sewing region.

Abstract: A bobbin for a sewing machine which is rotatably disposed in a rotary shell device of the machine to supply and under thread when performing a sewing operation, comprises of winding shaft separately inserted onto a fixed shaft of the rotary shuttle and on which the under thread is substantially wound, a first flange integrally formed at one end of the winding shaft, a second flange integrally formed at the other end of the winding shaft, and a partition flange forming a first winding portion between the first flange and the partition flange and forming a second winding portion between the second flange and the partition flange, a plurality of saw-toothed protrusions being formed at an entire outer circumference of the partition flange, and the protrusions having a linear sidewall that is oriented in a radial direction of the partition flange.

Abstract: A heatsink and a heatsink device using the heatsink are provided. The heatsink is formed of a plurality of thin heatsink plates, and the individual heatsink plates are bound to one another to be radially spread out, thereby enlarging the surface area of the heatsink and increasing its heat-dissipating efficiency. In the heatsink device, the heatsink is installed in an air duct, and cool air is supplied into the air duct by a fan, to thereby further increase the heat-dissipating efficiency. The binding force of the heatsink to a heat-generating source can be elastically maintained, which allows the heatsink to remain bound to the heat-generating source even after an external impact. In addition, by cutting out an upper portion of the heatsink plate, folding lines of the heatsink plate are shortened so that the heat-absorbing portions of the heatsink plates stacked upon one another can be tightly joined to form a heatsink by a reduced force.