Patents by Inventor Sang Ran Koh

Sang Ran Koh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10020185
    Abstract: A composition for forming a silica layer including a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 70,000 and a polydispersity index of about 5.0 to about 17.0 and a solvent; a silica layer manufactured using the same; and an electronic device including the silica layer.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: July 10, 2018
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Hui-Chan Yun, Woo-Han Kim, Sang-Ran Koh, Taek-Soo Kwak, Bo-Sun Kim, Jin-Gyo Kim, Yoong-Hee Na, Kun-Bae Noh, Sae-Mi Park, Jin-Hee Bae, Jun Sakong, Eun-Seon Lee, Wan-Hee Lim, Jun-Young Jang, Il Jung, Byeong-Gyu Hwang
  • Patent number: 9695287
    Abstract: A curable organo polysiloxane composition, an encapsulant, and an electronic device, the composition including at least one compound represented by the following Chemical Formula 1 and having a number average molecular weight of less than about 4,000, at least one first siloxane compound including a silicon-bonded hydrogen; and at least one second siloxane compound including a silicon-bonded alkenyl group:
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: July 4, 2017
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Hong-Jung Yoo, Sang-Ran Koh, Young-Ho Kim, Woo-Han Kim, Dong-Ju Shin
  • Patent number: 9657143
    Abstract: Disclosed are a curable polysiloxane composition for an optical device includes at least one of a first siloxane compound represented by the following Chemical Formula 1, at least one of a second siloxane compound having silicon-bonded hydrogen (Si—H) at the terminal end, and at least one of a third siloxane compound having a silicon-bonded alkenyl group (Si-Vi) at the terminal end, an encapsulant obtained by curing the curable polysiloxane composition for an optical device, and an optical device including the encapsulant. (R1R2R3SiO1/2)M1(R4R5SiO2/2)D1(R6R7SiO2/2)D2(R8SiO2/2—Y1—SiO2/2R9)D3(R10SiO3/2)T1(R11SiO3/2)T2(R12SiO3/2)T3(SiO3/2—Y2—SiO3/2)T4(SiO4/2)Q1??[Chemical Formula 1] In the above Chemical Formula 1, R1 to R12, Y1, Y2, M1, D1, D2, D3, T1, T2, T3, T4 and Q1 are the same as defined in the specification.
    Type: Grant
    Filed: December 24, 2013
    Date of Patent: May 23, 2017
    Assignee: Cheil Industries, Inc.
    Inventors: Young-Ho Kim, Sang-Ran Koh, Woo-Han Kim, Hong-Jung Yoo, Eun-Seon Lee, Ha-Neul Kim, Yun-Hee Baek, Doo-Ri Song, Dong-Ju Shin, Chi-Won An
  • Patent number: 9441111
    Abstract: Disclosed are a composition for an encapsulant that includes a first polysiloxane including a moiety represented by Chemical Formula 1 and an alkenyl group bound to silicon (Si—Vi) at the terminal end and a second polysiloxane including hydrogen bound to silicon (Si—H) at the terminal end, an encapsulant obtained by curing the composition for an encapsulant, and an electronic element including the encapsulant.
    Type: Grant
    Filed: November 29, 2013
    Date of Patent: September 13, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Sang-Ran Koh, Woo-Han Kim, Chang-Soo Woo, Ha-Neul Kim, Chi-Won An, Eun-Seon Lee
  • Publication number: 20160172188
    Abstract: A rinse solution for a silica thin film includes trimethylbenzene, diethylbenzene, indane, indene, tert-butyl toluene, methylnaphthalene, a mixture including an aromatic hydrocarbon having 12 or more carbon atoms, a mixture including an aliphatic hydrocarbon having 12 or more carbon atoms, a mixture including a hetero hydrocarbon compound including a phenyl group and an oxygen atom, or a combination thereof.
    Type: Application
    Filed: June 29, 2015
    Publication date: June 16, 2016
    Inventors: Wan-Hee Lim, Il Jung, Sang-Ran Koh, Woo-Han Kim, Ha-Neul Kim, Hui-Chan Yun, Han-Song Lee
  • Publication number: 20160099145
    Abstract: A composition for forming a silica layer including a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 70,000 and a polydispersity index of about 5.0 to about 17.0 and a solvent; a silica layer manufactured using the same; and an electronic device including the silica layer.
