Abstract: A semiconductor package includes: a package substrate; a first re-distribution layer disposed on the package substrate; a second re-distribution layer disposed between the package substrate and the first re-distribution layer; a connection substrate interposed between the first re-distribution layer and the second re-distribution layer, wherein a connection hole penetrates the connection substrate; a first semiconductor chip mounted on a first surface of the first re-distribution layer; a first connection chip mounted on a second surface, opposite to the first surface, of the first re-distribution layer and disposed in the connection hole; a second connection chip mounted on a first surface of the second re-distribution layer and disposed in the connection hole; and a first lower semiconductor chip mounted on a second surface, opposite to the first surface, of the second re-distribution layer.

Abstract: A semiconductor package includes: a package substrate; a semiconductor chip disposed on the package substrate; a transparent substrate disposed on the semiconductor chip; and an adhesive layer that is disposed between the semiconductor chip and the transparent substrate. The adhesive layer is configured to block light. The transparent substrate includes: a first lower side that faces the semiconductor chip, a second lower side that faces the semiconductor chip and that is disposed above the first lower side, and a first inner side wall that connects the first lower side and the second lower side, and the adhesive layer is in contact with the second lower side and the first inner side wall.

Abstract: A bioelectronic device for regulating stem cell differentiation, a method for differentiating stem cells using the same, and a method for manufacturing the bioelectronic device. According to the present invention, it is possible to effectively control the differentiation of stem cells at a single-cell level, and to simultaneously perform a free radical inhibition function.

Abstract: A semiconductor package includes: a substrate; a first semiconductor chip disposed on the substrate; a capacitor disposed on the substrate and spaced apart from the first semiconductor chip in a first direction; an insulating layer disposed on the substrate and covering the capacitor; a first heat conductive layer at least partially surrounding side walls of the first semiconductor chip and disposed on the insulating layer, wherein the first heat conductive layer is in contact with the side walls of the first semiconductor chip, and wherein the first heat conductive layer includes a first material that is a conductive material; and a second heat conductive layer disposed on the first heat conductive layer, wherein the second heat conductive layer is in contact with the first heat conductive layer, wherein the second heat conductive layer includes a second material that is a non-conductive material.

Abstract: A semiconductor package includes: a package substrate; a first re-distribution layer disposed on the package substrate; a second re-distribution layer disposed between the package substrate and the first re-distribution layer; a connection substrate interposed between the first re-distribution layer and the second re-distribution layer, wherein a connection hole penetrates the connection substrate; a first semiconductor chip mounted on a first surface of the first re-distribution layer; a first connection chip mounted on a second surface, opposite to the first surface, of the first re-distribution layer and disposed in the connection hole; a second connection chip mounted on a first surface of the second re-distribution layer and disposed in the connection hole; and a first lower semiconductor chip mounted on a second surface, opposite to the first surface, of the second re-distribution layer.

Abstract: A semiconductor package includes a first redistribution substrate, a connection substrate on the first redistribution substrate and having a first opening and a second opening that penetrate the connection substrate, a semiconductor chip on the first redistribution substrate and in the first opening of the connection substrate, a chip module on the first redistribution substrate and in the second opening of the connection substrate, and a molding layer that covers the semiconductor chip, the chip module, and the connection substrate. The chip module includes an inner substrate and a first passive device on the inner substrate. In the second opening, the molding layer covers the first passive device on the inner substrate.

Abstract: A method for determining lithographic matching performance includes obtaining first monitoring data from recurrent monitoring for stability control for an available EUV scanner. For a DUV scanner, second monitoring data is similarly obtained from recurrent monitoring for stability control. The EUV first monitoring data are in a first layout. The DUV second monitoring data are in a second layout. A cross-platform overlay matching performance between the first lithographic apparatus and the second lithographic apparatus is determined based on the first monitoring data and the second monitoring data. This is done by reconstructing the first and/or second monitoring data into a common layout to allow comparison of the first and second monitoring data.

Abstract: The present invention relates to a method and system for an emergency rescue request and loss prevention. The method includes checking an operation mode activation signal by the electronic device connected to a portable device through Bluetooth low energy (BLE) communication, activating a loss prevention mode and outputting an alarm when the operation mode activation signal that a strength of a BLE signal transmitted from the portable device is a threshold value or less and transmitting to a pre-stored contact number a message which is generated on the basis of surroundings data acquired from at least one of a camera and a microphone provided in the electronic device, activating an emergency rescue request mode when the operation mode activation signal is generated from an outside of the portable device. The method and system can also be applied to other embodiments.

Abstract: A method of producing carbon nanotubes in a fluidized bed reactor includes preparing a carbon nanotube by supplying a catalyst and a carbon source to an interior of the fluidized bed reactor having an internal pressure of 0.5 barg to 1.2 barg (gauge pressure), thereby improving the yield and purity of carbon nanotubes.

Abstract: A workstation includes a receiver configured to receive identification information of an X-ray detector from the X-ray detector; a controller configured to set assign indicator information of the X-ray detector, based on the received identification information of the X-ray detector; an output unit configured to display the set assign indicator information of the X-ray detector; and a transmitter configured to transmit the set assign indicator information of the X-ray detector to the X-ray detector. The X-ray detector includes a transmitter configured to transmit the identification information of the X-ray detector to the workstation; a receiver configured to receive the assign indicator information from the workstation after the transmitter transmits the identification information of the X-ray detector to the workstation; and an output unit configured to display an assign indicator based on the received assign indicator information.

