Abstract: A method for fabricating a capacitor includes forming a first storage node (SN) oxide layer over a substrate, forming a second SN oxide layer over the first SN oxide layer, forming a mask pattern over the second SN oxide layer, dry-etching the first and the second SN oxide layers using the mask pattern as an etch barrier to form a capacitor region, and wet-etching a resultant structure including the capacitor region to enlarge a bottom width of the capacitor region, thereby forming a final capacitor region having the enlarged bottom width, wherein the first SN oxide layer comprises one portion of high impurity concentration and the other portion of low impurity concentration, the one portion corresponding to a region where the final capacitor region is to be formed.

Abstract: A method for fabricating a semiconductor device includes forming a first trench by etching a substrate, forming first spacers on sidewalls of the first trench, forming a second trench by etching the substrate under the first trench, forming second spacers on sidewalls of the second trench, forming a third trench, which has a wider width than a width between the second spacers, by etching the substrate under the second trench, forming a liner layer on the surface of the third trench, and exposing one of the sidewalls of the second trench by selectively removing the second spacers.

Abstract: A wafer level chip scale package having stud bumps and a method for fabricating the same are described. The wafer level chip scale package includes a silicon substrate having a passivation layer and a chip pad on its top surface; a stud bump being formed on the chip pad and encircled by a first insulating layer; a re-distributed line (RDL) pattern being formed on the same horizontal surface as the first insulating layer and the stud bump, the RDL pattern for connecting the stud bump and a solder bump; a second insulating layer for insulating the RDL pattern so that a portion of the RDL pattern that is connected with the solder bump is exposed; and the solder bump being attached to the exposed portion if the RDL pattern.

Abstract: An apparatus includes: a process chamber for treating a substrate; a susceptor in the process chamber; a supporting frame over the susceptor; and at least one wire connected to the supporting frame.

Abstract: An apparatus and method for seamlessly providing voice and data services to a user through an access terminal in a mobile communication system including a heterogeneous service & mobility gateway (HSMG) for an interworking service between a circuit network and a packet network, and various access networks overlapping each other. The access terminal notifies the HSMG that a voice call is received, if the access terminal that accessed a packet network receives a voice call. The HSMG sends a direction request to a circuit network upon receiving the notification indicating that the voice call is received. The access terminal directs to the circuit network and registers a new location upon receiving the direction request. The HSMG sets up an incoming voice call to the access terminal after the registration of a new location.

Abstract: A method for fabricating a capacitor includes forming a first storage node (SN) oxide layer over a substrate, forming a second SN oxide layer over the first SN oxide layer, forming a mask pattern over the second SN oxide layer, dry-etching the first and the second SN oxide layers using the mask pattern as an etch barrier to form a capacitor region, and wet-etching a resultant structure including the capacitor region to enlarge a bottom width of the capacitor region, thereby forming a final capacitor region having the enlarged bottom width, wherein the first SN oxide layer comprises one portion of high impurity concentration and the other portion of low impurity concentration, the one portion corresponding to a region where the final capacitor region is to be formed.

Abstract: An apparatus includes: a process chamber for treating a substrate; a susceptor in the process chamber; a supporting frame over the susceptor; and at least one wire connected to the supporting frame.

Abstract: An apparatus includes: a process chamber for treating a substrate; a susceptor in the process chamber; a supporting frame over the susceptor; and at least one wire connected to the supporting frame.

Abstract: A femto base station of a WiMAX system can manage a list of closed subscriber groups (CSGs). A CSG indicator is broadcast. The femto base station receives a registration request message from a mobile station having received the CSG indicator and adds the mobile station to a CSG registration list. The femto base station searches for the mobile station from the CSG registration list if an attach request message is received; and forwards the attach request message to an access service network (ASN) gateway if the mobile station is in the CSG registration list. The femto base station establishes a link message with the mobile station if an attach acceptance message corresponding to the attach request message from the ASN-gateway.

Abstract: A method and a system for establishing a local routing in a mobile communication network, and for allowing different mobile stations connected with the same Access Service Network GateWay (ASN GW) to transmit and receive traffic without delivering such traffic to a Home Agent (HA) are provided. In the method, a session server determines whether first and second mobile stations are connected with the same ASN GW by using their location information. In case of a connection with the same ASN GW, the session server establishes a local routing in the ASN GW so that traffic between the first and second mobile stations is directly routed to each other at the ASN GW. Then the ASN GW receiving the traffic from one of both mobile stations transmits the traffic to the other according to the local routing.

Abstract: Disclosed are asymmetric styryl derivatives and an organic light emitting diode prepared using the same. More particularly, there are provided asymmetric styryl derivatives that can provide a blue organic light emitting diode with superior thermal stability, as well as improved luminous efficiency, improved brightness, and extended lifetime, by synthesizing a novel thermally stable compound with a styryl structure represented by Formula 1, and using the compound as a dopant in an organic light emitting layer (EML) of a multilayered organic light emitting diode, and an organic light emitting diode prepared by the same.

