Patents by Inventor Sang Min Song

Sang Min Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100255221
    Abstract: Disclosed is a polyimide film, which is colorless and transparent, with superior mechanical properties and high thermal stability.
    Type: Application
    Filed: August 27, 2008
    Publication date: October 7, 2010
    Applicant: KOLON INDUSTRIES, INC.
    Inventors: Hak Gee Jung, Hyo Jun Park, Sang Min Song, Chung Seock Kang
  • Publication number: 20090069532
    Abstract: Disclosed herein is a polyimide film having an elongation from 50 to 150%, a tensile elastic modulus from 4 to 8 GPa, a tensile strength from 150 to 500 MPa, and a hygroscopicity of 5% or less. The polyimide film has high elastic modulus and tensile strength and an excellent elongation, and thus the polyimide film exhibits excellent material properties when it is used as a base film for TAB and COF, and its properties can be usefully modified using an additive to improve productivity and processibility thereof.
    Type: Application
    Filed: January 16, 2007
    Publication date: March 12, 2009
    Applicant: Kolon Industries, Inc.
    Inventors: Chan Jae Ahn, Sang Min Song, Chung Seock Kang
  • Publication number: 20090054576
    Abstract: Disclosed are an intermediate transfer belt for use in a laser printer, a fax machine and a copier, and a production method thereof. Specifically, an intermediate transfer belt including silicone modified polyimide resin and a production method thereof are provided, thereby realizing a monolayer intermediate transfer belt having excellent electrical properties, water repellency and heat dissipation properties and good mechanical strength. Further, even without the additional use of an adhesive layer for adhesion to a fluorine resin layer and fluorine resin, the intermediate transfer belt can exhibit satisfactory properties, and process efficiency can be maximized.
    Type: Application
    Filed: January 3, 2007
    Publication date: February 26, 2009
    Applicant: KOLON INDUSTRIES, INC.
    Inventors: Hyo Jun Park, Chae Hyun Lim, Chung Seock Kang, Sang Min Song
  • Patent number: 6531564
    Abstract: A water-soluble polymeric adhesion promoter is represented by the following formula (I): wherein R is a hydrogen atom, a hydroxyl group or a lower alkyl group having 1 to 4 carbon atoms, and m and k are numbers selected such that m/k is in the range from about 1/0.001 to about 1/0.1, and such that that the polymer (I) has a weight average molecular weight of about 3,000 to about 600,000.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: March 11, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Se Yong Oh, Chan Eon Park, Sang Min Song
  • Publication number: 20020161151
    Abstract: A water-soluble polymeric adhesion promoter is represented by the following formula (I): 1
    Type: Application
    Filed: June 28, 2002
    Publication date: October 31, 2002
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Se Yong Oh, Chan Eon Park, Sang Min Song
  • Patent number: 6468664
    Abstract: The present invention relates to a poly(imide-siloxane) compound useful as passivation layer for packaging tapeless LOC, which is produced by reacting in a polar solvent a diaminosiloxane compound of the formula(1) wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, and R10 are independently an aromatic group, aliphatic group or halogenated hydrocarbon, hydroxy, or ether group, and m and n are integers such that m+n is an integer of 0˜1000; and a diamine compound of the formula(2) H2N—R—NH2   (2) wherein R is at least one selected from the below groups: with an aromatic tetracarboxylic dianhydride of the formula (3) wherein A is at least one selected from the below groups: wherein the number of moles of the compound (3) is the same as the total number of moles of compounds (1) and (2).
    Type: Grant
    Filed: October 18, 2000
    Date of Patent: October 22, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chan Eon Park, Jin Ho Kang, Sang Min Song, Young Tak Ahn, Jae Geun Park, Myung Sup Jung
  • Patent number: 6455654
    Abstract: A water-soluble polymeric adhesion promoter is represented by the following formula (I): wherein R is a hydrogen atom, a hydroxyl group or a lower alkyl group having 1 to 4 carbon atoms, and m and k are numbers selected such that m/k is in the range from about 1/0.001 to about 1/0.1, and such that that the polymer (I) has a weight average molecular weight of about 3,000 to about 600,000.
    Type: Grant
    Filed: January 18, 2001
    Date of Patent: September 24, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Se Yong Oh, Chan Eon Park, Sang Min Song
  • Publication number: 20020035222
    Abstract: A water-soluble polymeric adhesion promoter is represented by the following formula (I): 1
    Type: Application
    Filed: January 18, 2001
    Publication date: March 21, 2002
    Inventors: Se Yong Oh, Chan Eon Park, Sang Min Song