Abstract: According to the present disclosure, it is possible to predict a success or a failure of a clinical trial by reflecting the effect of a drug on a cell population and a human gene. Therefore, it is possible to solve the problems caused by excessive clinical trials, such as excessive use of the drug.

Abstract: A method for determining a substrate model for describing a first measurement dataset and a second measurement dataset relating to a performance parameter. The method include obtaining candidate basis functions for a plurality of substrate models. Steps 1 to 4 are performed iteratively for the first measurement dataset and the second measurement dataset until at least one stopping criterion is met so as to determine the substrate model, the steps including: 1. selecting a candidate basis function from the candidate basis functions; 2. updating a substrate model by adding the candidate basis function into this substrate model to obtain an updated substrate model; 3. evaluating the updated substrate model based on the first measurement dataset and/or second measurement dataset; and 4. determining whether to include the basis function within the substrate model based on the evaluation.

Abstract: A semiconductor package includes a first redistribution substrate, a connection substrate on the first redistribution substrate and having a first opening and a second opening that penetrate the connection substrate, a semiconductor chip on the first redistribution substrate and in the first opening of the connection substrate, a chip module on the first redistribution substrate and in the second opening of the connection substrate, and a molding layer that covers the semiconductor chip, the chip module, and the connection substrate. The chip module includes an inner substrate and a first passive device on the inner substrate. In the second opening, the molding layer covers the first passive device on the inner substrate.

Abstract: A controlling method for a vehicle which comprises an engine, a driving motor connected with the engine, a first clutch connected between the engine and the driving motor, a start motor connected with the engine, a transmission connected with the driving motor, and a second clutch connected between the driving motor and the transmission, comprises synchronizing speeds of the engine and the driving motor, and adjusting a torque of the start motor to release baulking which occurs while a connection state of the first clutch is switched to another connection state upon the speeds of the engine and the driving motor being synchronized.

Abstract: The present disclosure relates to a clock generator and a display device including the same. The clock generator includes a first clock generation circuit configured to output a clock, data, and a timing control signal; a first wiring through which the clock is serially transmitted; a second wiring through which the data is serially transmitted; a third wiring through which a pulse of the timing control signal is serially transmitted; a second clock generation circuit connected to the first clock generation circuit through the first wiring, the second wiring, and the third wiring and configured to generate pre-clocks in which phases are sequentially shifted based on the data and the clock; and a clock adjustment circuit configured to receive the pulse of the timing control signal and the pre-clock and output an output clock.

Abstract: An electric headrest sliding device includes a slider configured to be movable upwards and downwards by driving of a motor, a front frame of a headrest, and a rotation link configured to connect the slider to the front frame, wherein the rotation link is rotated forwards or rearwards to push or pull the front frame during upward-and-downward movement of the slider, thereby accurately adjusting the front and rear positions of the headrest.

Abstract: A vehicle controlling method is for a vehicle which comprises an engine, a driving motor connected to the engine, a first clutch connected between the engine and the driving motor, a start motor connected to the engine, a transmission connected to the driving motor, and a second clutch connected between the driving motor and the transmission.

Abstract: An automatically operatable electric wing-out headrest includes a motor having a lead screw configured to adjust forward-and-rearward rotation of wing-out pads respectively mounted on the opposite sides of a headrest body, a first slider coupled to the lead screw so as to be movable upwards and downwards, a second slider configured to contact the first slider so as to be movable forwards and rearwards, and a wing-out link connected to the second slider to rotate a wing-out frame.

Abstract: A display device includes a substrate including a plurality of emission areas respectively corresponding to a plurality of subpixels for displaying an image, a plurality of light emitting elements respectively located in the plurality of emission areas of a first surface of the substrate and respectively corresponding to the plurality of subpixels, a first planarization layer on the first surface of the substrate and covering the plurality of light emitting elements, and an array layer on the first planarization layer.

Abstract: A semiconductor package includes: a package substrate; a first re-distribution layer disposed on the package substrate; a second re-distribution layer disposed between the package substrate and the first re-distribution layer; a connection substrate interposed between the first re-distribution layer and the second re-distribution layer, wherein a connection hole penetrates the connection substrate; a first semiconductor chip mounted on a first surface of the first re-distribution layer; a first connection chip mounted on a second surface, opposite to the first surface, of the first re-distribution layer and disposed in the connection hole; a second connection chip mounted on a first surface of the second re-distribution layer and disposed in the connection hole; and a first lower semiconductor chip mounted on a second surface, opposite to the first surface, of the second re-distribution layer.