    Type: Application
    Filed: May 22, 2015
    Publication date: April 7, 2016
    Inventors: Hui-Chan Yun, Woo-Han Kim, Sang-Ran Koh, Taek-Soo Kwak, Bo-Sun Kim, Jin-Gyo Kim, Yoong-Hee Na, Kun-Bae Noh, Sae-Mi Park, Jin-Hee Bae, Jun Sakong, Eun-Seon Lee, Wan-Hee Lim, Jun-Young Jang, Il Jung, Byeong-Gyu Hwang
  • Publication number: 20160093825
    Abstract: A curable organo polysiloxane composition, an encapsulant, and an electronic device, the composition including at least one compound represented by the following Chemical Formula 1 and having a number average molecular weight of less than about 4,000, at least one first siloxane compound including a silicon-bonded hydrogen; and at least one second siloxane compound including a silicon-bonded alkenyl group:
    Type: Application
    Filed: September 28, 2015
    Publication date: March 31, 2016
    Inventors: Hong-Jung YOO, Sang-Ran KOH, Young-Ho KIM, Woo-Han KIM, Dong-Ju SHIN
  • Patent number: 9291899
    Abstract: A resist underlayer composition and a method of manufacturing a semiconductor integrated circuit device, the composition including a solvent and an organosilane polymer, the organosilane polymer being a condensation polymerization product of at least one first compound represented by Chemical Formulae 1 and 2 and at least one second compound represented by Chemical Formulae 3 to 5.
    Type: Grant
    Filed: December 30, 2009
    Date of Patent: March 22, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Hyeon-Mo Cho, Sang-Kyun Kim, Chang-Soo Woo, Mi-Young Kim, Sang-Ran Koh, Hui-Chan Yun, Woo-Jin Lee, Jong-Seob Kim
  • Publication number: 20150376453
    Abstract: A curable organic polysiloxane composition includes (A) an amide compound represented by Chemical Formula 1, (B) at least one first siloxane compound including a silicon-bonded alkenyl group (Si-Vi) and including a moiety represented by Chemical Formula 2, and (C) at least one second siloxane compound having a silicon-bonded hydrogen (Si—H): where R, R1, R2, l, m, and n are as defined in the specification.
    Type: Application
    Filed: December 30, 2014
    Publication date: December 31, 2015
    Inventors: Ji-Ho LEE, Woo-Han KIM, Sang-Ran KOH, Hong-Jung YOO
  • Publication number: 20150353688
    Abstract: Disclosed are a curable polysiloxane composition for an optical device includes at least one of a first siloxane compound represented by the following Chemical Formula 1, at least one of a second siloxane compound having silicon-bonded hydrogen (Si—H) at the terminal end, and at least one of a third siloxane compound having a silicon-bonded alkenyl group (Si-Vi) at the terminal end, an encapsulant obtained by curing the curable polysiloxane composition for an optical device, and an optical device including the encapsulant. (R1R2R3SiO1/2)M1(R4R5SiO2/2)D1(R6R7SiO2/2)D2(R8SiO2/2—Y1—SiO2/2R9)D3(R10SiO3/2)T1(R11SiO3/2)T2(R12SiO3/2)T3(SiO3/2—Y2—SiO3/2)T4(SiO4/2)Q1??[Chemical Formula 1] In the above Chemical Formula 1, R1 to R12, Y1, Y2, M1, D1, D2, D3, T1, T2, T3, T4 and Q1 are the same as defined in the specification.
    Type: Application
    Filed: December 24, 2013
    Publication date: December 10, 2015
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Young-Ho KIM, Sang-Ran KOH, Woo-Han KIM, Hong-Jung YOO, Eun-Seon LEE, Ha-Neul KIM, Yun-Hee BAEK, Doo-Ri SONG, Dong-Ju SHIN, Chi-Won AN
  • Publication number: 20150299464
    Abstract: Disclosed are a composition for an encapsulant that includes a first polysiloxane including a moiety represented by Chemical Formula 1 and an alkenyl group bound to silicon (Si—Vi) at the terminal end and a second polysiloxane including hydrogen bound to silicon (Si—H) at the terminal end, an encapsulant obtained by curing the composition for an encapsulant, and an electronic element including the encapsulant.
    Type: Application
    Filed: November 29, 2013
    Publication date: October 22, 2015
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Sang-Ran KOH, Woo-Han KIM, Chang-Soo WOO, Ha-Neul KIM, Chi-Won AN, Eun-Seon LEE
  • Patent number: 9147626
    Abstract: A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si—H/Si-Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: September 29, 2015
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Sung-Hwan Cha, Sang-Ran Koh, Yong Kook Kim, Woo-Han Kim, Ha Neul Kim, Chi Won An
  • Patent number: 9140986
    Abstract: A resist underlayer composition includes a solvent and an organosilane condensation polymerization product, the organosilane condensation polymerization product including about 40 to about 80 mol % of a structural unit represented by the following Chemical Formula 1,
    Type: Grant
    Filed: July 2, 2012
    Date of Patent: September 22, 2015
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Mi-Young Kim, Sang-Kyun Kim, Hyeon-Mo Cho, Sang-Ran Koh, Hui-Chan Yun, Yong-Jin Chung, Jong-Seob Kim
  • Publication number: 20150041959
    Abstract: A hardmask composition for forming a resist underlayer film, a process for producing a semiconductor integrated circuit device, and a semiconductor integrated circuit device, the hardmask composition including an organosilane polymer, a stabilizer, the stabilizer including methyl acetoacetate, ethyl-2-ethylacetoacetate, nonanol, decanol, undecanol, dodecanol, acetic acid, phenyltrimethoxysilane, diphenylhexamethoxydisiloxane, diphenylhexaethoxydisiloxane, dioctyltetramethyldisiloxane, tetramethyldisiloxane, decamethyltetrasiloxane, dodecamethylpentasiloxane, hexamethyldisiloxane, or mixtures thereof, and a solvent, wherein the solvent includes acetone, tetrahydrofuran, benzene, toluene, diethyl ether, chloroform, dichloromethane, ethyl acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate, ethyl lactate, ? butyrolactone, methyl isobutyl ketone, or mixtures thereof, the solvent is present in an amount of about 70 to about 99.
