Patents by Inventor Sang Ki Kim
Sang Ki Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11858149Abstract: A robot may include an input interface configured to obtain an image of a surrounding environment of the robot, and at least one processor configured to rotate the robot in place for localization, and estimate at least one of a position or a pose in a space, based on a plurality of sequential images obtained by the input interface during the rotation of the robot. The position or the pose of the robot may be estimated based on inputting the plurality of sequential images obtained during the rotation of the robot into a trained model based on an artificial neural network. In a 5G environment connected for the Internet of Things, embodiments of the present disclosure may execute an artificial intelligence algorithm and/or a machine learning algorithm.Type: GrantFiled: November 16, 2020Date of Patent: January 2, 2024Assignee: LG ELECTRONICS INC.Inventors: Sookhyun Yang, Jungsik Kim, Jinuh Joo, Hyoungrock Kim, Sang Ki Kim, Minjung Kim, Moonsik Nam, Gyuho Eoh, Donghak Lee
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Publication number: 20230317532Abstract: A semiconductor device includes a substrate with first and second surfaces, a first test pad on the first surface of the substrate, a first bump pad on the first surface of the substrate and spaced apart from the first test pad in a first direction, a second bump pad on the first surface of the substrate and spaced apart from the first bump pad, a second test pad on the first surface of the substrate and spaced apart from the second bump pad in the first direction, a first wiring layer in the first direction and electrically connecting the first test pad to the first bump pad, a second wiring layer in the first direction, spaced apart from the first wiring layer, and electrically connecting the second test pad to the second bump pad, and a first bump connected to each of the first and second bump pads.Type: ApplicationFiled: November 15, 2022Publication date: October 5, 2023Inventors: Il Geun JUNG, Sung Jin KIM, Sang-Ki KIM, Joong Won SHIN, Sung Yun WOO, Sang Hyeon JEON, Ji Min CHOI
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Patent number: 11481655Abstract: This present invention relates to a system for processing distributed intelligent information, and discloses a method that when there are no actions beyond the threshold value among the analyzed actions, a virtual global workspace (GW) is formed, the global workspace including one or more thinking devices, and the thinking device operates as a first type device or a second type device, in which an action alternative is requested for the global workspace in the case of operating as the first type device, and an action solution is proposed for the global workspace in the case of operating as the second type device.Type: GrantFiled: November 27, 2019Date of Patent: October 25, 2022Assignee: Electronics and Telecommunications Research InstituteInventors: Sang Ki Kim, Sun Me Kim
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Patent number: 11466807Abstract: An insulation device for a low-temperature pipe according to the present disclosure includes: a pair of primary insulation materials surrounding a first radially outer surface and a second radially outer surface of the pipe; a pair of secondary insulation materials surrounding outer surfaces of the primary insulation materials; a pair of tertiary insulation materials surrounding outer surfaces of the secondary insulation materials; a pair of finishing covers surrounding outer surfaces of the tertiary insulation materials; an out-profile coupled to each of the finishing covers so as to surround each of widthwise opposite ends of the finishing cover; and an in-profile coupled to each of the finishing covers so as to surround each of lengthwise opposite ends of the finishing cover, wherein the pair of secondary insulation materials are configured such that each of opposed contact surfaces thereof is formed in a shape bent at least one time.Type: GrantFiled: October 16, 2019Date of Patent: October 11, 2022Assignee: DONG IN ENGINEERING CO., LTD.Inventor: Sang Ki Kim
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Publication number: 20220228695Abstract: An insulation device for a low-temperature pipe according to the present disclosure includes: a pair of primary insulation materials surrounding a first radially outer surface and a second radially outer surface of the pipe; a pair of secondary insulation materials surrounding outer surfaces of the primary insulation materials; a pair of tertiary insulation materials surrounding outer surfaces of the secondary insulation materials; a pair of finishing covers surrounding outer surfaces of the tertiary insulation materials; an out-profile coupled to each of the finishing covers so as to surround each of widthwise opposite ends of the finishing cover; and an in-profile coupled to each of the finishing covers so as to surround each of lengthwise opposite ends of the finishing cover, wherein the pair of secondary insulation materials are configured such that each of opposed contact surfaces thereof is formed in a shape bent at least one time.Type: ApplicationFiled: October 16, 2019Publication date: July 21, 2022Inventor: Sang Ki KIM