Abstract: A display device includes a scan write line, a PWM emission line, a PAM emission line, a sweep signal line, a first data line, a second data line, and a subpixel connected thereto, and including a light emitting element, a first pixel driver to supply a control current to a node according to the first data voltage in response to the PWM emission signal, a second pixel driver to generate a driving current according to the second data voltage in response to the PWM emission signal, and a third pixel driver to supply the driving current to the light emitting element according to the PAM emission signal and a voltage of the node, wherein the PWM emission signal includes a plurality of PWM pulses, the PAM emission signal includes a plurality of PAM pulses, and a number of the PWM pulses is greater than a number of the PAM pulses.

Abstract: In one aspect, a computer-implemented method, includes obtaining object audio and metadata that spatially describes the object audio, converting the object audio to time-frequency domain Ambisonics audio based on the metadata, and encoding the time-frequency domain Ambisonics audio and a subset of the metadata as one or more bitstreams to be stored in computer-readable memory or transmitted to a remote device.

Abstract: In one aspect, a computer-implemented method, includes obtaining object audio and metadata that spatially describes the object audio, converting the object audio to Ambisonics audio based on the metadata, encoding, in a first bit stream, the Ambisonics audio, and encoding, in a second bit stream, at least a subset of the metadata.

Abstract: A display device includes connection lines, pulse amplitude modulation (PAM) data lines configured to receive pulse width modulation (PWM) data voltages, PWM data lines configured to receive the PWM data voltages, a first connection control line configured to receive a first connection control signal, a second connection control line configured to receive a second connection control signal, subpixels connected to the PWM data lines and the PAM data lines, and a first demultiplexer (demux) unit configured to connect the connection lines to the PAM data lines or to the PWM data lines according to the first connection control signal and the second connection control signal.

Abstract: A semiconductor package includes: a package substrate; a semiconductor chip disposed on the package substrate; a transparent substrate disposed on the semiconductor chip; and an adhesive layer that is disposed between the semiconductor chip and the transparent substrate. The adhesive layer is configured to block light. The transparent substrate includes: a first lower side that faces the semiconductor chip, a second lower side that faces the semiconductor chip and that is disposed above the first lower side, and a first inner side wall that connects the first lower side and the second lower side, and the adhesive layer is in contact with the second lower side and the first inner side wall.

Abstract: A bioelectronic device for regulating stem cell differentiation, a method for differentiating stem cells using the same, and a method for manufacturing the bioelectronic device. According to the present invention, it is possible to effectively control the differentiation of stem cells at a single-cell level, and to simultaneously perform a free radical inhibition function.

Abstract: A semiconductor package includes: a substrate; a first semiconductor chip disposed on the substrate; a capacitor disposed on the substrate and spaced apart from the first semiconductor chip in a first direction; an insulating layer disposed on the substrate and covering the capacitor; a first heat conductive layer at least partially surrounding side walls of the first semiconductor chip and disposed on the insulating layer, wherein the first heat conductive layer is in contact with the side walls of the first semiconductor chip, and wherein the first heat conductive layer includes a first material that is a conductive material; and a second heat conductive layer disposed on the first heat conductive layer, wherein the second heat conductive layer is in contact with the first heat conductive layer, wherein the second heat conductive layer includes a second material that is a non-conductive material.

Abstract: A semiconductor package includes: a package substrate; a first re-distribution layer disposed on the package substrate; a second re-distribution layer disposed between the package substrate and the first re-distribution layer; a connection substrate interposed between the first re-distribution layer and the second re-distribution layer, wherein a connection hole penetrates the connection substrate; a first semiconductor chip mounted on a first surface of the first re-distribution layer; a first connection chip mounted on a second surface, opposite to the first surface, of the first re-distribution layer and disposed in the connection hole; a second connection chip mounted on a first surface of the second re-distribution layer and disposed in the connection hole; and a first lower semiconductor chip mounted on a second surface, opposite to the first surface, of the second re-distribution layer.

Abstract: A method for determining lithographic matching performance includes obtaining first monitoring data from recurrent monitoring for stability control for an available EUV scanner. For a DUV scanner, second monitoring data is similarly obtained from recurrent monitoring for stability control. The EUV first monitoring data are in a first layout. The DUV second monitoring data are in a second layout. A cross-platform overlay matching performance between the first lithographic apparatus and the second lithographic apparatus is determined based on the first monitoring data and the second monitoring data. This is done by reconstructing the first and/or second monitoring data into a common layout to allow comparison of the first and second monitoring data.

Abstract: A semiconductor package includes a first redistribution substrate, a connection substrate on the first redistribution substrate and having a first opening and a second opening that penetrate the connection substrate, a semiconductor chip on the first redistribution substrate and in the first opening of the connection substrate, a chip module on the first redistribution substrate and in the second opening of the connection substrate, and a molding layer that covers the semiconductor chip, the chip module, and the connection substrate. The chip module includes an inner substrate and a first passive device on the inner substrate. In the second opening, the molding layer covers the first passive device on the inner substrate.