Abstract: A method of manufacturing a semiconductor device includes forming an active pattern and a gate electrode crossing the active pattern on a substrate, forming a first contact connected to the active pattern at a side of the gate electrode, forming a second contact connected to the gate electrode, and forming a third contact connected to the first contact at the side of the gate electrode. The third contact is formed using a photomask different from that used to form the first contact. A bottom surface of the third contact is disposed at a level in the device lower than the level of a top surface of the first contact.

Abstract: Provided is a method of fabricating a semiconductor device with a field effect transistor. The method may include forming a first gate electrode and a second gate electrode extending substantially parallel to each other and each crossing a PMOSFET region on a substrate and an NMOSFET region on the substrate; forming an interlayered insulating layer covering the first gate electrode and the second gate electrode; patterning the interlayered insulating layer to form a first sub contact hole on the first gate electrode, the first sub contact hole being positioned between the PMOSFET region and the NMOSFET region, when viewed in a plan view; and patterning the interlayered insulating layer to form a first gate contact hole and to expose a top surface of the second gate electrode, wherein the first sub contact hole and the first gate contact hole form a single communication hole.

Abstract: An integrated circuit (IC) may include at least one cell including a plurality of conductive lines that extend in a first direction and are in parallel to each other in a second direction that is perpendicular to the first direction, first contacts respectively disposed at two sides of at least one conductive line from among the plurality of conductive lines, and a second contact disposed on the at least one conductive line and the first contacts and forming a single node by being electrically connected to the at least one conductive line and the first contacts.

Abstract: A method of generating a photo mask for use during fabrication of a semiconductor device includes; generating an initial layout design including critical circuit paths and non-critical circuit paths by shielding all gate line patterns used to implement transistors in the critical circuits and non-critical circuits, and thereafter generating a layout design from the initial layout design by selectively un-shielding a non-critical gate line pattern among the gate line patterns used to implement a gate of a non-critical transistor in a non-critical circuit, while retaining the shielding of all critical gate line patterns among the gate line patterns.

Abstract: A method of manufacturing an integrated circuit, a system for carrying out the method, and a system for verifying an integrated circuit may use a standard cell layout including a first layout region that may violate design rules. The method for designing an integrated circuit may comprise receiving a data file that includes a scaling enhanced circuit layout, and designing a first standard cell layout using design rules and the data file. The designing the first standard cell layout may include designing a first layout region of the first standard cell layout using the data file, and designing a second region of the first standard cell layout using the design rules.

Abstract: A layout design system for designing a semiconductor device includes a processor, a storage module storing an intermediate design, and a correction module used by the processor to correct the intermediate design. The intermediate design includes an active region and dummy designs on the active region. Each dummy design includes a dummy structure and dummy spacers disposed at opposite sides of the dummy structure. The correction module is configured to alter widths of regions of at least some of the dummy designs. The corrected design is used to produce a semiconductor device having an active fin, a hard mask layer disposed on the active fin, a gate structure crossing the over the hard mask layer, and a spacer disposed on at least one side of the gate structure. The hard mask layer, and the active fin, are provided with widths that vary due to the dummy designs.

Abstract: A layout design system includes a processor; a storage unit configured to store a first unit design having a first area, wherein in the first unit design, a termination is not placed on a border thereof; and a design module configured to generate a second unit design having a second area larger than the first area by placing the termination on a border of the first unit.

Abstract: A semiconductor integrated circuit (IC) may comprise at least one cell comprising at least one fin field-effect transistor (FET). The at least one cell may comprise a plurality of fins that extend in a first direction and are arranged in parallel to each other in a second direction that is perpendicular to the first direction. A size of the at least one cell in the second direction may correspond to a number and a pitch of the plurality of fins.

Abstract: A manipulation lever assembly for a trunk lid may include a manipulation lever including a connection portion wherein the connection portion is pivotally coupled to the trunk lid; and an actuation member, one end portion of which is coupled to a first end portion of the manipulation lever and the other end portion of which is coupled to a locking assembly of the trunk lid, wherein when the locking assembly is unlocked, the actuation member activates the manipulation lever, so that a second end of the manipulation lever is extracted outwards from the trunk lid.