Patents by Inventor Sang-eui Lee

Sang-eui Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130251425
    Abstract: A heating member includes: a resistive heating layer which generates heat when supplied with electrical energy; a release layer as an outermost layer of the heating member and including a polymer; an intermediate layer disposed between the resistive heating layer and the release layer. The resistive heating layer includes a base polymer, and an electroconductive filler dispersed in the base polymer. The intermediate layer includes a polymer material being a same type as the base polymer of the resistive heating layer or the polymer of the release layer.
    Type: Application
    Filed: March 21, 2013
    Publication date: September 26, 2013
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yoon-chul SON, Dong-earn KIM, Dong-ouk KIM, Ha-jin KIM, Sung-hoon PARK, Min-jong BAE, Sang-eui LEE, Kun-mo CHU, In-taek HAN
  • Publication number: 20130222510
    Abstract: A resistance heating composition including a silicon emulsion particle, a carbon nanotube, and an aqueous medium.
    Type: Application
    Filed: August 2, 2012
    Publication date: August 29, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-ouk KIM, Dong-earn KIM, Ha-Jin KIM, Sung-hoon PARK, Min-jong BAE, Yoon-chul SON, Sang-eui LEE, Kun-mo CHU, In-taek HAN
  • Publication number: 20130112379
    Abstract: A super-hydrorepellent coating composition including a nano structure, polyorganosiloxane, a cross-linker, and a catalyst; a super-hydrorepellent coating layer including a cured product of the super-hydrorepellent coating composition; and a heat exchanger including the super-hydrorepellent coating layer.
    Type: Application
    Filed: April 22, 2011
    Publication date: May 9, 2013
    Inventors: Young-Chul Ko, Woo-Taek Hwang, Ha-Jin Kim, Sang Eui Lee, Nak-Hyun Kim
  • Patent number: 8437674
    Abstract: A heating member includes a resistive heating layer disposed on an outermost layer of the heating member, where the resistive heating layer includes a conductive filler distributed in a base material and where the resistive heating layer emits heat when supplied with an electric current from an electrode, and a contacting unit which exposes the conductive filler of the resistive heating layer and contacts the electrode.
    Type: Grant
    Filed: July 29, 2010
    Date of Patent: May 7, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-eui Lee, In-taek Han, Ha-jin Kim, Sang-soo Jee, Dong-earn Kim
  • Publication number: 20130062591
    Abstract: A case including a case main body, a matrix including a semiconductor nanocrystal, the matrix disposed in the case main body, and a sealant disposed on the case main body, wherein the sealant has a gas permeability of about 1 cubic centimeter at standard temperature and pressure per centimeter per meter squared per day per atmosphere or less and a tensile strength of about 5 megaPascals or more, and wherein the semiconductor nanocrystal is a Group II-VI compound, a Group III-V compound, a Group IV-VI compound, a Group IV element, a Group IV element, a Group IV compound, or a combination thereof.
    Type: Application
    Filed: May 9, 2012
    Publication date: March 14, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shin Ae JUN, Eun Joo JANG, In-Taek HAN, Hyun A. KANG, Hyo Sook JANG, Sang Eui LEE, Soo-Kyung KWON
  • Patent number: 8355661
    Abstract: A fusing device includes; a heating member having a resistive heating layer constituting an outermost portion of the heating member, a nip forming member facing the heating member to form a fusing nip therewith, and a plurality of current supplying electrodes which contact an outer circumference of the resistive heating layer to supply electrical current to the resistive heating layer.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: January 15, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-earn Kim, In-taek Han, Ha-jin Kim, Sang-soo Jee, Sang-eui Lee
  • Publication number: 20120294659
    Abstract: A heating composite, including a polymer matrix; and a carbon nanotube structure including a plurality of carbon nanotubes continuously connected to each other and integrated with the polymer matrix.
    Type: Application
    Filed: May 18, 2012
    Publication date: November 22, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-eui LEE, In-taek HAN, Yoon-chul SON, Ha-jin KIM, Dong-ouk KIM, Dong-earn KIM, Kun-mo CHU
  • Patent number: 8290418
    Abstract: A fixing unit includes a heating member which includes a core member, and a heating layer. The heating layer is disposed on an outer circumference of the core member. The heating layer includes an elastic material, and carbon nanotube doped with metal and distributed in the elastic material as a conductive filler of the heating layer. A press member faces the heating member to form a fixing nip. The fixing unit applies heat and pressure to toner on a medium passing through the fixing nip, to fix the toner on the medium.
