Abstract: Disclosed is a composition for a silica-based insulation layer including hydrogenated polysilazane or hydrogenated polysiloxzane, wherein a concentration of a cyclic compound having a weight average molecular weight of less than 400 is less than or equal to 1,200 ppm. The composition for a silica-based insulation layer may reduce a thickness distribution during formation of a silica-based insulation layer, and thereby film defects after chemical mechanical polishing (CMP) during a semiconductor manufacturing process may be reduced.

Abstract: A method of fabricating an integrated circuit device may include forming a polishing stop layer and a semiconductor layer on a substrate, and selectively polishing the semiconductor layer from a surface which simultaneously exposes the polishing stop layer and the semiconductor layer, by using a slurry composition including a compound composition and polishing particles. The compound composition may include a sulfonate compound and a terminal amine group-including compound.

Abstract: In a method of manufacturing a semiconductor device, mask patterns are formed on a semiconductor substrate. An organic layer is formed on the semiconductor substrate to cover the mask patterns. An upper portion of the organic layer is planarized using a polishing composition. The polishing composition includes an oxidizing agent and is devoid of abrasive particles.

Abstract: A polishing composition includes abrasive particles, a pyrrolidone containing a hydrophilic group, a dispersing agent, a first dishing inhibitor including polyacrylic acid, and a second dishing inhibitor including a non-ionic polymer.

Abstract: A polymer includes a structural unit represented by Chemical Formula 1 and an organic layer composition including the same. wherein in Chemical Formula 1, A is a carbon cyclic group including at least one hetero atom, B is one of groups in Group 1, where Ar1 to Ar4, R11 to R14, L and m are as defined in the specifiction and * is a linking point.

Abstract: The present invention discloses a photosensitive resin composition for an insulating film of a display device including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a color material having a maximum absorption wavelength of 400 to 550 nm; and (D) a solvent, an insulation film using the same, and a display device including the insulation film.

Abstract: Disclosed is a method and apparatus for constructing and playing a sensory effect media data file, which includes information on sensory effects. A method for constructing a sensory effect media data file according to an embodiment of the present invention includes: inserting first composition information, which represents a property of media data, into a composition information container field; inserting second composition information, which represents a property of sensory effect data, into the composition information container field; inserting a sample of the media data into a media data field, where the sample represents data associated with a timestamp; and inserting a sample of the sensory effect data into the media data field.

Abstract: A sample rate converter and a method of converting a sample rate are disclosed herein. The sample rate converter includes a data delay unit, a clock rate conversion unit, a Lagrange polynomial filter unit, a resample position calculation unit, and a resample position compensation unit. The data delay unit delays signals in response to an input clock signal. The clock rate conversion unit converts the sample rate of the signals. The Lagrange polynomial filter unit performs a filtering function on the signals whose rate has been converted. The resample position calculation unit outputs the value (Dint, dfrac) of the resample position of the signals based on a set resample ratio value. The resample position compensation unit corrects the error value of the signals by applying the value (Dint, dfrac) to the signals, and outputs a final signal.

Abstract: An apparatus and method for producing a makeup avatar is disclosed. The apparatus may include a spectrum information metadata generating unit to generate spectrum information metadata, based on skin spectrum information of a user and cosmetics spectrum information related to makeup, a makeup information generating unit to receive, from the user, a makeup avatar to which makeup is applied through a user terminal, and to generate makeup information of the makeup avatar, a control information determining unit to determine control information for controlling a makeup status of the makeup avatar, based on the makeup information and the spectrum information metadata, and a makeup avatar metadata generating unit to generate makeup avatar metadata, based on spectrum information metadata corresponding to the control information and the makeup information.

Abstract: A composition for forming a silica based layer includes a silicon-containing compound including polysilazane, polysiloxazane, or a combination thereof and one or more kinds of solvent, and having a turbidity increasing rate of less than or equal to about 0.13.

Abstract: A hardmask composition includes a polymer including a moiety represented by the following Chemical Formula 1 and a solvent. In the above Chemical Formula 1, A and B are as defined in the specification.

Abstract: A cleaning composition includes an organic solvent, an organic acid, a chelating agent, a surfactant containing at least one hydroxyl group (OH) at the end, and an ultra pure water, wherein a pH value of the cleaning composition is equal to or higher than 12.

Abstract: A chemical mechanical polishing (CMP) slurry composition for polishing an organic layer and a method of forming a semiconductor device using the same are disclosed. The CMP slurry composition may include from 0.001% to 5% by weight of oxide-polishing particles; from 0.1% to 5% by weight of an oxidant; from 0% to 5% by weight of a polishing regulator; from 0% to 3% by weight of a surfactant; from 0% to 3% by weight of a pH regulator; and from 79% to 99.889% by weight of deionized water. The use of the CMP slurry composition makes it possible to allow a silicon-free organic layer to be polished with a selectivity higher than 6:1 with respect to an oxide layer.

Abstract: A rinse liquid for an insulation layer, the rinse liquid including a solvent represented by the following Chemical Formula 1:

Abstract: A method of fabricating a semiconductor device includes forming an active region in a semiconductor substrate, forming a plurality of dummy gates on the active region, the plurality of dummy gates having a gate mask disposed thereon, forming an interlayer insulating layer on the gate mask, and performing a one-time chemical mechanical polishing (CMP) process by using a slurry composition capable of polishing the interlayer insulating layer and the gate mask until top surfaces of the dummy gates are exposed.

Abstract: A sample rate converter and a method of converting a sample rate are disclosed herein. The sample rate converter includes a data delay unit, a clock rate conversion unit, a Lagrange polynomial filter unit, a resample position calculation unit, and a resample position compensation unit. The data delay unit delays signals in response to an input clock signal. The clock rate conversion unit converts the sample rate of the signals. The Lagrange polynomial filter unit performs a filtering function on the signals whose rate has been converted. The resample position calculation unit outputs the value (Dint, dfrac) of the resample position of the signals based on a set resample ratio value. The resample position compensation unit corrects the error value of the signals by applying the value (Dint, dfrac) to the signals, and outputs a final signal.

Abstract: A digital RF receiver does not use a separate receiver according to a mode and a band for multi-mode reception, MIMO reception, and bandwidth extension reception, and changes only setting variables in a single receiver structure so as to implement multi-mode reception, MIMO reception, bandwidth extension reception, and/or simultaneous multi-mode operation, such that complexity of the receiver, development cost, and power consumption can be reduced.

Abstract: A resist underlayer composition and a method of manufacturing a semiconductor integrated circuit device, the composition including a solvent and an organosilane polymer, the organosilane polymer being a condensation polymerization product of at least one first compound represented by Chemical Formulae 1 and 2 and at least one second compound represented by Chemical Formulae 3 to 5.

Abstract: Embodiments provide a digital RF receiver including a signal converting unit which converts an RF signal received from an external device into a digital signal, a plurality of functional modules which processes the digital signal in accordance with a predetermined algorithm when the digital signal is input, and a signal processing controller which selects at least one of the plurality of functional modules to control the digital signal to be processed in consideration of whether an IF signal component is included in the digital signal or a sampling rate related with sampling information of the digital signal.

Abstract: Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin selected from a polybenzoxazole precursor, a polyimide precursor, and a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) an organic dye and (E) a solvent, wherein the organic dye (D) includes at least one red dye having an absorption wavelength of 590 to 700 nm, at least one yellow dye having an absorption wavelength of 550 to 590 nm, and at least one blue dye having an absorption wavelength of 450 to 500 nm.