Patents by Inventor Sang-Won Kang

Sang-Won Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240357900
    Abstract: An elastic member according to an embodiment includes: a first region and a second region, wherein a first direction defined as a width direction and a second direction defined as a longitudinal direction in the elastic member, the first region is defined as a folding region that is folded with the first direction as a folding axis, the second region is defined as an unfolding region, a width of the first region is smaller than a width of the second region, and the width of the first region is 15 mm or more.
    Type: Application
    Filed: August 26, 2022
    Publication date: October 24, 2024
    Inventors: Sang Jun KO, Sung Won KANG, Jung Min GWAK
  • Publication number: 20240336690
    Abstract: An antibody binds to CD154. The antibody includes HCDR, which includes amino acid sequences of SEQ ID NOs: 1 to 3, and LCDR which includes amino acid sequences of SEQ ID NOs: 4 to 6. A composition including an antibody-drug conjugate in which a drug is conjugated to the antibody may prevent or treat a T cell-mediated autoimmune disease and/or organ transplant rejection.
    Type: Application
    Filed: August 1, 2022
    Publication date: October 10, 2024
    Inventors: JUN HO CHUNG, KYUNG HO CHOI, SANG IL KIM, YOUNG JAE LEE, SU JEONG KIM, SEO RYEONG PARK, SI WON HWANG, DONG MIN KANG, SU REE KIM
  • Publication number: 20240326384
    Abstract: The present disclosure relates to an optical laminate including: a glass substrate; a pressure-sensitive adhesive layer formed on one surface of the glass substrate; a metal layer pattern formed on one surface of the pressure-sensitive adhesive layer; and a functional layer provided on a portion on one surface of the pressure-sensitive adhesive layer on which the metal layer pattern is not formed, wherein the pressure-sensitive adhesive layer contains a silicone-based pressure-sensitive adhesive, and the functional layer includes a solder resist layer, and a method for manufacturing the optical laminate.
    Type: Application
    Filed: March 19, 2024
    Publication date: October 3, 2024
    Inventors: Sung-Jin NOH, Goo-Hyun KANG, Sang-Won YUN, Jun-Gu LEE, Ki-Joon PARK, Cheol-Hun LEE
  • Publication number: 20240298654
    Abstract: The present invention relates to a method for preparing dough for frozen pizza, dough for frozen pizza prepared by the preparation method, and frozen pizza comprising the same.
    Type: Application
    Filed: March 8, 2022
    Publication date: September 12, 2024
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Jae Kyoung CHOI, Hye Won SHIN, Eun Yi KIM, Sang Geun KIM, Young Min HA, Hee Soo PARK, Min Hyuk KIM, Ki Moon KANG
  • Patent number: 12081048
    Abstract: Disclosed is an apparatus and method for balancing battery packs connected in parallel. If the pack voltage deviation of the first to nth battery packs is greater than the first threshold value, a battery cell having a higher voltage than the pack balancing target voltage set according to a preset criterion among the voltages of all cells is discharged to perform pack balancing for each battery pack and if the pack voltage deviation is equal to or smaller than the first threshold value, a battery cell having a higher voltage than the cell balancing target voltage set according to a preset criterion among the voltages of the cells included in a battery pack having a cell voltage deviation greater than the second threshold value is discharged to perform cell balancing for each battery pack.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: September 3, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Su-Won Kang, Han-Sol Kim, Bum-Hee Lee, Sang-Ki Lee
  • Patent number: 12064728
    Abstract: An electrodeionization filter includes: a housing having a water inlet and a water outlet; a first electrode installed inside the housing in a spiral shape; a second electrode installed inside the housing in a spiral shape so as to be spaced apart from the first electrode; and an ion exchange module installed between the first electrode and the second electrode for adsorbing or desorbing ionic substances contained in water introduced by an application of electricity. At least one of the first electrode and the second electrode has a structure in which a center portion thereof is denser than a peripheral region thereof. Accordingly, the lifespan of the electrodes of the electrodeionization filter can be increased, and the assembly of the electrodes and related parts can be easily facilitated.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: August 20, 2024
    Assignee: COWAY Co., Ltd.
    Inventors: Sang-Young Lee, Sang-Hyeon Kang, Chul-Ho Kim, Tae-Seong Kwon, Hyoung-Min Moon, Sung-Min Moon, Jun-Young Lee, Byoung-Phil Lee, Byung-Sun Mo, Guk-Won Lee
  • Patent number: 12059762
    Abstract: In a system for automatically manufacturing a pipe spool, when information on a pipe spool is input to a control unit, manufacturing of a spool pipe by cutting an original pipe, processing of a spool pipe, processing of a connection member, manufacturing of a straight pipe spool by welding a spool pipe to a connection member, and manufacturing a three-dimensional spool by welding a straight pipe spool to the other straight pipe spool or a connection member may be automatically performed by a sensor, an automatic device or a robot included in each process and the control unit connected to each of the devices.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: August 13, 2024
    Assignees: HDHYUNDAI ROBOTICS CO., LTD, SAMSUNG E&A CO., LTD
    Inventors: Sung-Gi Kang, Young-Choon Kwak, Sun-Gyu Hwang, Sung-Keun Kim, Roh-Hyun Myung, Sang-Hun Rim, Byeong-Yeol Lee, Sang-Pil Cheon, Chan-Won Seo, Jung-Hoon Choo, Min-Kue Choi
  • Publication number: 20240266253
    Abstract: Provided is a direct cooling device for an integrated circuit configured to form a direct cooling portion with a flow channel through which cooling fluid may flow in a through via hole of a substrate constituting the integrated circuit, and to couple the substrate to a heat sink unit through a bonding portion formed integrally with the direct cooling portion, unlike the prior art in which only a ground circuit is possible through the through via hole, which derives the effect of increasing product reliability due to improved thermal management efficiency of the integrated circuit by directly cooling the semiconductor device as well as the ground circuit, and the effect of simplifying and miniaturizing the structure by implementing the cooling function using a circuit for grounding the semiconductor device even without forming an additional flow path structure for cooling the semiconductor device.