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Publication number: 20210229291Abstract: A robot may include an input interface configured to obtain an image of a surrounding environment of the robot, and at least one processor configured to rotate the robot in place for localization, and estimate at least one of a position or a pose in a space, based on a plurality of sequential images obtained by the input interface during the rotation of the robot. The position or the pose of the robot may be estimated based on inputting the plurality of sequential images obtained during the rotation of the robot into a trained model based on an artificial neural network. In a 5G environment connected for the Internet of Things, embodiments of the present disclosure may execute an artificial intelligence algorithm and/or a machine learning algorithm.Type: ApplicationFiled: November 16, 2020Publication date: July 29, 2021Inventors: Sookhyun YANG, Jungsik Kim, Jinuh Joo, Hyoungrock Kim, Sang Ki Kim, Minjung Kim, Moonsik Nam, Gyuho Eoh, Donghak Lee
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Patent number: 11070639Abstract: A network infrastructure system implements data sharing and processing by using a network infrastructure to which an application terminal or application server constituting an application domain is connected in a shared manner, includes a plurality of network infrastructure nodes storing, processing, sharing data, wherein each of the plurality of network infrastructure nodes includes a data processing module including a data transfer function, a data distribution function, a data processing function, and a data sharing function which are provided to at least one of the application terminal and the application server.Type: GrantFiled: September 14, 2018Date of Patent: July 20, 2021Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Sun Me Kim, Nam Seok Ko, Sang Ki Kim, Sung Hyuk Byun, Dong Il Seo, Jea Hoon Yu, Tae Whan Yoo, Seung Hyun Yoon, Sang Ho Lee
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Patent number: 11010124Abstract: Disclosed are a sound source focus method and device in which the sound source focus device, in a 5G communication environment by amplifying and outputting a sound source signal of a user's object of interest extracted from an acoustic signal included in video content by executing a loaded artificial intelligence (AI) algorithm and/or machine learning algorithm. The sound source focus method includes playing video content including a video signal including at least one moving object and the acoustic signal in which sound sources output by the object are mixed, determining the user's object of interest from the video signal, acquiring unique sound source information about the user's object of interest, extracting an actual sound source for the user's object of interest corresponding to the unique sound source information from the acoustic signal, and outputting the actual sound source extracted for the user's object of interest.Type: GrantFiled: December 4, 2019Date of Patent: May 18, 2021Assignee: LG ELECTRONICS INC.Inventors: Sang Ki Kim, Yongchul Park, Sungmin Han, Siyoung Yang, Juyeong Jang, Minook Kim
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Publication number: 20210096810Abstract: Disclosed are a sound source focus method and device in which the sound source focus device, in a 5G communication environment by amplifying and outputting a sound source signal of a user's object of interest extracted from an acoustic signal included in video content by executing a loaded artificial intelligence (AI) algorithm and/or machine learning algorithm. The sound source focus method includes playing video content including a video signal including at least one moving object and the acoustic signal in which sound sources output by the object are mixed, determining the user's object of interest from the video signal, acquiring unique sound source information about the user's object of interest, extracting an actual sound source for the user's object of interest corresponding to the unique sound source information from the acoustic signal, and outputting the actual sound source extracted for the user's object of interest.Type: ApplicationFiled: December 4, 2019Publication date: April 1, 2021Applicant: LG ELECTRONICS INC.Inventors: Sang Ki KIM, Yongchul PARK, Sungmin HAN, Siyoung YANG, Juyeong JANG, Minook KIM
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Publication number: 20210082421Abstract: Disclosed are a speech processing method and a speech processing apparatus, characterized in that a speech processing is carried out by executing an artificial intelligence (AI) algorithm and/or a machine learning algorithm, such that the speech processing apparatus, a user terminal, and a server can communicate with each other in a 5G communication environment. The speech processing method according to one exemplary embodiment of the present invention includes converting a response text, which is generated in response to a spoken utterance of a user, to a spoken response utterance, obtaining external situation information while outputting the spoken response utterance, generating a dynamic spoken response utterance by converting the spoken response utterance on the basis of the external situation information, and outputting the dynamic spoken response utterance.Type: ApplicationFiled: November 6, 2019Publication date: March 18, 2021Applicant: LG ELECTRONICS INC.Inventors: Sang Ki KIM, Yongchul PARK, Minook KIM, Siyoung YANG, Juyeong JANG, Sungmin HAN
