Abstract: A printed circuit board includes an insulating layer including a cavity including a groove structure formed on one surface of the insulating layer, a circuit pattern including a first pad formed on a bottom surface of the cavity and a second pad formed inside the insulating layer, a first metal layer embedded in a side surface of the cavity, the first metal layer being in contact with the bottom surface of the cavity and being formed along the boundary of the cavity, and a second metal layer formed on the second pad and having a stepped structure formed with the second pad.

Abstract: An electronic component-embedded substrate of the present disclosure includes a core structure including an insulating layer, a first wiring layer disposed on an upper surface of the insulating layer and a through-portion passing through the insulating layer; a first electronic component disposed in the through-portion and including a connection electrode; an insulator disposed in a portion of the through-portion between the core structure and a portion of the first electronic component; and a first metal layer disposed on an upper surface of the insulator. At least a portion of the first metal layer is included on the first wiring layer and physically in contact with at least a portion of the connection electrode.

Abstract: A printed circuit board includes a first insulating layer having a cavity, a metal pattern including a first shielding pattern disposed on an inner wall of the cavity and a second shielding pattern spaced apart from the first shielding pattern and covering the first shielding pattern, an electronic device positioned in the cavity and surrounded by the first shielding pattern and the second shielding pattern, and a second insulating layer stacked on the first insulating layer and embedding the electronic device therein.

Abstract: A printed circuit board includes a first insulating layer having a cavity, a metal pattern including a first shielding pattern disposed on an inner wall of the cavity and a second shielding pattern spaced apart from the first shielding pattern and covering the first shielding pattern, an electronic device positioned in the cavity and surrounded by the first shielding pattern and the second shielding pattern, and a second insulating layer stacked on the first insulating layer and embedding the electronic device therein.

Abstract: The present invention relates to a method for stabilizing retinol (Vitamin A), an unstable fat-soluble material, to use the same in cosmetics. The present invention provides an anti-inflammatory and skin wrinkle reducing cosmetic composition containing retinol stabilized by nano-emulsification, wherein a retinol polymer nanocapsule formed by capturing retinol with porous polymer particles is nano-emulsified by a mung bean MCT (medium chain triglyceride) extract and lecithin for stabilizing retinol.

Abstract: The present invention relates to a method for stabilizing retinol (Vitamin A), an unstable fat-soluble material, to use the same in cosmetics. The present invention provides an anti-inflammatory and skin wrinkle reducing cosmetic composition containing retinol stabilized by nano-emulsification, wherein a retinol polymer nanocapsule formed by capturing retinol with porous polymer particles is nano-emulsified by a mung bean MCT (medium chain triglyceride) extract and lecithin for stabilizing retinol.

Abstract: Disclosed herein is a hemodialysis tube treated with a medicament on the surface thereof, which provides stable communication between the artery and the vein of the patient under hemodialysis and can greatly reduce stenosis at arteriovenous connections. As a base material of the hemodialysis tube, expanded polytetrafluoroethylene is used while the medicament is paclitaxel or rapamycin.