Abstract: A system for providing communication when a mobile station moves between a wireless LAN system and a mobile communication system. A packet data service node provides a packet data service between an IP network and the mobile station when the mobile station accesses the mobile communication system. A packet control function provides the packet data service between a correspondent node connected to the IP network and the mobile station when the mobile station previously connected to the mobile communication system is connected to an access point, and provides the packet data service between the correspondent node connected to the IP network and the mobile station when the mobile station previously connected to the access point is connected to a base station system. An interworking server connected between the access point of the wireless LAN system and the packet control function of the mobile communication system.

Abstract: A method for performing a handoff between a wireless local area network (LAN) including an access router (AR) supporting an Internet protocol (IP) routing function and a mobile communication network including a packet data service node (PDSN) connected to a base station system (BSS), for supporting the IP routing function. An access terminal (AT) detects its movement from the wireless LAN to the mobile communication network, and exchanges information for tunneling between the AR and the PDSN, with the PDSN. The PDSN sets up a tunnel for packet delivery between the PDSN and the AR, and delivers packets to the AT through the set tunnel.

Abstract: Disclosed is a insole arranged on an upper surface of an innersole in a shoe. The insole includes: an intermediate supporting portion 41 coming into close contact with a center portion of a foot sole, including an arch, and having a plurality of elastic protrusions P formed on a lower surface of grids L defining grid-type thru-holes; and a rear supporting portion 42 extending from the rear end of the intermediate supporting portion 11 to a heel of the foot in order to make close contact with a rear portion of the foot sole, and having a plurality of stationary protrusions P? formed on the lower surface of the rear supporting portion 42 to protrude downward. The insole can improve air permeability through the thru-holes, and in addition always makes close contact with the foot sole through elastic protrusions formed on the lower surface thereof so as to buffer impact on the shoe.

Abstract: An integrated light guide panel for use in a backlight unit for an LCD and a method for manufacturing the same are disclosed. The integrated light guide panel includes a light guide panel for guiding light, to form surface light, a reflective coating layer arranged beneath the light guide panel, to reflect light emerging from a lower surface of the light guide panel such that the light is again incident to the light guide panel, a diffusive coating layer arranged over the light guide panel, to diffuse light emerging from the light guide panel, a prism coating layer arranged over the diffusive coating layer, to concentrate light emerging from the diffusive coating layer, and low refractive coating layers respectively arranged between the light guide panel and the reflective coating layer and between the light guide panel and the diffusive coating layer.

Abstract: A method for fabricating a semiconductor device includes: providing a substrate structure including a bit line and a capacitor formed apart from each other at a different level; forming first, second, and third insulation layers over the bit line, the second insulation layer being a first etch stop layer; forming a second etch stop layer over a top electrode of the capacitor; forming a fourth insulation layer over the third insulation layer and the second etch stop layer; and performing a plurality of etch steps to expose an upper surface of the bit line and an upper surface of the capacitor.

Abstract: A terminal-state-setting apparatus and a method using a distance between a portable communication terminal and a user are provided. The terminal-state-setting method in the portable communication terminal includes measuring a distance between the terminal and a user-distance-recognizing device using a radio communication; and setting a state of the terminal according to the measured distance value. The user does not have to manually set the terminal state through the menu setup, and the user state can be accurately reflected through a presence service.

Abstract: Provided is a method of cross-paging including transmitting mobile terminal location information from a mobile communication system to a heterogeneous mobile communication system after the mobile terminal location registration. The mobile communication system is then requested to page the mobile terminal according to the received information in the heterogeneous mobile communication system and, then the mobile terminal is paged. Further provided is a method of cross-paging that includes determining whether the mobile terminal has been location-registered in the mobile communication system or in the heterogeneous mobile communication system with reference to pre-registered mobile terminal location information when a mobile terminal paging request occurs in the heterogeneous mobile communication system.

Abstract: An active handoff system and method of a dual mode terminal capable of connecting to a wireless network, such as wireless local area network (LAN), and a mobile communication system are provided. The handoff method includes the steps of assigning, at a packet data service node of the mobile communication system, an IP address to the dual mode terminal connected to the service network, establishing, at the packet data service node, a tunneling path to the wireless LAN when the dual mode terminal moves from the mobile communication network to the wireless LAN, and disconnecting, at the packet data service node, the tunneling path to the wireless LAN, and establishing a tunneling path to another packet data service node whose Internet Protocol (IP) address has been established by the packet data service node, when the dual mode terminal moves from the wireless LAN to the mobile communication system.

Abstract: A method for fabricating a semiconductor device includes: providing a substrate structure including a bit line and a capacitor formed apart from each other at a different level; forming first, second, and third insulation layers over the bit line, the second insulation layer being a first etch stop layer; forming a second etch stop layer over a top electrode of the capacitor; forming a fourth insulation layer over the third insulation layer and the second etch stop layer; and performing a plurality of etch steps to expose an upper surface of the bit line and an upper surface of the capacitor.