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Publication number: 20200167676Abstract: This present invention relates to a system for processing distributed intelligent information, and discloses a method that when there are no actions beyond the threshold value among the analyzed actions, a virtual global workspace (GW) is formed, the global workspace including one or more thinking devices, and the thinking device operates as a first type device or a second type device, in which an action alternative is requested for the global workspace in the case of operating as the first type device, and an action solution is proposed for the global workspace in the case of operating as the second type device.Type: ApplicationFiled: November 27, 2019Publication date: May 28, 2020Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Sang Ki KIM, Sun Me KIM
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Publication number: 20200043495Abstract: A method for performing multi-language communication includes receiving an utterance, identifying a language of the received utterance, determining whether the identified language matches a preset reference language, applying, to the received utterance, an interpretation model interpreting the identified language into the reference language when the identified language does not match the reference language, changing, to text, speech data which is outputted in the reference language as a result of applying the interpretation model, generating a response message responding to the text of the speech data, and outputting the response message. Here, the interpretation model may be a deep neural network model generated through machine learning, and the interpretation model may be stored in an edge device or provided through a server in an Internet of things environment through a 5G network.Type: ApplicationFiled: October 15, 2019Publication date: February 6, 2020Inventors: Yongchul PARK, Minook KIM, Sang Ki KIM, Siyoung YANG, Juyeong JANG, Sungmin HAN
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Publication number: 20190098104Abstract: A network infrastructure system implements data sharing and processing by using a network infrastructure to which an application terminal or application server constituting an application domain is connected in a shared manner, includes a plurality of network infrastructure nodes storing, processing, sharing data, wherein each of the plurality of network infrastructure nodes includes a data processing module including a data transfer function, a data distribution function, a data processing function, and a data sharing function which are provided to at least one of the application terminal and the application server.Type: ApplicationFiled: September 14, 2018Publication date: March 28, 2019Inventors: Sun Me KIM, Nam Seok KO, Sang Ki KIM, Sung Hyuk BYUN, Dong Il SEO, Jea Hoon YU, Tae Whan YOO, Seung Hyun YOON, Sang Ho LEE
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Patent number: 10242293Abstract: Provided are a method and program for computing a bone age using a deep neural network. The method for computing a bone age using a deep neural network, including: receiving an analysis target image that is a specific medical image to compute the bone age; and analyzing the analysis target image by at least one computer using the deep neural network to compute the bone age. According to the present disclosure, since the bone age is computed by accumulating medical images of a specific race (particularly, Korean) and analyzing the same, it is possible to compute an accurate bone age that conforms to race.Type: GrantFiled: December 30, 2015Date of Patent: March 26, 2019Assignees: The Asan Foundation, Vuno, Inc.Inventors: Woo Hyun Shim, Jin Seong Lee, Yu Sub Sung, Hee Mang Yoon, Jung Hwan Baek, Sang Ki Kim, Hyun Jun Kim, Ye Ha Lee, Kyu Hwan Jung
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Patent number: 10090266Abstract: A semiconductor device includes a semiconductor chip having a semiconductor substrate with chip and boundary regions, and an integrated circuit on the chip region. A center pad is provided on the chip region and on the integrated circuit, and a boundary pad is provided on the boundary region. The semiconductor device further includes a first lower insulating structure having a contact hole exposing the center pad, a second lower insulating structure, at the same vertical level as the first lower insulating structure, and having a first opening exposing the boundary pad to an outside of the first lower insulating structure, a conductive pattern including a contact portion, a conductive line portion, and a bonding pad portion, and an upper insulating structure formed on the first lower insulating structure and the conductive pattern and having a second opening exposing the bonding pad portion to the outside of the semiconductor chip.Type: GrantFiled: July 8, 2016Date of Patent: October 2, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ae-Hee Choi, Sang-ki Kim, Ahyun Jo, Kyo-Seon Choi
