Abstract: The invention provides a method of forming a film stack on a substrate, comprising depositing a tungsten nitride layer on the substrate, subjecting the substrate to a nitridation treatment using active nitrogen species from a remote plasma, and depositing a conductive bulk layer directly on the tungsten nitride layer without depositing a tungsten nucleation layer on the tungsten nitride layer as a growth site for tungsten.

Abstract: Embodiments of the invention provide an improved process for depositing tungsten-containing materials. The process utilizes soak processes and vapor deposition processes to provide tungsten films having significantly improved surface uniformity while increasing the production level throughput. In one embodiment, a method is provided which includes depositing a tungsten silicide layer on the substrate by exposing the substrate to a continuous flow of a silicon precursor while also exposing the substrate to intermittent pulses of a tungsten precursor. The method further provides that the substrate is exposed to the silicon and tungsten precursors which have a silicon/tungsten precursor flow rate ratio of greater than 1, for example, about 2, about 3, or greater. Subsequently, the method provides depositing a tungsten nitride layer on the tungsten suicide layer, depositing a tungsten nucleation layer on the tungsten nitride layer, and depositing a tungsten bulk layer on the tungsten nucleation layer.

Abstract: Embodiments of the invention provide an improved process for depositing tungsten-containing materials. The process utilizes soak processes and vapor deposition processes to provide tungsten films having significantly improved surface uniformity while increasing the production level throughput. In one embodiment, a method is provided which includes depositing a tungsten silicide layer on the substrate by exposing the substrate to a continuous flow of a silicon precursor while also exposing the substrate to intermittent pulses of a tungsten precursor. The method further provides that the substrate is exposed to the silicon and tungsten precursors which have a silicon/tungsten precursor flow rate ratio of greater than 1, for example, about 2, about 3, or greater. Subsequently, the method provides depositing a tungsten nitride layer on the tungsten suicide layer, depositing a tungsten nucleation layer on the tungsten nitride layer, and depositing a tungsten bulk layer on the tungsten nucleation layer.

Abstract: Embodiments of the invention provide apparatuses for vapor depositing tungsten-containing materials, such as metallic tungsten and tungsten nitride. In one embodiment, a processing chamber is provided which includes a lid assembly containing a lid plate, a showerhead, a mixing cavity, a distribution cavity, and a resistive heating element contained within the lid plate. In one example, the resistive heating element is configured to provide the lid plate at a temperature within a range from about 120° C. to about 180° C., preferably, from about 140° C. to about 160° C., more preferably, from about 145° C. to about 155° C. The mixing cavity may be in fluid communication with a tungsten precursor source containing tungsten hexafluoride and a nitrogen precursor source containing ammonia. In some embodiments, a single processing chamber may be used to deposit metallic tungsten and tungsten nitride materials by CVD processes.

Abstract: Embodiments of the invention provide processes for vapor depositing tungsten-containing materials, such as metallic tungsten and tungsten nitride. In one embodiment, a method for forming a tungsten-containing material is provided which includes positioning a substrate within a processing chamber containing a lid plate, heating the lid plate to a temperature within a range from about 120° C. to about 180° C., exposing the substrate to a reducing gas during a pre-nucleation soak process, and depositing a first tungsten nucleation layer on the substrate during a first atomic layer deposition process within the processing chamber. The method further provides depositing a tungsten nitride layer on the first tungsten nucleation layer during a vapor deposition process, depositing a second tungsten nucleation layer on the tungsten nitride layer during a second atomic layer deposition process within the processing chamber, and exposing the substrate to another reducing gas during a post-nucleation soak process.

Abstract: A method for creating a refractory metal and refractory metal nitride cap effective for reducing copper electromigration and copper diffusion is described. The method includes depositing a refractory metal nucleation layer and nitriding at least the upper portion of the refractory metal layer to form a refractory metal nitride. Methods to reduce and clean the copper lines before refractory metal deposition are also described. Methods to form a thicker refractory metal layer using bulk deposition are also described.

Abstract: A tungsten nucleation film is formed on a surface of a semiconductor substrate by alternatively providing to that surface, reducing gases and tungsten-containing gases. Each cycle of the method provides for one or more monolayers of the tungsten film. The film is conformal and has improved step coverage, even for a high aspect ratio contact hole.

Abstract: Electronic components such as semiconductor wafer VLSI and ULSI integrated circuit devices are provided having a robust barrier layer in the device interconnects. The robust barrier layer provides excellent step coverage, low resistance and enhanced adhesion to CVD copper and the interconnect has a double structure of a layer of a barrier material and a metal layer thereon. The metal layer is preferably tungsten and is formed by replacing silicon or other such atoms on the surface of the barrier layer with tungsten metal. A layer of silicon can be formed on the barrier layer, silicon atoms can be formed on the surface by reacting the barrier layer with a silicon containing reactant or a silicon containing barrier layer can be used.

Abstract: A tungsten nucleation film is formed on a surface of a semiconductor substrate by alternatively providing to that surface, reducing gases and tungsten-containing gases. Each cycle of the method provides for one or more monolayers of the tungsten film. The film is conformal and has improved step coverage, even for a high aspect ratio contact hole.

Abstract: A method for creating a refractory metal and refractory metal nitride cap effective for reducing copper electromigration and copper diffusion is described. The method includes depositing a refractory metal nucleation layer and nitriding at least the upper portion of the refractory metal layer to form a refractory metal nitride. Methods to reduce and clean the copper lines before refractory metal deposition are also described. Methods to form a thicker refractory metal layer using bulk deposition are also described.