    Type: Application
    Filed: February 4, 2024
    Publication date: August 8, 2024
    Inventors: Min Soo KANG, Jun Rae PARK, Hae Cheon KIM, Hyoung Soon LEE, Sung Jae CHANG, Hyun Wook JUNG, Il Gyu CHOI, Seong Il KIM, Sang Heung LEE, Ho Kyun AHN, Jong Won LIM
  • Publication number: 20240266251
    Abstract: A direct cooling type semiconductor package unit includes a substrate made of a material capable of manufacturing a semiconductor device, and having a material layer for forming the semiconductor device stacked on one side of the substrate, and a flow channel through which a cooling fluid flows formed on the other side of the substrate to enable direct cooling of the semiconductor device using the cooling fluid; a packaging block disposed at a position spaced apart from the substrate for packaging the semiconductor device, and having an electrode electrically connected to the semiconductor device through wiring and placed thereon to be insulated; a heat sink unit disposed on a lower side of the packaging block and having a fluid movement region formed at a position corresponding to a flow channel of the substrate; and a thin film type structure disposed between the substrate and the heat sink unit for coupling between the substrate and the heat sink unit and being moldable to have pattern structures of variou
    Type: Application
    Filed: February 4, 2024
    Publication date: August 8, 2024
    Inventors: Jun Rae PARK, Min Soo KANG, Hae Cheon KIM, Hyoung Soon LEE, Sung Jae CHANG, Hyun Wook JUNG, Il Gyu CHOI, Seong Il KIM, Sang Heung LEE, Ho Kyun AHN, Jong Won LIM
  • Publication number: 20240262272
    Abstract: An open space type headrest is applied to a vehicle seat in which a covering, which surrounds a foam pad of a volume body positioned on a mounting cover of a flat body coupled to a front surface of an exterior cover formed of a protrusion body, is fixed to the mounting cover, and opening spaces are formed in the exterior cover, the mounting cover, and the foam pad to enlarge front viewing of a rear passenger due to a see-through characteristic of a mesh fabric of the covering.
    Type: Application
    Filed: November 21, 2023
    Publication date: August 8, 2024
    Inventors: Jong-Seok Han, Sang-Do Park, Deok-Soo Lim, Sang-Soo Lee, Sang-Hark Lee, Chan-Ho Jung, Suk-Won Hong, Hyun-Suk Kang, Sang-Sub Jeon, Sung-Chol An, Min-Soo Kim
  • Publication number: 20240266496
    Abstract: A lithium metal is physically pressed to a silicon wafer having a uniform intaglio or embossed pattern formed thereon in advance, or liquid lithium is applied to the silicon wafer and may then be cooled in order to form a uniform pattern on the surface of the lithium metal.
    Type: Application
    Filed: April 16, 2024
    Publication date: August 8, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Oh-Byong CHAE, Eun-Kyung KIM, Sang-Wook WOO, Geun-Sik JO, Soo-Hee KANG, Hee-Won CHOI
  • Publication number: 20240255808
    Abstract: Provided is a liquid crystal display device. The liquid crystal display device includes: an array substrate in which a pixel region is disposed, the pixel region including a thin film transistor and a pixel electrode connected to the thin film transistor; a counter substrate facing the array substrate; a liquid crystal layer interposed between the array substrate and the counter substrate; and a gap column spacer which maintains a cell gap between the array substrate and the counter substrate, and includes a bottom end portion having a first width, and a top end portion having a second width smaller than the first width.
    Type: Application
    Filed: October 20, 2023
    Publication date: August 1, 2024
    Inventors: Sang-Ho KANG, Seo-Won CHOI
  • Publication number: 20240248418
    Abstract: A substrate processing apparatus includes a photoresist coater applying a photoresist film on a substrate, a humidifier increasing an amount of moisture in an ambient to which the photoresist film on the substrate is exposed, and an exposer irradiating the photoresist film exposed to the ambient having the increased amount of moisture with light. The humidifier is disposed between the photoresist coater and the exposer.