    Type: Grant
    Filed: September 11, 2009
    Date of Patent: October 16, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ha-jin Kim, In-taek Han, Sang-soo Jee, Sang-eui Lee, Dong-earn Kim
  • Publication number: 20120207525
    Abstract: A resistance heating composition including carbon nanotubes, an ionic liquid, and a binder resin.
    Type: Application
    Filed: February 13, 2012
    Publication date: August 16, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-ouk KIM, Ha-Jin KIM, In-taek HAN, Yoon-chul SON, Sang-soo JEE, Dong-earn KIM, Sang-eui LEE, Kun-mo CHU
  • Publication number: 20120181004
    Abstract: A surface coating layer, in contact with a surface of a base material of a heat exchanger, comprises a plurality of composite layers comprising a first layer contacting a surface of the base material, the first layer comprising a first matrix and a first nanobody, and a second layer contacting a surface of the first layer and having an interface with the air, where the first layer and the second layer each include a different amount by volume of the first nanobody and the second nanobody, respectively.
    Type: Application
    Filed: May 17, 2011
    Publication date: July 19, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yoon Chul SON, Sang Eui LEE, Ha Jin KIM, Dong Ouk KIM, Dong Earn KIM, Kun Mo CHU
  • Patent number: 8055177
    Abstract: A heating member includes a weight supporter having an outer circumference, and a resistive heating disposed on the outer circumference of the weight supporter. The resistive heating layer includes a conductive filler dispersed in a base material. A pair of electrodes extends along a length direction of a rotational axis of the weight supporter and is arranged along a circumference of the weight supporter for supplying electric power to the resistive heating layer.
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: November 8, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-eui Lee, In-taek Han, Ha-jin Kim, Sang-soo Jee, Dong-earn Kim
  • Publication number: 20110116850
    Abstract: A heating member includes a resistive heating layer disposed on an outermost layer of the heating member, where the resistive heating layer comprises a conductive filler distributed in a base material and where the resistive heating layer emits heat when supplied with an electric current from an electrode, and a contacting unit which exposes the conductive filler of the resistive heating layer and contacts the electrode..
    Type: Application
    Filed: July 29, 2010
    Publication date: May 19, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-eui LEE, In-taek HAN, Ha-jin KIM, Sang-soo JEE, Dong-earn KIM
  • Publication number: 20110044739
    Abstract: A fusing device includes; a heating member having a resistive heating layer constituting an outermost portion of the heating member, a nip forming member facing the heating member to form a fusing nip therewith, and a plurality of current supplying electrodes which contact an outer circumference of the resistive heating layer to supply electrical current to the resistive heating layer.
    Type: Application
    Filed: August 10, 2010
    Publication date: February 24, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-earn KIM, In-taek HAN, Ha-jin KIM, Sang-soo JEE, Sang-eui LEE
  • Publication number: 20100260526
    Abstract: A heating member includes a weight supporter having an outer circumference, and a resistive heating disposed on the outer circumference of the weight supporter. The resistive heating layer includes a conductive filler dispersed in a base material. A pair of electrodes extends along a length direction of a rotational axis of the weight supporter and is arranged along a circumference of the weight supporter for supplying electric power to the resistive heating layer.
    Type: Application
    Filed: October 26, 2009
    Publication date: October 14, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-eui LEE, In-Taek HAN, Ha-jin KIM, Sang-soo JEE, Dong-earn KIM
  • Publication number: 20100209154
    Abstract: A fixing unit includes a heating member which includes a core member, and a heating layer. The heating layer is disposed on an outer circumference of the core member. The heating layer includes an elastic material, and carbon nanotube doped with metal and distributed in the elastic material as a conductive filler of the heating layer. A press member faces the heating member to form a fixing nip. The fixing unit applies heat and pressure to toner on a medium passing through the fixing nip, to fix the toner on the medium.
    Type: Application
    Filed: September 11, 2009
    Publication date: August 19, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ha-jin KIM, In-taek HAN, Sang-soo JEE, Sang-eui LEE, Dong-earn KIM