Abstract: A tungsten nucleation film is formed on a surface of a semiconductor substrate by alternatively providing to that surface, reducing gases and tungsten-containing gases. Each cycle of the method provides for one or more monolayers of the tungsten film. The film is conformal and has improved step coverage, even for a high aspect ratio contact hole.

Abstract: Electronic components such as semiconductor wafer VLSI and ULSI integrated circuit devices are provided having a robust barrier layer in the device interconnects. The robust barrier layer provides excellent step coverage, low resistance and enhanced adhesion to CVD copper and the interconnect has a double structure of a layer of a barrier material and a metal layer thereon. The metal layer is preferably tungsten and is formed by replacing silicon or other such atoms on the surface of the barrier layer with tungsten metal. A layer of silicon can be formed on the barrier layer, silicon atoms can be formed on the surface by reacting the barrier layer with a silicon containing reactant or a silicon containing barrier layer can be used.

Abstract: A semiconductor device for use in a memory cell includes an active matrix, a capacitor structure, formed on top of the active matrix, an intermediate dielectric (IMD) layer formed on the capacitor structure and a barrier layer formed on the IMD layer, wherein the barrier layer includes a TiO2 layer and an Al2O3 layer. Since the Al2O3 layer is obtained by oxidizing the Ti1-xAlxN layer, the Al2O3 layer has a structure very dense. Therefore, the barrier layer prevents a capacitor structure from hydrogen damages caused by the formation of another IMD layer or a passivation layer during the following processes.

Abstract: A method for forming a lower electrode structure of a capacitor of a semiconductor device, includes the steps of: forming an active region in a semiconductor substrate; forming an insulation layer atop the semiconductor substrate having the active region formed therein; forming a contact hole in the insulation layer, the contact hole exposing the active region; forming a conductive plug connected to the active region through the contact hole, the conductive plug having an upper contact surface; forming a silicide contact on the upper contact surface of the conductive plug; forming a lower electrode layer in electrical contact with the silicide contact, by depositing titanium aluminum nitride on the insulation layer; and patterning the lower electrode layer to form a lower electrode having an upper surface. A natural oxide film is prevented from generating between the interface of the plug and the lower electrode.

Abstract: There is provided a method for forming a metal line of a semiconductor device, in which a (TiAl)N layer having a lower reflectivity and permeability is formed as anti-reflective coating layer. Since the (TiAl)N anti-reflective coating layer effectively prevent a metal line from reflecting in lightening process using a shorter wavelength such as DUV, a fine metal line can be formed exactly.

Abstract: A semiconductor device for use in a memory cell includes an active matrix, a capacitor structure, formed on top of the active matrix, an intermediate dielectric (IMD) layer formed on the capacitor structure and a barrier layer formed on the IMD layer, wherein the barrier layer includes a TiO2 layer and an Al2O3 layer. Since the Al2O3 layer is obtained by oxidizing the Ti1-xAlxN layer, the Al2O3 layer has a structure very dense. Therefore, the barrier layer prevents a capacitor structure from hydrogen damages caused by the formation of another IMD layer or a passivation layer during the following processes.

Abstract: The present invention relates to a method for manufacturing a semiconductor device having a gate electrode (e.g. tungsten gate electrode) of low resistivity. In the method for manufacturing a semiconductor device, a conductive sacrifice polysilicon pattern is formed on a gate insulating film and then a first interlayer insulating film is deposited. The first interlayer insulating film is blank-etched so as to expose the surface of the sacrifice polysilicon pattern and then the exposed sacrifice polysilicon pattern is etched to form a recessed profile, in which, in the recessed portion, a predetermined thickness of sacrifice polysilicon pattern remains. On the surface of the remnant sacrifice polysilicon pattern in the recessed portion a metal film (e.g. a tungsten film) is selectively deposited. When selectively depositing of the metal film, most of remnant sacrifice polysilicon pattern is consumed.

Abstract: A method for fabricating a capacitor of a semiconductor memory device includes forming a titanium aluminum nitride layer, satisfying Ti1-xAlxN, where x<1, as a diffusion inhibiting film on a platinum upper layer for forming the capacitor's upper electrode.

Abstract: A bit line of a semiconductor device capable of obtaining low line resistance and low contact resistance, thereby achieving an improvement in the operating speed and reliability of the semiconductor device. The bit line has a multilayer structure including a Ti film, an MOCVD-TiN film and a W film sequentially formed over the semiconductor substrate. The MOCVD-TiN film serves as a diffusion barrier to suppress a reaction of tungsten, which forms the bit line, with silicon existing on a contact region during a thermal process at a high temperature such as a BPSG reflow.

Abstract: A method for fabricating a semiconductor device, wherein, when a blanket of the planarization layer is deposited and thermally treated for its reflow after the formation of a metal gate electrode consisting of a CVD-TiN layer pattern and a W layer pattern on a semiconductor substrate, a gate oxide is formed at the interface between the CVD-TiN layer and the semiconductor substrate by the reaction of the moisture absorbed in the CVD-TiN layer with the Si of the substrate, without executing an additional process and, thus, the stress between the gate oxide and the metal layer is not high, so that the gate oxide can be prevented from being degraded, and the production yield and the reliability of device operation is improved.