Patents by Inventor Sang-eui Lee

Sang-eui Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9505934
    Abstract: A super-hydrorepellent coating composition including a nano structure, polyorganosiloxane, a cross-linker, and a catalyst; a super-hydrorepellent coating layer including a cured product of the super-hydrorepellent coating composition; and a heat exchanger including the super-hydrorepellent coating layer.
    Type: Grant
    Filed: April 22, 2011
    Date of Patent: November 29, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Chul Ko, Woo-Taek Hwang, Ha-Jin Kim, Sang Eui Lee, Nak-Hyun Kim
  • Patent number: 9501013
    Abstract: A heating member for a fusing apparatus includes a resistive heating layer including a base polymer and an electroconductive filler dispersed in the base polymer, where the resistive heating layer generates heat by receiving electric energy, and where a storage modulus of the resistive heating layer is about 1.0 megapascal or greater.
    Type: Grant
    Filed: May 8, 2013
    Date of Patent: November 22, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-eui Lee, Dong-earn Kim, Dong-ouk Kim, Ha-jin Kim, Sung-hoon Park, Min-jong Bae, Yoon-chul Son, Kun-mo Chu, In-Taek Han
  • Publication number: 20160293290
    Abstract: A composition for preparing an electrically conductive composite includes, based on the total weight of the composition: about 37 weight percent to about 84 weight percent of an epoxy; about 0.001 weight percent to about 22 weight percent of an electrically conductive filler; and about 15 weight percent to about 45 weight percent of a thermoplastic resin, wherein the thermoplastic resin is a liquid at about 25° C., is miscible with the epoxy, and forms a domain upon heat curing that is phase-separated from the epoxy and the electrically conductive inorganic filler. Also composites prepared therefrom and an electronic device including the same.
    Type: Application
    Filed: February 19, 2016
    Publication date: October 6, 2016
    Inventors: Soichiro MIZUSAKI, Sang Eui LEE, Won Suk CHANG, In Taek HAN
  • Patent number: 9362189
    Abstract: A case including a case main body, a matrix including a semiconductor nanocrystal, the matrix disposed in the case main body, and a sealant disposed on the case main body, wherein the sealant has a gas permeability of about 1 cubic centimeter at standard temperature and pressure per centimeter per meter squared per day per atmosphere or less and a tensile strength of about 5 megaPascals or more, and wherein the semiconductor nanocrystal is a Group II-VI compound, a Group III-V compound, a Group IV-VI compound, a Group IV element, a Group IV element, a Group IV compound, or a combination thereof.
    Type: Grant
    Filed: May 9, 2012
    Date of Patent: June 7, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shin Ae Jun, Eun Joo Jang, In-Taek Han, Hyun A. Kang, Hyo Sook Jang, Sang Eui Lee, Soo-Kyung Kwon
  • Patent number: 9348280
    Abstract: A heating composite, including a polymer matrix; and a carbon nanotube structure including a plurality of carbon nanotubes continuously connected to each other and integrated with the polymer matrix.
    Type: Grant
    Filed: May 18, 2012
    Date of Patent: May 24, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Eui Lee, In-Taek Han, Yoon-Chul Son, Ha Jin Kim, Dong-Ouk Kim, Dong-Earn Kim, Kun Mo Chu
  • Patent number: 9272902
    Abstract: A resistance heating composition including a silicon emulsion particle, a carbon nanotube, and an aqueous medium.
    Type: Grant
    Filed: August 2, 2012
    Date of Patent: March 1, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-ouk Kim, Dong-earn Kim, Ha-jin Kim, Sung-hoon Park, Min-jong Bae, Yoon-chul Son, Sang-eui Lee, Kun-mo Chu, In-taek Han
  • Patent number: 9165701
    Abstract: A resistance heating element includes a positive temperature coefficient resistance heating layer having a positive temperature coefficient, and a negative temperature coefficient resistance heating layer, which is connected to the positive temperature coefficient resistance heating layer and has a negative temperature coefficient.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: October 20, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kun-mo Chu, Dong-earn Kim, Sang-eui Lee, Dong-ouk Kim, Ha-jin Kim, Sung-hoon Park, Min-jong Bae, Yoon-chul Son
  • Publication number: 20150288247
    Abstract: A BLDC vibrational motor is provided, which is improved so as to generate a larger vibrational force per same volume compared to prior arts. A cylindrical bearing is fixed to a doughnut-shaped permanent magnet directly so that the magnet can be disposed as close as possible to the center of rotation, and thus coils can have a reduced volume and be disposed as close as possible to the center of rotation. The external space of the coils can be secured larger as much as the movement of position of the coils, and the weight takes up the space for rotation, so that volume of the weight can be enlarged. Thus, the weight can be extended and disposed to the external space of the coils, it is possible for a vibration motor with a small volume to generate a large vibrational force, which facilitates slim designs of the vibrational motor.