    Type: Application
    Filed: February 7, 2024
    Publication date: July 25, 2024
    Inventors: Seok HEO, Cha Won KOH, Sang Joon HONG, Hyun Woo KIM, Kyung-Won KANG, Dong-Wook KIM, Kyung Won SEO, Young Il JANG, Yong Suk CHOI
  • Publication number: 20240250417
    Abstract: An electronic device is provided. The electronic device includes an outer housing that comprises a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a side surface surrounding a space between the first surface and the second surface, a display adapted to expose at least a portion of the display through the first surface of the outer housing, a PCB arranged between the second surface and the display in an interior of the outer housing, a communication circuit arranged on or over the PCB, a first conductive structure formed of at least one of the first surface or at least a portion of the side surface is electrically connected to the communication circuit, and a second conductive structure formed of the portion of the display electrically connected to the first conductive structure.
    Type: Application
    Filed: April 1, 2024
    Publication date: July 25, 2024
    Inventors: Tae Young KIM, In Young LEE, Sang Hoon CHOI, Woo Suk KANG, Jae Won CHOE, Jae Bong CHUN
  • Patent number: 12039035
    Abstract: Disclosed herein are an apparatus and method for detecting violation of control flow integrity. The apparatus includes memory for storing a program and a processor for executing the program, wherein the processor multiple branch identifier registers to which identifiers of branch targets are written, a set branch identifier instruction configured to command an identifier of a branch target to be written to a branch identifier register at a predetermined sequence number, among the multiple branch identifier registers, and a check branch identifier instruction configured to command a signal indicating detection of a control flow hijacking attack to be issued based on whether a value written to the branch identifier register at the predetermined sequence number is identical to a value of an identifier of a branch target at the predetermined sequence number, wherein the program detects whether a control flow is hijacked based on the multiple branch identifier registers.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: July 16, 2024
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Dong-Wook Kang, Dae-Won Kim, Ik-Kyun Kim, Sang-Su Lee, Jin-Yong Lee, Byeong-Cheol Choi, Yong-Je Choi
  • Patent number: 11922960
    Abstract: A quantization device includes: a trellis-structured vector quantizer which quantizes a first error vector between an N-dimensional (here, “N” is two or more) subvector and a first predictive vector; and an inter-frame predictor which generates a first predictive vector from the quantized N-dimensional subvector, wherein the inter-frame predictor uses a predictive coefficient comprising an N×N matrix and performs an inter-frame prediction using the quantized N-dimensional subvector of a previous stage.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: March 5, 2024
    Assignees: SAMSUNG ELECTRONICS CO., LTD., INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS
    Inventors: Ho-sang Sung, Sang-won Kang, Jong-hyun Kim, Eun-mi Oh
  • Publication number: 20220323453
    Abstract: The present invention relates to a pharmaceutical composition for prevention or treatment of solid cancer comprising an epidithiodioxopiperazine derivative compound based on a parent structure comprising an intramolecular disulfide bridge in an epidithiodioxopiperazine ring or a pharmaceutically acceptable salt thereof as an active ingredient.
    Type: Application
    Filed: August 25, 2020
    Publication date: October 13, 2022
    Inventor: Sang Won KANG
  • Patent number: 11439640
    Abstract: The present invention relates to a pharmaceutical composition for treating colorectal cancer including a material inhibiting the enzyme activity of peroxiredoxin 2 as an active ingredient, and more specifically, to a pharmaceutical composition for treating colorectal cancer, which exhibits the effect of reducing colon polyps via increase of active ?-catenin degradation by inhibiting the activity of peroxiredoxin 2, based on the mechanism that promotes colorectal tumor by the interaction between peroxiredoxin 2 (PrxII) and tankyrase (TNKS) in an APC-mutant cell.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: September 13, 2022
    Assignee: EWHA UNIVERSITY—INDUSTRY COLLABORATION FOUNDATION
    Inventor: Sang Won Kang
  • Publication number: 20220130403
    Abstract: A quantization device includes: a trellis-structured vector quantizer which quantizes a first error vector between an N-dimensional (here, “N” is two or more) subvector and a first predictive vector; and an inter-frame predictor which generates a first predictive vector from the quantized N-dimensional subvector, wherein the inter-frame predictor uses a predictive coefficient comprising an N×N matrix and performs an inter-frame prediction using the quantized N-dimensional subvector of a previous stage.
    Type: Application
    Filed: January 10, 2022
    Publication date: April 28, 2022
    Applicants: SAMSUNG ELECTRONICS CO., LTD., INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS
    Inventors: Ho-sang SUNG, Sang-won Kang, Jong-hyun Kim, Eun-mi Oh
  • Patent number: 11238878
    Abstract: A quantization device includes: a trellis-structured vector quantizer which quantizes a first error vector between an N-dimensional (here, “N” is two or more) subvector and a first predictive vector; and an inter-frame predictor which generates a first predictive vector from the quantized N-dimensional subvector, wherein the inter-frame predictor uses a predictive coefficient comprising an N×N matrix and performs an inter-frame prediction using the quantized N-dimensional subvector of a previous stage.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: February 1, 2022
    Assignees: SAMSUNG ELECTRONICS CO., LTD., INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS
    Inventors: Ho-sang Sung, Sang-won Kang, Jong-hyun Kim, Eun-mi Oh