    Type: Application
    Filed: October 24, 2014
    Publication date: February 12, 2015
    Inventors: Sang Ran KOH, Sang Kyun KIM, Sang Hak LIM, Mi Young KIM, Hui Chan YUN, Do Hyeon KIM, Dong Seon UH, Jong Seob KIM
  • Patent number: 8916329
    Abstract: A hardmask composition for processing a resist underlayer film includes a solvent and an organosilane polymer, wherein the organosilane polymer is represented by Formula 6: In Formula 6, R is methyl or ethyl, R? is substituted or unsubstituted cyclic or acyclic alkyl, Ar is an aromatic ring-containing functional group, x, y and z satisfy the relations x+y=4, 0.4?x?4, 0?y?3.6, and 4×10?4?z?1, and n is from about 3 to about 500.
    Type: Grant
    Filed: February 6, 2009
    Date of Patent: December 23, 2014
    Assignee: Cheil Industries, Inc.
    Inventors: Sang Kyun Kim, Sang Hak Lim, Mi Young Kim, Sang Ran Koh, Hui Chan Yun, Do Hyeon Kim, Dong Seon Uh, Jong Seob Kim
  • Publication number: 20140357792
    Abstract: A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si—H/Si-Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.
    Type: Application
    Filed: August 8, 2014
    Publication date: December 4, 2014
    Inventors: Sung-Hwan CHA, Sang-Ran KOH, Yong Kook KIM, Woo-Han KIM, Ha Neul KIM, Chi Won AN
  • Patent number: 8877877
    Abstract: A polyorganosiloxane composition, an encapsulation material, and an electronic device, the polyorganosiloxane composition including a linear first polyorganosiloxane resin including a moiety represented by the following Chemical Formula 1 and a moiety represented by the following Chemical Formula 2, the first polyorganosiloxane resin including double bonds at both terminal ends thereof, and a second polyorganosiloxane resin having a three dimensional network structure,
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: November 4, 2014
    Assignee: Cheil Industries, Inc.
    Inventors: Sang-Ran Koh, June-Ho Shin, Woo-Han Kim, Sung-Hwan Cha, Hyun-Jung Ahn
  • Patent number: 8847414
    Abstract: A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si—Vi) at its terminal end, wherein a ratio (Si—H/Si—Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si—Vi) in the second polysiloxane is about 1 to about 1.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: September 30, 2014
    Assignee: Cheil Industries, Inc.
    Inventors: Sung-Hwan Cha, Sang-Ran Koh, Yong Kook Kim, Woo-Han Kim, Ha Neul Kim, Chi Won An
  • Patent number: 8758981
    Abstract: A photoresist underlayer composition includes a solvent, and a polysiloxane resin represented by Chemical Formula 1: {(SiO1.5—Y—SiO1.5)x(SiO2)y(XSiO1.5)z}(OH)e(OR1)f.
    Type: Grant
    Filed: July 2, 2012
    Date of Patent: June 24, 2014
    Assignee: Cheil Industries, Inc.
    Inventors: Mi-Young Kim, Sang-Kyun Kim, Hyeon-Mo Cho, Chang-Soo Woo, Sang-Ran Koh, Hui-Chan Yun, Woo-Jin Lee, Jong-Seob Kim
  • Patent number: 8524851
    Abstract: A silicon-based hardmask composition, including an organosilane polymer represented by Formula 1: {(SiO1.5—Y—SiO1.5)x(R3SiO1.5)y(XSiO1.5)z}(OH)e(OR6)f??(1).
    Type: Grant
    Filed: July 12, 2010
    Date of Patent: September 3, 2013
    Assignee: Cheil Industries, Inc.
    Inventors: Sang Kyun Kim, Hyeon Mo Cho, Sang Ran Koh, Mi Young Kim, Hui Chan Yun, Yong Jin Chung, Jong Seob Kim