    Type: Application
    Filed: April 2, 2015
    Publication date: October 8, 2015
    Inventor: Sang Eui LEE
  • Patent number: 9052655
    Abstract: A heating member includes: a resistive heating layer which generates heat when supplied with electrical energy; a release layer as an outermost layer of the heating member and including a polymer; an intermediate layer disposed between the resistive heating layer and the release layer. The resistive heating layer includes a base polymer, and an electroconductive filler dispersed in the base polymer. The intermediate layer includes a polymer material being a same type as the base polymer of the resistive heating layer or the polymer of the release layer.
    Type: Grant
    Filed: March 21, 2013
    Date of Patent: June 9, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoon-chul Son, Dong-earn Kim, Dong-ouk Kim, Ha-jin Kim, Sung-hoon Park, Min-jong Bae, Sang-eui Lee, Kun-mo Chu, In-taek Han
  • Patent number: 9037063
    Abstract: A method of forming a thin film resistive heating layer, the method including: forming a polymer layer by extruding a polymer paste, in which an electrically conductive filler is dispersed, by using an extrusion molding operation, on an outer circumferential surface of a cylindrical member; and forming a thin film resistive heating layer by making an outer diameter of the polymer layer uniform by using a ring blading operation.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: May 19, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-eui Lee, Ha-jin Kim, Dong-earn Kim, Dong-ouk Kim, Sung-hoon Park, Min-jong Bae, Yoon-chul Son, Kun-mo Chu
  • Patent number: 9002253
    Abstract: A heating member includes: a resistive heating layer including: a medium-passing area, and non-medium-passing areas respectively on opposing sides of the medium-passing area at opposing side portions of the resistive heating layer; a core which supports the resistive heating layer; a thermally conductive layer between the resistive heating layer and the core, and disposed in a non-medium passing area at a side portion of the resistive heating layer; and an electrode which is between the resistive heating layer and the core, contacts the side portion of the resistive heating layer and supplies current to the resistive heating layer. A ratio of a contact area between the thermally conductive layer and the resistive heating layer to an area of the non-medium-passing area in which the thermally conductive layer is disposed, ranges from about 5% to about 25%.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: April 7, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoon-chul Son, Dong-earn Kim, Dong-ouk Kim, Ha-jin Kim, Sung-hoon Park, Min-jong Bae, Sang-eui Lee, Kun-mo Chu
  • Publication number: 20150070932
    Abstract: A light source unit includes: a light guiding plate having a front surface and a rear surface facing each other, and a side surface between the front surface and the rear surface; a light guiding bar disposed on the side surface of the light guiding plate; a quantum dot package disposed on a surface of the light guiding bar; and a dot light source which provides light to the quantum dot package.
    Type: Application
    Filed: July 29, 2014
    Publication date: March 12, 2015
    Inventors: Dong Earn KIM, Jeong Hee LEE, Eun Joo JANG, Min Jong BAE, Sang Eui LEE
  • Publication number: 20150062967
    Abstract: A light source unit includes a light guide plate which includes a front surface and a rear surface which are opposite to each other and a side between and connecting the front surface and the rear surface, a light conversion device on the side of the light guide plate; and a light source which generates and supplies light to the light conversion device.
    Type: Application
    Filed: April 14, 2014
    Publication date: March 5, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min Jong BAE, Jeong Hee LEE, Dong Earn KIM, Sang Eui LEE, Na Youn Won, Hyun A KANG, Shin Ae JUN
  • Publication number: 20150041715
    Abstract: A method of grinding a semiconductor nanocrystal-polymer composite, the method including obtaining a semiconductor nanocrystal-polymer composite including a semiconductor nanocrystal and a first polymer, contacting the semiconductor nanocrystal-polymer composite with an inert organic solvent; and grinding the semiconductor nanocrystal-polymer composite in the presence of the inert organic solvent to grind the semiconductor nanocrystal-polymer composite.