Abstract: Disclosed are semiconductor packages and methods of fabricating the same. The semiconductor package includes a first semiconductor chip on a first substrate, a first molding layer covering a sidewall of the first semiconductor chip and including at least two guide holes that expose the first substrate and are spaced apart from each other in a periphery of the first substrate, a second substrate on the first molding layer, a connection terminal between the first substrate and the second substrates and connecting the first and second substrates to each other, and an alignment structure that extends from a bottom surface of the second substrate into each of the at least two guide holes of the first molding layer. A height of the alignment structure is greater than a height of the first molding layer and the first semiconductor chip.

Abstract: Provided is a method of producing carbon nanotubes by supplying a catalyst and a carbon source to a fluidized bed reactor. The fluidized bed reactor has an expanded zone. A flow velocity (linear velocity) of a raw material supplied to the fluidized bed reactor is equal to or higher than a terminal velocity of an internal material in the fluidized bed reactor.

Abstract: The present invention relates to a method and system for an emergency rescue request and loss prevention. The method includes checking an operation mode activation signal by the electronic device connected to a portable device through Bluetooth low energy (BLE) communication, activating a loss prevention mode and outputting an alarm when the operation mode activation signal that a strength of a BLE signal transmitted from the portable device is a threshold value or less and transmitting to a pre-stored contact number a message which is generated on the basis of surroundings data acquired from at least one of a camera and a microphone provided in the electronic device, activating an emergency rescue request mode when the operation mode activation signal is generated from an outside of the portable device. The method and system can also be applied to other embodiments.

Abstract: Disclosed are semiconductor packages and methods of fabricating the same. The semiconductor package includes a first semiconductor chip on a first substrate, a first molding layer covering a sidewall of the first semiconductor chip and including at least two guide holes that expose the first substrate and are spaced apart from each other in a periphery of the first substrate, a second substrate on the first molding layer, a connection terminal between the first substrate and the second substrates and connecting the first and second substrates to each other, and an alignment structure that extends from a bottom surface of the second substrate into each of the at least two guide holes of the first molding layer. A height of the alignment structure is greater than a height of the first molding layer and the first semiconductor chip.

Abstract: Disclosed are semiconductor packages and methods of fabricating the same. The semiconductor package includes a first semiconductor chip on a first substrate, a first molding layer covering a sidewall of the first semiconductor chip and including at least two guide holes that expose the first substrate and are spaced apart from each other in a periphery of the first substrate, a second substrate on the first molding layer, a connection terminal between the first substrate and the second substrates and connecting the first and second substrates to each other, and an alignment structure that extends from a bottom surface of the second substrate into each of the at least two guide holes of the first molding layer. A height of the alignment structure is greater than a height of the first molding layer and the first semiconductor chip.

Abstract: The present invention provides a method and a kit for half coating nanoparticles. According to the present invention, nanoparticles can be half coated in a relatively simple and economical process that can replace complicated processes, such as chemical synthesis, of a conventional Janus nanoparticle-preparing method.

Abstract: An X-ray apparatus includes an X-ray radiator configured to radiate X-rays to an object and a controller configured to acquire orientation information indicating an orientation of the X-ray radiator and motion information indicating a movement of an X-ray detector configured to detect the X-rays radiated by the X-ray radiator and select the X-ray detector based on the orientation information and the motion information.

Abstract: Disclosed are semiconductor packages and methods of fabricating the same. The semiconductor package includes a first semiconductor chip on a first substrate, a first molding layer covering a sidewall of the first semiconductor chip and including at least two guide holes that expose the first substrate and are spaced apart from each other in a periphery of the first substrate, a second substrate on the first molding layer, a connection terminal between the first substrate and the second substrates and connecting the first and second substrates to each other, and an alignment structure that extends from a bottom surface of the second substrate into each of the at least two guide holes of the first molding layer. A height of the alignment structure is greater than a height of the first molding layer and the first semiconductor chip.

Abstract: A semiconductor package and a method manufacturing the same are disclosed. At least one semiconductor chip is mounted on a package substrate. An insulative mold layer is formed at sides of the semiconductor chip having at least one recess in a region in which conductive connection members are formed, the recess defining one or more protrusions within the mold layer. An interposer is positioned on the protrusions with the conductive connection members connecting and providing electrical connections between conductive pads on the upper surface of the package and conductive pads on the lower surface of the package substrate. The protrusions may position the interposer in the vertical direction by defining the vertical spacing between the lower surface of the interposer and the upper surface of the package substrate. The protrusions may also position the interposer in one or more horizontal directions and/or prevent substantial movement during connecting of the interposer to the package substrate.

Abstract: A radiographic imaging apparatus and a method for controlling the same. The radiographic imaging apparatus includes a database configured to store first subject information and an imaging condition corresponding to the first subject information A controller, upon receiving second subject information regarding a subject to be image, is configured to detect an imaging condition corresponding to second subject information acquired from the database, determine a recommended imaging condition using the detected imaging condition, and determine reliability of the recommended imaging condition. A user interface (UI) is configured to display the recommended imaging condition and the reliability of the recommended imaging condition.