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Publication number: 20180232603Abstract: Provided are a method and program for computing a bone age using a deep neural network. The method for computing a bone age using a deep neural network, including: receiving an analysis target image that is a specific medical image to compute the bone age; and analyzing the analysis target image by at least one computer using the deep neural network to compute the bone age. According to the present disclosure, since the bone age is computed by accumulating medical images of a specific race (particularly, Korean) and analyzing the same, it is possible to compute an accurate bone age that conforms to race.Type: ApplicationFiled: December 30, 2015Publication date: August 16, 2018Inventors: Woo Hyun Shim, Jin Seong Lee, Yu Sub Sung, Hee Mang Yoon, Jung Hwan Baek, Sang Ki Kim, Hyun Jun Kim, Ye Ha Lee, Kyu Hwan Jung
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Patent number: 9911688Abstract: A semiconductor device includes a semiconductor chip substrate with a chip region and a scribe lane region, center and boundary pads respectively provided on the chip and scribe lane regions, a lower insulating structure provided on the chip region and the scribe lane region, a first conductive pattern including a contact portion, a conductive line portion, and a bonding pad portion, and an upper insulating structure defining first and second openings formed on the bonding pad portion and the boundary pad. The lower insulating structure includes a plurality of lower insulating layers, which are sequentially stacked on the substrate, and each of which is a silicon-containing inorganic layer.Type: GrantFiled: July 5, 2016Date of Patent: March 6, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyo-Seon Choi, Seungmo Kang, Sang-ki Kim, Yooncheol Bang
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Publication number: 20170062387Abstract: The semiconductor chip may include an integrated circuit on a substrate, center pad on the substrate and electrically connected to the integrated circuit, lower insulating structure on the center pad and having a contact hole exposing the center pad, redistribution layer including a conductive pattern and a barrier pattern, the barrier pattern between the lower insulating structure and the conductive pattern, the conductive patter including a contact portion filling the contact hole, bonding pad portion, and conductive line portion on the lower insulating structure and connecting the contact portion to the bonding pad portion, and an upper insulating structure on the redistribution layer and having a first opening defined therein, the first opening exposing the bonding pad portion. The upper insulating structure may include an upper insulating layer covering the lower insulating structure and the redistribution layer and a polymer layer on the upper insulating layer.Type: ApplicationFiled: July 7, 2016Publication date: March 2, 2017Applicant: Samsung Electronics Co., Ltd.Inventors: Seokwoo HONG, Sang-ki KIM, Kyo-Seon CHOI, Ae-Hee CHOI
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Publication number: 20170062363Abstract: A semiconductor device includes a semiconductor chip having a semiconductor substrate with chip and boundary regions, and an integrated circuit on the chip region. A center pad is provided on the chip region and on the integrated circuit, and a boundary pad is provided on the boundary region. The semiconductor device further includes a first lower insulating structure having a contact hole exposing the center pad, a second lower insulating structure , at the same vertical level as the first lower insulating structure, and having a first opening exposing the boundary pad to an outside of the first lower insulating structure, a conductive pattern including a contact portion, a conductive line portion, and a bonding pad portion, and an upper insulating structure formed on the first lower insulating structure and the conductive pattern and having a second opening exposing the bonding pad portion to the outside of the semiconductor chip.Type: ApplicationFiled: July 8, 2016Publication date: March 2, 2017Inventors: Ae-Hee CHOI, Sang-ki KIM, Ahyun JO, Kyo-Seon CHOI
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Publication number: 20170062321Abstract: A semiconductor device includes a semiconductor chip substrate with a chip region and a scribe lane region, center and boundary pads respectively provided on the chip and scribe lane regions, a lower insulating structure provided on the chip region and the scribe lane region, a first conductive pattern including a contact portion, a conductive line portion, and a bonding pad portion, and an upper insulating structure defining first and second openings formed on the bonding pad portion and the boundary pad. The lower insulating structure includes a plurality of lower insulating layers, which are sequentially stacked on the substrate, and each of which is a silicon-containing inorganic layer.Type: ApplicationFiled: July 5, 2016Publication date: March 2, 2017Inventors: Kyo-Seon CHOI, SEUNGMO KANG, Sang-ki KIM, Yooncheol BANG