    Type: Application
    Filed: August 7, 2014
    Publication date: February 12, 2015
    Inventors: Jeong Hee LEE, Hyun A KANG, Eun Joo JANG, Sang Eui LEE, Shin Ae JUN, Oul CHO, Tae Gon KIM, Tae Hyung KIM
  • Publication number: 20140242345
    Abstract: A method of preparing a nano-composite layer comprising superhydrophobic surfaces, the method comprising: providing a first roll and a second roll with a predetermined gap therebetween; rotating the first roll and the second roll in a direction towards each other, wherein a linear velocity of the first roll is greater than a linear velocity of the second roll; supplying a composition for the nano-composite layer to the predetermined gap to form a composition layer having a first thickness on a circumference of the first roll; adjusting the linear velocity of the first roll, the second roll, or both, such that the linear velocity of the second roll is greater than or equal to the linear velocity of the first roll to form the nano-composite layer; and separating the nano-composite layer from the first roll.
    Type: Application
    Filed: February 25, 2014
    Publication date: August 28, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sung-hoon PARK, Sang-eui LEE, Dong-ouk KIM, Byung-hoon KIM
  • Publication number: 20140205336
    Abstract: A resistance heating element includes a positive temperature coefficient resistance heating layer having a positive temperature coefficient, and a negative temperature coefficient resistance heating layer, which is connected to the positive temperature coefficient resistance heating layer and has a negative temperature coefficient.
    Type: Application
    Filed: December 2, 2013
    Publication date: July 24, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kun-mo CHU, Dong-earn KIM, Sang-eui LEE, Dong-ouk KIM, Ha-jin KIM, Sung-hoon PARK, Min-jong BAE, Yoon-chul SON
  • Publication number: 20140126940
    Abstract: A heating member includes: a resistive heating layer including: a medium-passing area, and non-medium-passing areas respectively on opposing sides of the medium-passing area at opposing side portions of the resistive heating layer; a core which supports the resistive heating layer; a thermally conductive layer between the resistive heating layer and the core, and disposed in a non-medium passing area at a side portion of the resistive heating layer; and an electrode which is between the resistive heating layer and the core, contacts the side portion of the resistive heating layer and supplies current to the resistive heating layer. A ratio of a contact area between the thermally conductive layer and the resistive heating layer to an area of the non-medium-passing area in which the thermally conductive layer is disposed, ranges from about 5% to about 25%.
    Type: Application
    Filed: May 29, 2013
    Publication date: May 8, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yoon-chul SON, Dong-earn KIM, Dong-ouk KIM, Ha-jin KIM, Sung-hoon PARK, Min-jong BAE, Sang-eui LEE, Kun-mo CHU
  • Publication number: 20140072353
    Abstract: A fusing apparatus including a heating unit including a heater having a substantially flat shape; a nip forming unit which faces the heating unit and forms a fusing nip with the heating unit; and a driving unit which moves the heating unit to alternately repeat a forward motion whereby the heating unit moves forward in a moving direction of the recording medium, when the fusing nip is formed, and a returning motion whereby the heating unit moves backward in a direction opposite to the moving direction of the recording medium, when the fusing nip is released.
    Type: Application
    Filed: June 21, 2013
    Publication date: March 13, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dong-earn KIM, Dong-ouk KIM, Ha-jin KIM, Sung-hoon PARK, Min-jong BAE, Yoon-chul SON, Sang-eui LEE, Kun-mo CHU, In-taek HAN
  • Publication number: 20140053393
    Abstract: A method of forming a thin film resistive heating layer, the method including: forming a polymer layer by extruding a polymer paste, in which an electrically conductive filler is dispersed, by using an extrusion molding operation, on an outer circumferential surface of a cylindrical member; and forming a thin film resistive heating layer by making an outer diameter of the polymer layer uniform by using a ring blading operation.
    Type: Application
    Filed: June 28, 2013
    Publication date: February 27, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sang-eui LEE, Ha-jin KIM, Dong-earn KIM, Dong-ouk KIM, Sung-hoon PARK, Min-jong BAE, Yoon-chul SON, Kun-mo CHU
  • Publication number: 20130302074
    Abstract: A heating member for a fusing apparatus includes a resistive heating layer including a base polymer and an electroconductive filler dispersed in the base polymer, where the resistive heating layer generates heat by receiving electric energy, and where a storage modulus of the resistive heating layer is about 1.0 megapascal or greater.
    Type: Application
    Filed: May 8, 2013
    Publication date: November 14, 2013
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sang-eui LEE, Dong-earn KIM, Dong-ouk KIM, Ha-jin KIM, Sung-hoon PARK, Min-jong BAE, Yoon-chul SON, Kun-mo CHU, In-taek HAN